Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by Staff; Category: Fab News; Published: 23 June 2008

HERRENBERG, GERMANY -- HMS-Höllmüller and Uyemura (UIC) have formed an alliance to jointly market and sell desmear/electroless copper/copper plating packages in Japan as well as in other parts of Asia. UIC installed a HMS´s PTH and plating technology line (ComPlate PTH/ComPlate Cu G4) in the UIC Osaka facility. The equipment and chemistry combo are being used for customer qualifications.

“HMS and UIC had already successfully formed an alliance for a specific customer for horizontal reel-to-reel applications with electroless nickel, electrolytic nickel, electrolytic gold systems, so that it was a natural decision to extend this concept to other regions”, says Joe Kresky, managing director of HMS.

Details: Written by Staff; Category: Fab News; Published: 23 June 2008

HAMPSTEAD, NH and SHENZHEN, CHINA – P.D. Circuits has completed "phase two" of its development of its PCB supply chain operations in China.

The company reports that it has doubled its engineering staff in South China, increased its manufacturing sources, added inspection capabilities, and expanded its office in Shenzhen. The company has also certified five employees to IPC 600G, and increased its training program and its inspections of the company’s PCB manufacturing partners.

Details: Written by Staff; Category: Fab News; Published: 20 June 2008

BOTHELL, WA -- Neah Power Systems, Inc., developer of fuel cells for military, industrial and consumer portable electronic devices has selected Sanmina-SCI Corporation for its engineering development and manufacturing support in commercializing its silicon based fuel cell systems.

Details: Written by Staff; Category: Fab News; Published: 20 June 2008

TAIWAN - Industry reports have stated that Nan Ya PCB is expected to see utilization rates reach 95% in the third quarter, with Intel's 45nm process substrates accounting for over half of the company's production.

The peak season that typically occurs in the second half of the year is expected to help stabilize the company's average selling prices.

Industry reports indicate that the company is expected to see sequential revenues increase 5% for the second quarter, and up to 15% for Q3, while gross margin will increase to 22% in the second quarter and to 25% in the third.

PYUNGTAEK-CITY, KOREA - The InkTec Co. and Thin Film Electronics ASA have announced that they have extended their joint development agreement (JDA) signed in November 2007 and will begin production of printed memory circuits.

CHANDLER, AZ - The Rogers Corporation has appointed Michael D. Bessette to head its Advanced Circuit Materials Division (ACMD) effective July 10, 2008.

A 33-year veteran of Rogers Corporation, Bessette previously worked at Rogers’ R&D department in Connecticut, and also in Japan, where he headed up Rogers’ joint venture with INOAC Corporation, manufacturing elastomer materials. Bessette has been responsible for the Durel Division’s global electroluminescent backlighting business for the past five years.

"Mike Bessette brings his extensive experience in R&D... to the Advanced Circuits Materials Division at a critical time, as we strive to accelerate the division’s growth and product diversification." said Robert Wachob, president and CEO.

Bessette holds a B.S. degree in Chemical Engineering from Northeastern University and an M.S. degree in Chemical Engineering and Polymer Science from the University of Connecticut.