BANNOCKBURN, IL -- An IPC subcommittee is beginning work on an update to its 2003 white paper on halogenated flame retardant use in printed circuit boards and assemblies.

Subcommittee chair Doug Sober seeks new data in support of revising IPC-WP/TR-584A, a report that summarizes IPC's position on "halogen free" materials for the electronics industry.

The original paper primarily centers on copper-clad laminates and prepregs, resin coated copper foils, flexible materials and soldermasks.

The trade group asked for corporate reports or studies of more recent vintage be made available for readers and users of the to-be-written B revision. "They will then have most up-to-date reasons why TBBPA is still the best flame retardant for printed board laminate available," wrote IPC director of PCB programs, standards and technology Tom Newton in an email announcing the project.

Data and reports are requested by Aug. 26, ahead of the 4-33 subcommittee meeting in late September.

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