Log in / Register
  • How to Run a Design of Experiments

    How to Run a Design of Experiments

    A review of the six fundamental steps behind scientific process development.
      READ MORE...

  • American Standard Circuits’ Push for UHDI is On

    American Standard Circuits’ Push for UHDI is On

    After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
      READ MORE...

  • Collaborating Across the Industry

    Collaborating Across the Industry

    The High Density Packaging User Group drives innovation through active partnerships.
      READ MORE...

  • Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Why a relatively unknown technology might be right for static bend applications.
      READ MORE...

  • Embedded Sensors in Flex Circuits

    Embedded Sensors in Flex Circuits

    From glob top to lamination, solutions for sealing parts in flex.
      READ MORE...

Homepage Slideshow

IPC Releases PCB Fab Troubleshooting Guide

Published: 18 May 2016
 by Chelsey Drysdale

BANNOCKBURN, IL — IPC has released a new guide to PCB process defects, with causes and corrective actions for more than 650 potential problems.

IPC-9121, Troubleshooting PCB Fabrication Processes, also includes hundreds of full-color photos demonstrating real-world process defects.

The trade group envisions the handbook as a resource for manufacturers or buyers of printed circuit boards.

IPC-9121 organizes process defects by manufacturing steps: imaging, resists, protective coatings, drilling, surface prep, etching chemistries, lamination, final finishes, etc. It summarizes causes and solutions for each, reportedly allowing users to find and resolve process defects in-house.

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article