PCB material with negative coefficient of thermal expansion (CTE) supports large-format AI designs by reducing thermomechanical mismatch. Celeritas HM50 features a CTE of -8ppm/°C, enabling PCB stackups to counteract copper expansion and lower overall board CTE. This supports reduced warpage, minimized package bow and improved solder fatigue performance in high-density assemblies. The material supports applications where thermal stability is critical, including advanced AI hardware and high-performance computing systems, enabling improved reliability in large-scale designs.

Advanced Chip and Circuit Materials

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