TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.

Dow Corning, www.dowcorning.com
 

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