Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by Mike Buetow; Category: Fab News; Published: 24 September 2015

BANNOCKBURN, IL – IPC has released IPC-6012D, “Qualification and Performance Specification for Rigid Printed Boards,” a multi-year effort to update the industry standard for bare board acceptance.

Details: Written by Chelsey Drysdale; Category: Fab News; Published: 24 September 2015

BANNOCKBURN, IL – New microvia requirements are at the heart of the latest IPC standard for bare board qualification and performance.

Details: Written by Mike Buetow; Category: Fab News; Published: 23 September 2015

PHOENIX -- An Arizona jury this week said TUC Technology Corp. owes Isola USA more than $11 million in damages for willfully violating multiple patents for printed circuit board materials.

Details: Written by Chelsey Drysdale; Category: Fab News; Published: 22 September 2015

TACOMA, WA – Toray Composites America completed a multimillion dollar expansion project at its production facility here. The opening ceremony is Sept. 25.

NEW YORK – The copper-clad laminate market grew 7.1% year-over-year in 2014 to 760 million m². Production in China accounted for 68.4% of the global total, says ResearchInChina.

ARLINGTON, VA – Defense Advanced Research Projects Agency supported researchers have unveiled so-called "dielets" said to be capable of securing the authenticity of electronics components and products.