AUSTIN, TX -- Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the official opening of the company’s APAC facility in Kaohsiung City, Taiwan. The facility includes offices, a full technical/field support lab, as well as full ink production for customers using Electroninks’ metal-complex inks in-region. The new operation enables increased and redundant ink production capabilities, with additional engineering staff to work with customers directly in APAC. In addition, the company has also hired Takashi Mochizuki as APAC Business Manager, KY Liu as Taiwan Application Development Manager and Kazutaka Ozawa as Technical Director. Combined, these new members have more than 40 years of experience in conductive inks and semiconductor industries. They will work closely with the rest of the global operations and customers.
In addition to the new reactors and ink production tools, there is a full QA/QC lab and analytical equipment for ink qualification. The APAC facility also has a full engineering support lab complete with printing tools including new screen printers, spray coaters and inkjet printers – that match equipment going into production lines at customer sites. With the new staff and additional equipment, global customers will receive significantly improved logistics with shorter product lead times and faster technical support.
“This new facility marks an important milestone of growth and achievement for our company, and significantly improves our ability to serve the global market,” stated Melbs LeMieux, president and cofounder of Electroninks. “We appreciate the support of the local officials and our partners in Kaohsiung to bring this project to completion.”
For more information on Electroninks products and solutions, please visit www.electroninks.com
CAMBRIDGE, UK – 3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry. There are three main approaches to 3D electronics: applying electronics to a 3D surface, in-mold electronics, and fully printed 3D electronics. Each approach is discussed in detail in the newly launched IDTechEx report "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets".
The report weighs the pros and cons of each approach with numerous case studies showing how different manufacturing techniques and materials meet the requirements for application opportunities across the automotive, consumer goods, IC packaging, and medical device sectors.
Applying electronics to 3D surfaces
The most established approach to adding electrical functionality onto the surface of 3D objects is laser direct structuring (LDS). LDS saw tremendous growth around a decade ago and is used to manufacture hundreds of millions of devices each year, including antennas and simple conductive interconnects to the surface of 3D injection-molded plastic objects. However, despite its high patterning speed and widespread adoption, LDS has some weaknesses that leave space for alternative approaches to surface metallization. For example, valve jet printing, also known as dispensing, is already being used for a small proportion of antennas. This technique enables the rapid deposition of a wide range of materials.
Aerosol jetting and laser-induced forward transfer (LIFT) are other digital deposition technologies covered in the report. These technologies offer higher resolutions and rapid deposition of a wide range of materials, respectively. The IDTechEx report also benchmarks other emerging techniques, such as ultra-precision dispensing, electrohydrodynamic printing, impulse printing, pad printing, and spray metallization. IDTechEx forecasts a gradual growth in the market for partially additive electronics, particularly in the telecommunications and microelectronics sectors.
In-mold electronics
In-mold electronics (IME), in which electronics are printed/mounted prior to thermoforming into a 3D component, facilitate the transition towards greater integration of electronics, especially where capacitive touch sensing and lighting are required. IME offers multiple advantages relative to conventional mechanical switches, including a reduction in weight and material consumption of up to 70% and much simpler assembly.
The IME manufacturing process can be regarded as an extension of the well-established in-mold decorating (IMD) process. Thus, much of the existing process knowledge and capital equipment can be reused. IME differs from IMD through the initial screen printing of conductive thermoformable inks, followed by the deposition of electrically conductive adhesives and the mounting of SMDs (surface mount devices, primarily LEDs at present). More complex multilayer circuits can also be produced by printing dielectric inks to enable crossovers.
Despite the advantageous features, commercial deployment of IME-integrated SMD components has thus far been fairly limited. This relatively slow adoption, especially within the primary target market of automotive interiors, is attributed to both the challenges of meeting automotive qualification requirements and the range of less sophisticated alternatives, such as applying functional films to thermoformed parts. Along with greater acceptance of the technology, the adoption of IME will require clear design rules, materials that conform to established standards, and, crucially, the development of electronic design tools. IDTechEx predicts that the most significant growth in 3D electronics will occur in in-mold electronics (IME) once it passes its validation stage.
Fully printed 3D electronics
Arguably, the most innovative approach to additive electronics is fully printed 3D electronics, in which dielectric and conductive materials are sequentially deposited. Combined with placed SMD components, this results in a circuit, potentially with a complex multilayer structure embedded in a 3D plastic object. The core value proposition is that each object and embedded circuit can be manufactured using a different design without the expense of manufacturing masks and molds each time.
Fully 3D printed electronics are thus well suited to applications where a wide range of components need to be manufactured at short notice. The technology is also promising for applications where a customized shape and even functionality are important. The ability of 3D printed electronics to manufacture different components using the same equipment and the associated decoupling of unit cost and volume could also enable a transition to on-demand manufacturing.
The challenge for fully 3D printed electronics is that manufacturing is fundamentally a much slower process than making parts via injection molding since each layer needs to be deposited sequentially. While the printing process can be accelerated using multiple nozzles, it is best targeted at applications where customizability offers a tangible advantage. Ensuring reliability is also a challenge, considering different material properties; additionally, with embedded electronics, post hoc repairs are impossible - one strategy is using image analysis to check each layer and perform any repairs before the next layer is deposited.
Comprehensive analysis and market forecasts
The new IDTechEx report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets", analyzes the technologies and market trends that promise to bring electronics manufacturing into the 3D realm. Drawing from over 30 company profiles, the report assesses three distinct segments of the 3D electronics landscape. The IDTechEx report evaluates each segment's different technologies, potential adoption barriers, and application opportunities.
IDTechEx's new report also includes detailed 10-year market forecasts for each 3D electronics manufacturing technology, segmented by application sector and delineated by both revenue and area/volume.
To find out more about this report, including downloadable sample pages, please visit www.IDTechEx.com/3DElec
For the full portfolio of printed & flexible electronics market research from IDTechEx, please see www.IDTechEx.com/research/pe
BOCA RATON, FL – Inovaxe is thrilled to announce that TTM Technologies, Inc. (NASDAQ:TTMI), a global leader in technology solutions, has purchased its cutting-edge SREX Racks directly off the show floor at the recent 2024 IPC APEX EXPO.
TTM Technologies, Inc. is renowned for its mission-critical technology solutions, including RF components, RF microwave assemblies, and advanced PCBs, all designed to shorten time-to- market for its customers. With a commitment to modernization and efficiency, TTM recognizes the benefits of Inovaxe’s SREX Racks in enhancing inventory management processes.
Inovaxe’s SREX Racks set new standards for inventory management efficiency, boasting an impressive storage capacity of up to 880 7" reels or 480 13" reels. Equipped with intelligent sensors and integrated lighting for part identification, these state-of-the-art racks offer lightning-fast retrieval and return times, reducing kitting processes from hours to mere seconds. Seamlessly integrating with ERP, MES, MRP and pick-and-place software, the SREX racks provide real-time inventory visibility, enhancing operational transparency and control.
Gerald Palmer, Assembly Engineering/Operations Manager at TTM Technologies, Inc., commented on the acquisition, “We are excited to integrate Inovaxe’s SREX Racks into our inventory management processes. We anticipate significant improvements in efficiency and productivity.”
Inovaxe’s SREX Racks are not only ESD-compliant but also equipped for Wi-Fi and internet connectivity, ensuring compatibility with modern manufacturing environments. With a typical return on investment realized in just 3-6 months, these racks represent a vital investment in efficiency for manufacturers seeking to streamline their operations and drive growth.
For more information about Inovaxe's innovative inventory management solutions, visit www.inovaxe.com
WASHINGTON – The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung. The incentives, which are part of the CHIPS and Science Act, will support Samsung’s manufacturing operations in Texas. The Commerce Department previously announced incentives for TSMC, Intel, GlobalFoundries, Microchip Technology, and BAE Systems.
“Today’s announcement will help Samsung bring more semiconductor production, innovation, and jobs to U.S. shores, reinforcing America’s economy, competitiveness, and critical chip supply chains. We applaud Samsung for investing boldly in U.S.-based manufacturing and salute the U.S. Commerce Department for making significant headway in implementing the CHIPS Act’s manufacturing incentives and R&D programs. We look forward to continuing to work with leaders in government and industry to ensure the CHIPS Act remains on track to help reinvigorate U.S. chip manufacturing and research for many years to come.”
The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across 25 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create nearly 50,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
CAMBRIDGE, UK – IDTechEx's report "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets" analyses the technologies and market trends that promise to bring electronics into the 3D realm. Drawing from over 40 company profiles, the majority based on interviews, it assesses three distinct segments of the 3D electronics landscape: applying electronics to a 3D surface (partially additive), in-mold electronics, and fully additive electronics. Within each segment, the report evaluates the different technologies, potential adoption barriers, and application opportunities. It includes detailed 10-year market forecasts for each technology and application sector, delineated by both revenue and area/volume.
Motivation for 3D electronics
While partially additive 3D electronics has long been used for adding antennas and simple conductive interconnects to the surface of 3D injection-molded plastic objects, more complex circuits are increasingly being added onto surfaces made from a variety of materials by utilizing new techniques. Furthermore, in-mold electronics and 3D printed electronics enable complete circuits to be integrated within an object, offering multiple benefits that include simplified manufacturing and novel form factors. With 3D electronics, adding electronic functionality no longer requires incorporating a rigid, planar PCB into an object then wiring up the relevant switches, sensors, power sources, and other external components.
The report weighs the pros and cons of each approach against each other for multiple applications, with numerous case studies showing how the different manufacturing techniques are deployed across the automotive, consumer goods, IC packaging and medical device sectors. Furthermore, through detailed analysis of the technologies and their requirements, IDTechEx identifies innovation opportunities for both materials and manufacturing methods.
Applying electronics to a 3D surface
The most established approach to adding electrical functionality onto the surface of 3D objects is laser direct structuring (LDS). LDS saw tremendous growth around a decade ago and is used to manufacture hundreds of millions of devices each year, around 75% of which are antennas. However, despite its high patterning speed and widespread adoption, LDS has some weaknesses that leave space for alternative approaches to surface metallization. Valve jet printing or termed dispensing, a technique enabling wide range of materials deposition, is already used for a small proportion of antennas, and is the approach of choice for systems that deposit entire circuits onto 3D surfaces.
Aerosol jetting and laser induced forward transfer (LIFT) are other digital deposition technologies, which offer higher resolutions and rapid deposition of a wide range of materials respectively. Other emerging techniques such as ultra precise dispensing, electrohydrodynamic printing, impulse printing, pad printing, spray metallization are also benchmarked in this report, enabling new market potential of electronics on 3D surfaces. An advantage of digital deposition methods of the incumbent LDS technology is that dielectric materials can also be deposited within the same printing system, thereby enabling multilayer circuits. Insulating and conductive adhesives can also deposited, enabling SMD components to be mounted onto the surface.
In-mold electronics
In-mold electronics (IME), in which electronics are printed/mounted prior to thermoforming into a 3D component, facilitates the transition towards greater integration of electronics, especially where capacitive touch sensing and lighting is required. IME offers multiple advantages relative to conventional mechanical switches, including reduction in weight and material consumption of up to 70% and much simpler assembly. The IME manufacturing process can be regarded as an extension of the well established in-mold decorating (IMD) process, thus much of the existing process knowledge and capital equipment can be reused. IME differs from IMD though the initial screen printing of conductive thermoformable inks, followed by deposition of electrically conductive adhesives and the mounting of SMDs (surface mount devices, primarily LEDs at present). More complex multilayer circuits can also be produced by printing dielectric inks to enable crossovers.
Despite the wide range of applications and the advantageous reductions in size, weight, and manufacturing complexity, commercial deployment of IME integrated SMD components has thus far been fairly limited. This relatively slow adoption, especially within the primary target market of automotive interiors, is attributed to both the challenges of meeting automotive qualification requirements and the range of less sophisticated alternatives such as applying functional films to thermoformed parts. Along with greater acceptance of the technology, this will require clear design rules, materials that conform to established standards, and crucially the development of electronic design tools.
Fully printed 3D electronics
The least developed technology is fully printed 3D electronics, in which dielectric materials and conductive materials are sequentially deposited. Combined with placed SMD components, this results in a circuit, potentially with a complex multilayer structure embedded in a 3D plastic object. The core value proposition is that each object and embedded circuit can be manufactured to a different design without the expense of manufacturing masks and molds each time. Fully 3D printed electronics are thus well suited to applications where a wide range of components need to be manufactured at short notice. The technology is also promising for applications where a customized shape and even functionality is important. The ability of 3D printed electronics to manufacture different components using the same equipment, and the associated decoupling of unit cost and volume, could also enable a transition to on-demand manufacturing.
The challenges for fully 3D printed electronics are that manufacturing is fundamentally a much slower process than making parts via injection molding since each layer needs to be deposited sequentially. While the printing process can be accelerated using multiple nozzles, it is best targeted at applications where the customizability offers a tangible advantage. Ensuring reliability is also a challenge, considering different material properties; additionally, with embedded electronics post-hoc repairs are impossible - one strategy is using image analysis to check each layer and perform any repairs before the next layer is deposited.
Comprehensive analysis and market forecasts
IDTechEx has been researching the emerging printed electronics market for well over a decade, launching our first printed and flexible sensor report back in 2012. Since then, we have stayed close to the technical and market developments, interviewing key players worldwide, attending numerous conferences, delivering multiple consulting projects, and running classes and workshops on the topic. This enables us to provide a complete picture of the 3D electronics technological and market landscape, along with the entire field of printed electronics.
ATLANTA – ECIA is pleased to announce the 2024 Executive Conference theme, ‘Navigating the Tides of Change.’ Conference Chair Ken Bellero expands on the concept. “As chairperson of this year’s ECIA executive conference, I am both humbled and exhilarated to stand at the helm as we Navigate the Tides of Change together. It is through our collective wisdom, resilience, and innovation that we will chart a course to thrive in the ever-evolving landscape of the electronics industry. Our plan this year is to push the boundaries of our comfort zones and dare to dream of a future where we not only survive but thrive in the face of change.”
“Each year the conference theme serves to guide the committee and stimulate our imaginations as we plan activities and select speakers,” continued Stephanie Tierney, ECIA Director of Marketing Communications and Member Engagement. “The committee agreed that we wanted to build off the momentum from last year’s ‘Making Waves, the Power of You’. This theme takes that idea one step further as the industry evolves to address current and future challenges.”
The ECIA Executive Conference is a senior management level conference for the electronics industry's leading companies - representing the entire supply chain. The date for the 2024 Executive Conference is October 20-22 at the Loews Chicago O'Hare Hotel. Registration is now open.
