Fab News

WASHINGTON -- The US Department of Defense today announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics to enhance capabilities to produce high-density build-up (HDBU) substrates, which include high-density interconnect printed circuit board (PrCB) cores and HDBU build-up layers.

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ZHUHAI, CHINA – Skychem Technology is planning a CNY100 million ($13.8 million) production plant in Thailand to establish overseas capacity and expand abroad.

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WASHINGTON -- The US Environmental Protection Agency on Nov. 9 issued notice of a proposed administrative penalty assessment for alleged violations of the Clean Water Act at a printed circuit board fabricator in upstate New York.

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MYSURU, INDIA – Kaynes Technology will invest Rs 750 crore ($90 million) for a bare board printed circuit board plant here.

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LEOBEN, AUSTRIA – AT&S will start building IC chip substrates for AMD at its new plant in Malaysia next year, according to Reuters report today.

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LEOBEN, AUSTRIA – AT&S's revenues and margins improved in its second quarter ended Sept. 30, partially offsetting declines in the PCB fabricator's first quarter. 

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