WILSONVILLE, OR -- Mentor today announced the launch of a consortium to drive new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer IC designs.

Read more ...

CHELMSFORD, MA -- EMA Design Automation and Cadence will sponsor a two-hour luncheon tutorial on the newest features in the OrCAD 17.2 PCB design software next month.

Read more ...

SAN RAFAEL, CA – Computer-aided design software firm Autodesk reported fiscal first quarter revenue of $486 million, down 5% year-over-year.

Read more ...

DANBURY, CT – Amphenol RF released its first set of Ansys HFSS 3D component models. These 3D models, compatible with Ansys R17 or any newer version of the software, are available free on the company website

Read more ...

NORWOOD, MA – Artech House has published High-Speed Circuit Board Signal Integrity, Second Edition by Stephen C. Thierauf.  

Read more ...

ATLANTA – UP Media Group Inc. today announced registration is open for PCB West 2017, to be held Sept. 12 - 14 in Santa Clara, CA.

Read more ...

Page 13 of 233