Log in / Register
  • ENEPIG Corrosion Mechanisms

    ENEPIG Corrosion Mechanisms

    Different types of nickel corrosion and potential mitigation strategies.
      READ MORE...

  • The Future is Thin, Flat and Flexible

    The Future is Thin, Flat and Flexible

    What’s ahead for antennas, heaters and inks.
      READ MORE...

  • Royalty Flush

    Royalty Flush

    A noted solutions architect offers an audacious plan for AI acceptance. It just might work.
      READ MORE...

  • Rocking and Rolling at ZIW

    Rocking and Rolling at ZIW

    The annual user event was tuned into AI, but that’s not the only melody being played.
      READ MORE...

  • Can Thailand Pad its PCB Gains?

    Can Thailand Pad its PCB Gains?

    2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.
      READ MORE...

Homepage Slideshow

Uyemura Rolls Out Talon 3 E-Pd

Published: 19 April 2017

Talon 3 electroless palladium allows plating directly onto copper. Paves the way for electroless palladium/ immersion gold (EPIG).

Developed for applications that cannot tolerate nickel: medical sensors; flexible circuits; electronic products that cannot use nickel due to problems related to magnetics and frequency, and high-frequency circuitry (particularly aerospace). Deposits an electroless/autocatalytic palladium that is solderable and gold wire bondable. Bath has low palladium metal content. Rate of deposition and quality of deposit are reportedly consistent throughout the product’s bath life. EPIG finish solders after eight hours of steam aging.  

Uyemura
www.uyemura.com

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article