GUANGZHOU, CHINA – Xingsen Technology said its FCBGA packaging substrate project is still under construction, and it is expected that mass production will begin at the Zhuhai base in the third quarter of this year and trial production at the Guangzhou base in the fourth quarter of this year.

The Chinese PCB manufacturer said it has achieved stable mass production of integrated circuit packaging substrates such as FCBOC, FCCSP, Coreless and ETS, and has established stable relationships with domestic and foreign manufacturers of storage chips, application processor chips, radio frequency chips, and sensor chips.

At the same time, the company has invested heavily in the field of FCBGA packaging substrates to expand production, and it plans to start trial production in 2023 to support domestic chip packaging of ultra-large-scale integrated circuits such as CPUs, GPUs, FPGAs, and ASICs.

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