Printed Circuit Design & Fab Online Magazine - Design News

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PCB Thermal Challenges
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NTI-100: The World’s Top PCB Fabricators
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Design News

Details: Written by Mike Buetow; Category: Design News; Published: 07 November 2016

ALBUQUERQUE, NM — TE Connectivity and 3D Glass Solutions are collaborating on the development of electronic interconnect devices using glass-based system-in-package (SiP) technology.

Details: Written by Chelsey Drysdale; Category: Design News; Published: 03 November 2016

PITTSBURGH – ANSYS reported third quarter revenue of $245.9 million, up 3% year-over-year.

Details: Written by Chelsey Drysdale; Category: Design News; Published: 02 November 2016

PROSPECT, CT – Design-2-Part (D2P) Shows have released the 2017 schedule.

Details: Written by Chelsey Drysdale; Category: Design News; Published: 24 October 2016

SAN JOSE, CA – Cadence Design Systems reported third quarter revenue of $446 million, up 2.8% year-over-year.

DNEPROPETROVSK, UKRAINE -- Novarm has announced a call for submissions for an electronic hardware design competition based on the company's DipTrace PCB design software.

ROCHESTER, NY -- EMA Design Automation today announced the addition of the SiliconExpert component database to its PCB design portfolio.

Design News

TE Connectivity Teams on New SiP Technology

ANSYS Reports Q3 Revenue Up 3%

Design-2-Part Shows Announce 2017 Schedule

Cadence Reports Q3 Revenue Up 2.8%

DipTrace Opens Contest for Student Hardware Designs

EMA Now Offers SiliconExpert Component Database

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