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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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Design News

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Category: Design News

KARLSRUHE, GERMANY – Altium promoted Martin Harris to chief sales officer. Read more ...

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Category: Design News

MUNICH – Zuken has named Humair Mandavia executive director of its new SOZO Center in San Jose, effective immediately. Mandavia will lead Zuken’s effort to collaborate with customers and the design community to provide more timely and targeted solutions for their increasingly complex product development requirements. Read more ...

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NEW YORK -- BitSyncom is planning a contest to create an open source printed circuit board design for its second-generation ASIC chips. The new chips will use a 55nm technology and reportedly will run four times as fast as the firm's first-generation 110nm chips. The winner will receive 5,000 chips, totaling 7.5 TH/s overclocked. Read more ...

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LONGMONT, CO -- Eric Bogatin will teach several classes on signal integrity in San Jose next month. Among them: Read more ...

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SANTA CLARA, CA -- PCB West, the Silicon Valley's largest trade show for the printed circuit board industry, opens today at the Santa Clara Convention Center. Pre-show conference registration is up 40% over last year while preregistration for the exhibition is up 30%.

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SANTA CLARA, CA -- Agilent Technologies will split into two publicly traded companies, one focus on life sciences, diagnostics and applied markets and the other on electronic measurement products. The breakup is scheduled to be completed by the end of 2014.

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