Design News

BANNOCKBURN, IL – IPC has named Kevin Schuld director of assembly technology. He will be responsible for working with technical committees on standards development in the assembly technology area.
 
Schuld has over 20 years of experience within the electronics industry, having held various quality, evaluation and component engineering positions for companies such as Hitachi, Texas Instruments and Honeywell. Most recently, he was the senior customer quality engineer at Qualcomm CDMA Technologies.
 
“Kevin has well-rounded experience in customer quality management, statistical process controls, component and materials engineering and technical writing, not to mention that he’s well-versed in IPC’s assembly standards,” said Dave Top, IPC vice president of standards and technology.
AUSTIN, TX – National Instruments (NI) has named three trends that it believes will improve the efficiency of test and measurement systems in 2009.

Read more ...
PITTSBURGH, PA -- DesignAdvance Systems, Inc. has introduced a concept level planning tool for the hardware engineer. According to the company, CircuitPlan provides planning, feasibility and design collaboration capabilities from concept level planning through physical design and test.

"Our customers have been actively deploying our solutions [CircuitSpace and CircuitProbe] throughout their PCB design process," stated Mr. Edward Pupa, DesignAdvance CEO. "Now with CircuitPlan, we provide PCB designers, hardware engineers, test engineers and manufacturing engineers with solutions and an advanced methodology for planning, physical design, review / verification," continued Mr. Pupa.

CircuitPlan v1.0 will be available in February 2009.

WILSONVILLE, OR – Dr. Walden Rhines, chairman and CEO of Mentor Graphics Corp., will be the keynote speaker at DesignCon 2009, held February 2-5 in Santa Clara, CA.
 
In his address, Dr. Rhines will discuss issues confronting the EDA industry during these uncertain economic times. He will also offer provocative conclusions based on historical data and trends within the industry. The keynote will take place February 3, 11:50 a.m. to 12:30 p.m.
EDINA, MN – SMTA has issued a call for 2009 abstracts for four educational conferences.
 
The International Conference on Soldering & Reliability takes place May 20-22 in Toronto. The deadline for abstracts is Jan. 16. (Contact This email address is being protected from spambots. You need JavaScript enabled to view it. to request an extension.) Visit http://www.smta.org/education/education.cfm#toronto for more information.
 
The International Wafer-Level Packaging Conference takes place Oct. 29-30 in Santa Clara, CA. The abstract deadline is Mar. 17. Visit http://www.iwlpc.com/call_for_papers.cfm.
 
The AIMS Harsh Environment Electronics Symposium takes place in conjunction with SMTAI in San Diego, Oct. 5-6. The deadline for abstracts for both is Mar. 27. Visit http://www.smta.org/education/education.cfm#aims and http://www.smta.org/smtai/call_for_papers.cfm to view the complete call and to submit an abstract.
SAN JOSE, CA -- The EDA Consortium announced that EDA industry revenue fell 10.9% to about $1.3 billion for the third quarter of 2008 and the four-quarter moving average declined 2.8%.

Read more ...

Page 270 of 321