Press Releases

ATLANTA — ECIA is pleased to announce the 2024 Executive Conference Core Committee. Previously announced Chair Ken Bellero, Schaffner, and Co-Chair Maryellen Stack, Sager Electronics have finalized the core committee of returning and new members who already have hit the ground running for the best conference yet.

  • Pam Berigan, Sager Electronics
  • Lori Bruno, LuscomBridge
  • Tobi Cornell, Kruvand Associates
  • Robert Derringer, Crouzet
  • Juliet Fajardo, TDK-Lambda
  • Heather Fulara, DigiKey
  • Bob Garcia, Ferrari Technical Sales
  • Nicolle Ladouceur, ROHM Semiconductor

“I am really looking forward to working with this talented group of people,” commented Stephanie Tierney, ECIA’s Director of Member Communications and Member Engagement. “2023 was a record-breaking conference on many levels: sponsorships, attendance, survey responses and more were all ahead of the year before. This group has already vowed to surpass those records, and it will be fun working with them to meet the ambitious goals they have set for the 2024 Conference,” she continued. “All I can say is, ‘Watch out for another great event planned by this fantastic committee!’”

Subcommittees will be announced soon. For more information, go to https://www.eciaexecconference.org/. Sponsorship opportunities have been released and are filling up fast!

WASHINGTON – Printed circuit boards are prioritized in a December 12, 2023 report from the House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party:

  • Of 150 recommendations #1 is to strengthen domestic manufacturing of printed circuit boards and reduce reliance on adversary nations for microelectronics

Department of Defense:

The recently released National Defense Industrial Strategy focuses on creating resilient supply chains including microelectronics. The DoD has identified the need to expand domestic production and invest in a skilled workforce.

Congress has also obligated approximately $150 million for investments in microelectronics using the Defense Production Act. Two recent awards include:

  • $46.2 million to GreenSource Fabrication LLC via the Defense Production Act Investment Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.
  • $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PCB) cores and HDBU build-up layers.

While these actions are helpful, America needs to make a sustained, robust investment in manufacturing the microelectronics that power all aspects of modern life. The Printed Circuit Board Association of America and IPC have jointly called on Congressional appropriators to increase DPAI funding for microelectronics.

“Report after report coming out of Washington highlights our overreliance on Asia for microelectronics and the pressing need to make more printed circuit boards and substrates in America," said PCBAA Executive Director David Schild. "The current situation puts our national and economic security at risk. Congress and other agencies of government must act to reduce our dependency on foreign nations for the components that power national security and critical infrastructure systems.”

SAN DIEGO, CA – Pre-registration is now open for Chiplet Summit's second annual event on February 6-8 at the Santa Clara Convention Center. Hundreds of registrants and many key exhibitors will be at the premier showcase for chiplet technology. All major chip makers have adopted chiplets as their approach to producing devices at leading-edge nodes.

The event will cover the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, likely breakthroughs, optimization, and long-term trends. Pre-conference seminars will focus on chiplet basics, packaging methods, interfaces, design methods, working with foundries, AI in chiplet design, and the Open Chiplet Economy. Other features include a high-powered superpanel on “How Can Chiplets Accelerate Generative AI Applications?”, an expert table session (with beer and pizza), and an annual update of technologies and markets.

Industry-leading keynotes offer designers insight into trends and roadmaps. Speakers represent Applied Materials, Synopsys, Micron, Alphawave Semi, Hyperion Technologies (introducing a new packaging technology with larger packages and a 1000W power budget), and Open Compute Project (OCP). Their focus is on methods for designing processors, coprocessors, communications devices, and graphics and AI chips.

“We now see the full impact of chiplets. They allow designs to include off-the-shelf components as well as drop-ins from older process nodes,” said Chuck Sobey, Summit General Chair. “They are ideal for applications such as AI that demand more processing power, faster response time, and the ability to handle more data. Chiplet Summit will help designers make the right decisions for current projects and future needs.”

Chiplet Summit also features innovative products from industry leaders such as Applied Materials, Synopsys, Alphawave Semi, Open Compute Project, Achronix, Arm, Cadence, and Siemens EDA.

Visit Chiplet Summit:
ChipletSummit.com

SANTA ANA, CA – TTM Technologies, Inc. has donated $20,000 to the international humanitarian organization, Rise Against Hunger, through its TTM Chair of Community Service Award. The donation was made on behalf of TTM's West Region and Global Headquarters as part of their efforts to help those in need.

TTM's West Region partnered with Rise Against Hunger to launch a two-day meal packaging event in May 2023, where employees volunteered to package nutritious meals for people in developing countries. The goal was to package 10,000 meals per site, totalling 60,000 packaged meals. Across the six events spread through each TTM location in California, 360 TTM volunteers packaged 60,912 meals, which have already been shipped to developing countries. Their efforts have helped feed 360,000 individuals, which equates to nearly 5 tons of nutritious and impactful meals.

The TTM Board of Directors and Executive Team established the TTM Chair of Community Service Award in recognition of retired TTM Board Chairman Robert Klatell's community leadership and public service. Every year, this award recognizes a team of employees who selflessly contribute their time and abilities to positively impact communities through their service.

Shawn Powers, Executive Vice President and Chief Human Resources Officer said, "We are extremely proud of our employees for their hard work and dedication to this noble cause. Their efforts have significantly impacted many people's lives in developing countries, and we are honored to have made a positive contribution."

Megan Wolf, Donor Engagement Director for Rise Against Hunger, who was present at the global headquarters to receive the donation, thanked TTM for their generous donation and partnership in fighting hunger and malnutrition worldwide.

SINGAPORE – In a recent FutureScape report, IDC FutureScape: Worldwide Future of Work 2024 Predictions — Asia/Pacific (Excluding Japan) Implications, IDC predicts that by 2025, 60% of A2000 firms will upgrade hardware and software technologies to increase worker retention with personalized work experiences and enhanced collaboration by 2025. Collaborative applications are becoming more visual and will continue to develop characteristics not unlike a multiplayer game that enables a more personalized view of work and teams, better alignment to projects, and hands-on collaboration applications.

  • Generative AI emerges as a game-changer for organizational advancement, weaving a seamless tapestry across three key fronts: Intelligent Document Processing (IDP), Generative Automation, and Knowledge Sharing.
  • Smarter Document Handling: By 2026, businesses that link GenAI to smart document handling will discover 20% more ways to use it, boosting productivity, scalability, and delivering better customer experiences.
  • Generative Automation: Business teams using code generation copilots will achieve 70% success rate in streamlining jobs with task/workflow automation, replacing low-code and IT-supported development by 2024.
  • Efficient Knowledge Sharing: In 2025, GenAI tools will enable senior leaders to double the productive use of unstructured data by discovering untapped insights and knowledge, driving 20% growth in sustainable business benefits.

As GenAI takes center stage, its adaptive capabilities are set to streamline processes, automate tasks, and redefine the skillsets required for various roles. While this evolution brings forth unprecedented opportunities for upskilling and reskilling, it also underscores the imperative for organizations to adapt to this paradigm shift, ensuring the alignment of talent with the dynamic demands of the future workplace.

This prediction not only foretells a redefined professional landscape but also emphasizes the pivotal role of GenAI in driving organizational agility and competitiveness. In this dynamic environment, the significance of skill development cannot be overstated, as it becomes the essence of staying competitive and relevant. GenAI is not just a technological advancement but a catalyst for change in the skill landscape. The imperative for skill development is no longer a choice but a necessity in a landscape where GenAI is reshaping how we work.

  • Job Evolution: By 2027, 40% of current job roles will be redefined or eliminated across A2000 organizations accelerated by GenAI adoption.
  • Tailored Skills Boost: Enterprises will leverage personalized technology skills development to drive $1 trillion in productivity gains by 2027, enabled by GenAI and automation everywhere.
  • Tech Skill Support: By 2027, 80% of A1000 organizations will mitigate technical skills shortages using digital adoption platforms.
  • AR/VR engineering and training: By 2028, half of large businesses will use prompt engineering to prototype AR/VR simulations, reducing development time from weeks to hours and creating precision training.

Simultaneously, digital twins and sustainable office design are capturing attention, reflecting a growing focus on environmental consciousness in the region. Organizations are recalibrating priorities to balance technological innovation with a commitment to sustainability, showcasing a harmonious approach where cutting-edge technology aligns with ecological stewardship in APEJ's business narrative.

  • Digital Twins Maturity: By 2028, digital twin technologies will enhance virtual and physical office user experiences, driving a 30%+ improvement in retention of workers in A1000 companies.
  • Green Offices: By 2028, half of the biggest companies are set to invest in what we call "Climate Heavens" for their offices. This means using things like assets and renewable energy to cover 30% of their ongoing operating costs, making workplaces more eco-friendly.

"As the benefits and applicable use cases of GenAI unfold, organizations are exploring the outcomes that GenAI can potentially bring to business operations and innovation. The focus on skill development becomes a necessity and a strategic imperative, as GenAI enables personalized development. Simultaneously, the reimagination of workplaces, with digital twins and sustainability stand out as key foci for companies," says Dr . Lily Phan, Research Director, Future of Work, IDC Asia/Pacific.

SOUTHINGTON, CT – Katarina Roy has been appointed Technical Service Engineer, expanding Uyemura’s technical resources in the US northeast and the province of Ontario. She will work from Andover, MA. and the Uyemura Tech Center in Southington, CT.

Roy formerly worked for a medical device manufacturer, where she had both R&D and troubleshooting responsibilities. Most recently, she was a Manufacturing Engineer for Vicor Corp., a global leader in high-performance power modules, where her focus was process development, and she became highly knowledgeable about the optimization of Uyemura chemistries.

That knowledge was immediately helpful when she joined Uyemura, and assisted in the installation of ENIG chemistry at a customer location in Slovenia. In January, she will participate in the installation of a new ENEPIG line for a major US customer. Roy has a B.S. in Chemical Engineering and Lean Six Sigma training. She recently conducted a Lightning Talk on data management.

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