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Laird and Milplex Enter Fab Agreement

Published: 13 July 2009
 by Staff
ST. LOUIS and SCARBOROUGH, ONTARIO – Laird Technologies Inc. has signed a fabrication agreement with Milplex Circuit Inc.
 
Under terms of the agreement, the St. Louis-based company will allow Milplex to manufacture PCBs using its products. These include: the T-preg line of thermally conductive, electrically insulating pre-preg; the T-lam PP thermally conductive pre-preg and the T-lam SS single-sided insulated metal PCB substrate.

Laird designs and supplies customized performance-critical products, including EMI shielding, wireless antennae solutions and RF modules and systems. Milplex specializes in quick turn prototypes and production for double side through multilayer technologies.
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