Rogers Corporation (NYSE:ROG) and its Advanced Connectivity Solutions technical team will be presenting the latest developments in printed-circuit-board (PCB) materials for emerging high-frequency applications at the upcoming IPC APEX EXPO 2017 (http://www.ipcapexexpo.org), February 14-16, 2017 at the San Diego Convention Center.
As part of the technical program, Rogers’ Technical Marketing Manager, John Coonrod, is scheduled to present “Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies” on Tuesday, February 14th, from 1:30 PM to 3:00 PM as part of technical conference session S03 on High-Frequency/High-Speed I. Coonrod, author of the long-running ROG Blog series on PCB materials, will detail the type of circuit materials and material characteristics needed for rapidly growing applications at frequencies above 30 GHz, in particular for Fifth Generation (5G) wireless communications networks and for the growing number of automotive electronic safety systems, such as 77-GHz collision-avoidance radar systems.
Rogers at Booth 3624
On the exhibition floor, Rogers’ technical team will be at booth 3624 with examples of their diverse circuit materials as well as guidance and advice on achieving optimum performance with materials such as 92MLÔ and ULTRALAM® 3850HT laminates.
92ML materials: These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board. 92ML laminate materials are available with up to 4oz copper cladding; thick enough to meet today’s most demanding power distribution requirements. The high thermal conductivity of up to 3.5 W/m-K (in-plane) in combination with the relative ease and familiarity of epoxy based systems makes this material an ideal candidate for applications such as motor controllers, power supplies, converters, automotive electronics, etc. The relatively high Tg value of 160°C in combination with a low Z-axis coefficient of thermal expansion of 22ppm/°C (Tg) ensure that the 92ML materials survive lead free solder exposures and board reliability testing. The excellent rheological characteristics of the 92ML prepregs enable a high degree of resin flow: a critical element of high power multi-layer board processing.
Additionally, 92ML laminates are also offered in combination with an aluminum plate to form an insulated metal substrate (IMS). This product is known as 92ML StaCool™ laminate. In this configuration, the product has an integrated heat sink that can be machined and formed to serve as a mechanical chassis in the final application. 92ML StaCool laminate is characterized as having a high level of thermally stable adhesion to the aluminum substrate. This laminate withstands over 7 minutes of 288°C solder exposure enabling sufficient time for final product to be assembled without issues. 92ML StaCool laminate is useful in high power and operating temperature applications such as LED modules, automotive lighting, power devices, etc.
ULTRALAM 3850HT Laminates: This high-temperature (HT) liquid-crystal-polymer (LCP) circuit material delivers improved manufacturability in multilayer circuits. Its high melt temperature of +330°C improves multilayer layer-to-layer registration and offers improved thermal stability, while its low effective dielectric constant (3.14 @10GHz), low loss (0.002), and thin core offerings make it an ideal circuit material for millimeter wave frequencies. Being highly impermeable, this material is an attractive alternative to ceramic for MMIC (monolithic microwave integrated circuit) packaging.
These are just a few examples of Rogers’ circuit materials lineup, with more on display at Rogers’ booth 3624 at the upcoming IPC APEX EXPO 2017. Visitors can learn more about the benefits of each material along with application assistance at the Rogers’ booth.
About Rogers Corporation Rogers Corporation (NYSE:ROG) is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com. Image removed by sender.
