ATLANTAUP Media Group Inc., parent company of Circuits Assembly and Printed Circuit Design & Manufacture, has issued a call for abstracts for PCB East 2008, which will be held May 11-16 at the Holiday Inn Select and Convention Center in Tinley Park, IL.

PCB East annually provides attendees and vendors with a conference and exhibition focused on the design and fabrication of PCBs, high-density interconnect and other advanced circuits.
The five-day conference program focuses on PCB engineering, design and fabrication. The conference is comprised of a three-day technical conference and a professional development certificate program of one-day and two-day courses.
The event also includes a two-day exhibition of top industry vendors to be held May 13 – 14.
Papers and presentations of the following durations are sought for the technical conference: 30-minute paper sessions; one-hour lectures, presentations or panel sessions; two-hour workshops or panel sessions, and half-day seminars.
Papers and presentations of the following durations are sought for a Professional Development Certificate program of in-depth courses: one-day tutorials (7 hours of instruction); two-day tutorials (14 hours of instruction)
For consideration, please email a course title, suggested course length, short description of the target audience, 100- to 300-word abstract and speaker bio(s) to Ronda Faries at This email address is being protected from spambots. You need JavaScript enabled to view it. by Nov. 15.
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
Some suggested paper and presentation topics include (but are not limited to): high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes (especially how they affect design and fabrication); RF and microwave design; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; soldering; surface finishes; industry forecasts, and business and supply chain issues.
If selected, final papers and presentations will be due in March.
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