LISLE, IL – Molex has developed the capability to print high-performing silver flexible circuits on polyester substrates with traces as narrow as 0.13mm and spacing as small as 0.13mm.

CAMBRIDGE, MA – University engineers are adding to heat-shrinking materials. A team led by Nicholas X. Fang, an associate professor of mechanical engineering at MIT, has manufactured tiny, star-shaped structures out of interconnected beams, or trusses. The sugar-cube-size structures quickly shrink when heated to about 540°F.

PARSIPPANY, NJ – Sun Chemical and its parent company, DIC, have acquired Gwent Electronic Materials for an undisclosed sum.

KAOHSIUNG, TAIWAN – WUS Printed Circuit (Kunshan) expects 2016 profit of $8.9 million to $13.3 million, up between 983.4% and 1,525.1% compared to 2015.