ROSEMONT, IL – IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards this month at IPC's Fall Standards Development Committee Meetings here.
Awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
For their leadership of the 22AS and 5-22AD Task Groups that developed IPC J-STD-001GS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G, Dan Foster, Missile Defense Agency; Kathy Johnston, Raytheon Missile System; Gary Latta, SAIC; and Garry McGuire, NASA Marshall Space Flight Center, were honored with a Committee Leadership Award.
For their contributions to IPC J-STD-001GS, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; Roger Smith, Naval Surface Warfare Center; and Jonathon Vermillion, Ball Aerospace & Technologies, received a Special Recognition Award.
Erik Bjerke, BAE Systems; Gerald Leslie Bogert, Bechtel Plant Machinery; James Daggett, Raytheon; James Saunders, Raytheon; Bhanu Sood, NASA Goddard Space Flight Center; Charles Gamble, NASA Marshall Space Flight Center; and Stefan Hanigk, Ariane Group, received a Distinguished Committee Service Award for their contributions to IPC J-STD-001GS.
For their leadership of the 7-31FS Task Group that developed IPC/WHMA-A-620C-S, Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C, Garry McGuire, NASA Marshall Space Flight Center and George Millman, Raytheon Missile Systems, earned a Committee Leadership Award.
For their contributions to IPC/WHMA-A-620C-S, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; and Jonathon Vermillion, Ball Aerospace & Technologies, earned a Special Recognition Award.
A Distinguished Committee Service Award was presented to Chris Fitzgerald, Nasa Goddard Space Flight Center; Charles Gamble, NASA Marshall Space Flight Center; and John Mastorides, Honeywell Aerospace, for their contributions to IPC/WHMA-A-620C-S.
Mike Carano, RBP Chemical Technology, was honored with a Committee Leadership Award for leading the V-TSL Technology Solutions Committee that developed IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat.
Marc Carter, SAIC; Dennis Fritz, SAIC; Jeff Harms, Naval Surface Warfare Center; Happy Holden, Ted Jones, Naval Surface Warfare Center; Jerry Magera, Motorola Solutions; J.R. Strickland, Motorola Solutions; Joseph Fjelstad, Verdant Electronics; and Hardeep Heer, Firan Technology Group, received a Distinguished Committee Service Award for their contributions to IPC-WP-023.
For his leadership of the 2-19B Trusted Supplier Task Group that developed IPC-1791, Trusted Electronic Designer, Manufacturer and Assembler Requirements, Richard Snogren, Bristlecone, earned a Committee Leadership Award. Peter Bigelow, IMI; Scott Bowles, L3 Fuzing and Ordnance Systems, Cincinnati; Stephanie Brockway, DASD(SE) Systems Engineer; Marc Carter, SAIC; Don Dupriest, Lockheed Martin Missiles & Fire Control; Dennis Fritz, SAIC; Mark Kirkman, SAIC; Vijay Kumar, Lockheed Martin Missile & Fire Control; William May, NSWC Crane; Karen McConnell, Northrop Grumman; Mark McMeen, STI Electronics; Dr. Thi Nguyen, Lockheed Martin Missile & Fire Control; Douglas Schueller, AbelConn; Ray Shanahan, ODASD(SE); Roger Smith, NSWC Crane; Steve Vetter, NSWC Crane; Anne Bennedsen, GDCA; Aman Gahoonia, Defense Microelectronics Activity; Robert Irie, OSD AT&L MIBP; Suriyaken Kleitz, Schlumberger Well Services; Tim Koczanski, Defense Logistics Agency; Vicki Michetti, US Department of Defense; David Pentrack, Defense Microelectronics Activity; Ethan Plotkin, GDCA; Lowell Sherman, DLA Land and Maritime; and John Timler, SAIC, received a Distinguished Committee Service Award for their contributions to IPC-1791.
For his leadership of the D-13 Flexible Circuits Base Materials Subcommittee that developed IPC-4203, Cover and Bonding Material for Flexible Printed Circuitry and IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards, Clark Webster, ALL Flex, earned a Committee Leadership Award.
A Distinguished Committee Service Award was presented to Michael Collier, Teledyne Advanced Electronic Solutions; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Nick Koop, TTM Technologies; Dr. Thi Nguyen, Lockheed Martin Missile & Fire Control; Doug Sober, Essex Technologies Group; Mark Finstad, Flexible Circuit Technologies; Scott Herrmann, Dupont; and Brian Stevens, Rockwell Collins, for their contributions to IPC-4203 and IPC-4204.
Mike Bryant, BGF Industries, was honored with a Committee Leadership Award for leading the 3-12d Woven Glass Reinforcement Task Group, IPC-4412B, Specification for Finished Fabric Woven from "E" Glass for Printed Boards. Masahiro Awano, Nitto Boseki; Jiam Wei Cai, Shengyi Technology; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Kohji Hattori, Unitika Glass Fiber; Scott Hinaga, Cisco Systems; Bill Ortloff, Raytheon; Doug Sober, Essex Technologies Group; Bhanu Sood, NASA Goddard Space Flight Center; Curtis Carter, Saint-Gobain Vetrotex America; Doug Leys, Nelco Products; and David Wynants, Taconic Advanced Dielectric Division, received a Distinguished Committee Service Award.
For their leadership of the 5-33g Low Pressure Molding Task Group, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, Russell Steiner, Casco Products and Eric Camden, Foresite, earned a Committee Leadership Award.
For their contributions to IPC-7621, Fernando Cutino, Allegion; Jason Keeping, Celestica; Donald McCreary, Allegion; Joseph Montella, GHSP; William Pfingston, Miraco; and Callum Poole, Henkel, received a Distinguished Committee Service Award.
