MILPITAS, CA – SEMI FlexTech announced new projects featuring novel interconnect and integration strategies to move innovations to market-ready products. The projects include thin batteries, printed audio speaker systems, and flexible fan-out wafer-level packaging advances.
BANNOCKBURN, IL – IPC is issuing the following warning statement, which will also be included in the forthcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards: