LYON, FRANCE – Fan-in wafer-level packaging is experiencing continuous growth and attracting new applications, a new research report says, due to "indisputable benefits" linked to cost and form factor.
Read more ...SANTA ROSA, CA -- A Keysight subsidiary today announced a $600 million offer for Anite, a UK-based supplier of test and measurement tools to the wireless market.
Read more ...WESTFORD, MA – Zuken will hold a webinar on June 10 on 3D printed circuit board design in a product-centric design process.
Read more ...KATOWICE, POLAND -- Mentor Graphics has leased 48,000 sq. ft. of space in an office complex here, according to local reports.
Read more ...PITTSBURGH -- Ansys has entered into a definitive merger agreement with Gear Design Solutions, a provider of big data analytics.
AUSTIN, TX -- A new research report helps dissect new component package options for split die.