WILSONVILLE, OR -- Mentor today announced the launch of a consortium to drive new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer IC designs.

CHELMSFORD, MA -- EMA Design Automation and Cadence will sponsor a two-hour luncheon tutorial on the newest features in the OrCAD 17.2 PCB design software next month.

SAN RAFAEL, CA – Computer-aided design software firm Autodesk reported fiscal first quarter revenue of $486 million, down 5% year-over-year.

DANBURY, CT – Amphenol RF released its first set of Ansys HFSS 3D component models. These 3D models, compatible with Ansys R17 or any newer version of the software, are available free on the company website.