NAPLES, FL -- Richard (Dick) Finigan, the former chairman and CEO of Pads Software, passed away on Jul. 4.

Read more: Ex Pads CEO Finigan Passes Away

NEENAH, WI -- Plexus announced the expansion of its Engineering Solutions business in the US and Mexico, expanding an existing site and opening a second one. 

Read more: Plexus Expands Design Engineering Business

HERNDON, VA – A new iNEMI project will explore PCB design, fabrication and board assembly processes that could affect board warpage.

Read more: iNEMI Forms PCB Warpage Characterization & Minimization Project

WILSONVILLE, OR -- Mentor today announced the launch of a consortium to drive new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer IC designs.

Read more: Mentor Launches IC HDAP Design and Manufacturing Group