Log in / Register
  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

Homepage Slideshow

Merix Completes China Expansion

Published: 19 November 2008
 by Staff
BEAVERTON, OR-- Merix Corporation announced the completion of an expansion and technology upgrade to the Huiyang, China (HY) factory.

Merix has invested over $23 million in the HY expansion and increased the factory footprint to 400,000 square feet. The resulting expansion increases the innerlayer manufacturing capacity by approximately 300% compared to pre expansion levels.   

The upgrades to the HY factory improve the facility’s technology capabilities. The HY factory can now manufacture approximately 80% of the multilayer technology products produced in Merix' higher technology North American factories.

“The strategy we embarked upon fifteen months ago has become a reality,” said Michael D. Burger, president and CEO of Merix Corporation. “When combined with our recently completed global ERP system, we believe that this expansion uniquely equips Merix to provide our customers exceptional value through cost and time-to-market reduction while retaining Merix' reputation for high-reliability.”

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article