BANNOCKBURN, IL– IPC presented over 70 awards at the recent IPC Midwest Conference & Exhibition in Schaumburg, IL.
These awards honored individuals, teams and organizations who have made noteworthy contributions to both IPC and the industry by volunteering their time and expertise to the development of standards and programs, the awards fell into three categories: Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service.
Those receiving the Special Recognition Award were:
- Japan Electronics Packaging and Circuits Association (JPCA) for supporting industry efforts on standardization of flex circuits, including IPC-6013, Qualification and Performance Specification for Flexible Printed Boards
- Nancy Chism of Flextronics, Barry Morris of Advanced Rework Technology, Norma Moss of L-3 Communications, Zenaida Valianu of Celestica International Inc. and Debbie Wade of Advanced Rework Technology for their contributions to the 7-34T subcommittee that assisted in the development of the IPC-7711/7721B Training and Certification Program
- Joel Peiffer of 3M Company for his leadership and contributions to revision A of IPC-TM-650, Method 2.5.7.2, Dielectric Withstanding Voltage (Hi-Pot Method)-Thin Dielectric Layers for Printed Boards
Those receiving the Distinguished Committee Service Award were:
- Terry Clitheroe of Solder Technologies; Stephen Fribbins of Fribbins Training Services; James Moffitt of Moffitt Consulting Services; Blen Talbott of L-3 Communications; Sharon Ventress of U.S. Army Redstone Arsenal; Jennifer Day of Sanmina-SCI and Peggi Blakley of NSWC Crane for their assistance in developing the IPC-7711/7721 Training and Certification Program.
- Alan Exley of Raytheon Company; Mahendra Gandhi of Northrop Grumman Space Technology; Dr. J. Lee Parker of JLP; Gordon Sullivan of Huntsman Advanced Materials and Dewey Whittaker of Honeywell Inc. Air Transport Systems for contributions to the development of revision H of IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
- Gary Gong, Cisco Systems Inc.; T. Paul Parker, Lineage Power; Rudolf Wegener, Hewlett-Packard Company; Robert V. White, Consultant; Donald Gerstle, Murata Power Solutions; Tom Glowinke, Alcatel-Lucent; Michael Model, Lineage Power; Anders Petersson, Ericsson Power Module AB; Anne Ryan, Alcatel-Lucent; Lynn Simmons, Dell Inc.; Jerry Strunk, Lineage Power; and Eric Swenson, IBM Corporation, for contributions to the development of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications.
- John Andresakis, Oak-Mitsui, Inc.; John Bauer, Rockwell Collins; Daniel Brandler, Ohmega Technologies Inc.; Dr. G. Sidney Cox, E.I. du Pont de Nemours and Co.; Jason Ferguson, NSWC Crane; Dennis Fritz, MacDermid, Inc.; Dr. Jan Obrzut, NIST; Joel Peiffer, 3M Company; and Dr. Akikazu Shibata, JPCA, for contributions to IPC-4811, Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards.
- Tracy Cai, Guangdong Shengyi Sci. Tech Co. Ltd.; William Hall, Oak-Mitsui; John Jephson, Circuit Foil Trading, Inc.; Duane Mahnke, Rogers Corporation; and Edward Sandor, Taconic Advanced Dielectric Division, for contributions to the development of IPC-4562A, Metal Foil for Printed Board Applications.
- Michael Green, Lockheed Martin Space Systems Company; and Michael Luke, Raytheon Company, for contributions to IPC-2223B, Sectional Design Standard for Flexible Printed Boards.
- Takahisa Akatsuka, Nippon Mektron Ltd.; C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Alan Exley, Raytheon Company; Thomas Gardeski, E.I. du Pont de Nemours and Co.; and Toru Koizumi, JPCA, for contributions to IPC-6013, Qualification and Performance Specification for Flexible Printed Boards.
- Dudi Amir, Intel Corporation; Dr. Raiyomand Aspandiar, Intel Corporation; Werner Engelmaier, Engelmaier Associates, L.C.; Michael Green, Lockheed Martin Space Systems Company; Karen McConnell, Lockheed Martin EPI Center; George Oxx, Flextronics International USA; Robert Rowland, RadiSys Corporation; Vern Solberg, Solberg Technical Consulting; Kristen Troxel, Hewlett-Packard Company; and Bob Willis, The SMART Group, for contributions to IPC-7095B, Design and Assembly Process Implementation for BGAs.
Those receiving Distinguished Committee Leadership Awards were:
- Daniel Foster, STI Electronics; and Teresa Rowe, AAI Corporation, for leadership of the 7-34T subcommittee in the development of IPC-7711/7721B Training and Certification Program.
- Michael Green, Lockheed Martin Space Systems Company; and Vicka White, Honeywell Inc. Air Transport Systems, for leadership of the 2-30 Committee that developed revision H of IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
- Dr. Scott Strand, IBM Corporation; and Neil Witkowski, Alcatel-Lucent, for leadership of the 9-82 Power Devices Standard Subcommittee that developed IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications.
- David McGregor, E.I. du Pont de Nemours and Co.; Mahendra Gandhi, Northrop Grumman Space Technology; and Rocky Hillburn, CAC, for leadership of the D-52 Embedded Component Materials Subcommittee that helped develop IPC-4811, Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards.
- Dr. Arvind Partha, Somers Thin Strip; and Rolland Savage, High Performance Copper Foil Inc., for leadership of the 3-12a Metallic Foil Task Group that developed IPC-4562A, Metal Foil for Printed Board Applications.
- Mark Finstad, Minco Products Inc.; and William Ortloff, Raytheon Company, for leading the D-11 subcommittee that helped develop revision B to IPC-2223, Sectional Design Standard for Flexible Printed Boards.
- Mahendra Gandhi, Northrop Grumman Space Technology; and Nick Koop, Minco Products Inc., for leadership of the D-12 subcommittee that developed revision B of IPC-6013, Qualification and Performance Specification for Flexible Printed Boards.
- Ray Prasad, BeamWorks Inc., for leading the 5-21g task group that developed revision B of IPC-7095, Design and Assembly Process Implementation for BGAs.
