WASHINGTON -- The US Department of Defense today announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics to enhance capabilities to produce high-density build-up (HDBU) substrates, which include high-density interconnect printed circuit board (PrCB) cores and HDBU build-up layers.
ZHUHAI, CHINA – Skychem Technology is planning a CNY100 million ($13.8 million) production plant in Thailand to establish overseas capacity and expand abroad.