CRANSTON, RI – Technic Inc. has released CU 2800, an advanced acid copper electroplating process designed specifically for improving leveling of high aspect ratio PCBs at reduced plating times.
 
Using an innovative, proprietary brightener compound, CU 2800 is said to provide significantly improved throwing power reportedly making it possible for faster plating times.
 
Technic CU 2800 provides deposit leveling without the use of traditional stress inducing leveling agents. The end result is said to be a fine grain deposit exceeding the performance requirements of the most advanced PCB structures.
 
All Technic CU 2800 components are fully analyzable using Technic’s Electrochemical Bath Analyzer as well as other established quantitative methods.

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