CHANDLER, AZ – Amkor Technology said it would convert all of its 19mm through 31mm body size plastic ball grid array packages to pin-gate molding over the next few years.
“PBGA packages are a mature technology used in a wide range of applications and end markets, such as computing, network infrastructure, gaming, set top boxes and digital TV,” said Pat O’Brien, Amkor’s senior vice president, ball grid array products.

This effort will extend the usefulness of wirebonding to smaller silicon nodes and is applicable with gold and copper wires, he says.

Amkor’s PGM process is designed with a JEDEC-compliant larger mold cap; benefits include allowing the routing of active traces and vias within the mold cap dimensions, improving protection from solder mask cracking, and facilitating larger die sizes in the same form factor. 

The PGM PBGA uses a package saw singulation process that produces a smoother edge on the package, reducing the potential for binding in the test socket and shipping tray, Amkor says.

Gold wire diameter can be reduced over 50% down to 0.5mm. Copper wire diameters can also be reduced significantly. With PGM, wirebonding can now be used down to 28nm, the firm notes.

A company white paper provides further explanation of the reasons behind the switch.

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