TAIPEI – Taiwan's LCY Group has signed a business and capital alliance agreement with Nippon Denkai's US electrolytic copper foils subsidiary to offer a $9.5 million loan to support collaborations and share experiences in operations and expansions in the US.

In addition to the loan offered by LCY Group, the two companies have signed a license agreement under which LCY Technology will have access to Denkai's technology license. Under the agreement, LCY and Denkai will be able to complete and expand geographical customer portfolios and strengthen technological cooperation in rigid and flexible boards as well as high-functioning field (high-frequency, high-density mounting, etc.), LCY said in a release.

The partnership aims to enhance the production flexibility of both parties in manufacturing high-end PCB copper foils, which are used in packaging substrates, 5G and advanced driver assistance systems (ADAS) applications in Taiwan, China and the global market. LCY said it believes that the combined technical expertise, product portfolio and rich customer experience of both sides will help Denkai Group accelerate the realization of its mid- to long-term goals, and the collaboration aims to maximize production and sales synergies through accelerated sales growth of specialized PCB copper foil.

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