SAN DIEGO -- Rockwell-Collins engineer David Hillman today was inducted to the IPC Hall of Fame, capping nearly three decades of contributions to the industry trade group.

Hillman has been a tireless leader and contributor to a host of industry standards ranging from solderability to surface finishes to acceptability. He also chaired the J-STD-002 and J-STD-003 solderability committees.

He has chaired a number of industry solderability and lead-free process improvement investigations including the SERA and ROSA technology implementations. He has published more than 125 papers. 

He received the IPC President’s Award in 1999, and holds multiple awards for Distinguished Committee Service and Special Recognition award. He also received the NCMS Lead-free Solder Program Special Recognition, EPA DfE Printed Wiring Board Surface Finishes Program Recognition, and was nominated in 2002 as one of PC FAB Magazine’s 50 Most Influential People in the PCB Industry in 2002, and has twice been awarded the Soldertec Lead-Free Solder Award.

Hillman has spent nearly 30 years at Rockwell, where is now a Fellow: Materials & Process Engineer. He also spent three years at General Dynamics. He graduated from Iowa State University with bachelor's in 1984 and master's in 2001. He was recipient of the 1993 Rockwell Corporate Team Award and was awarded the Da Vinci medal as a Rockwell Engineer of the Year for 1994.

Hillman is the 37th individual to be inducted to the IPC Hall of Fame, including colleague Doug Pauls, who was inducted last year.

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