SAN JOSE, CA — Avishtech, the leading provider of PCB simulation solutions, today announced the formal launch of its lab materials services and consulting. The combination of state-of-the-art equipment and the deep knowledge and insight of the company’s materials science experts delivers a new level of information and expertise previously not available to the industry. In addition, access to these services is enabled through an easy-to-use interface on the company’s website or by directly emailing This email address is being protected from spambots. You need JavaScript enabled to view it.; most information is available with 24-48 hours of request and the results include not only the test data but the interpretation of it as well. Avishtech’s experts are only a phone call away during the testing process and the focus is on delivering the correct information in the timeliest manner possible.
Keshav Amla, Founder and CEO of Avishtech notes, “With today’s increasingly tight PCB design parameters, the more information that product developers have up front, the better. In addition, today, there are so many more aspects of materials characteristics and performance traits that influence the operability, reliability and life cycle of a final design than can be found in the typical data sheets provided by materials suppliers. In our state-of-the-art lab, we are able to test for these properties in a highly accurate and repeatable manner and can provide the highest degree of confidence in relating these base properties to results in the real hardware.”
With more companies employing MBSE (models-based-system engineering) design methodologies, there is a greater need for complete and correct information in digital format that will lead to an optimized design that addresses all of the steps in the product development process---from design to the downstream processes of manufacturing, assembly, test, field repairs and product life cycle.
Amla adds, “In an MBSE environment, the focus is on the systematic gathering and reporting of critical design information in the shortest amount of time possible in digital format. Very few, if any, companies will have the capabilities in-house to provide all of the materials performance information in an accurate and timely manner. With the services that we offer, we become an extension of our customers’ design team and we provide a vast amount of information in a clear and concise manner, for a very reasonable price, in the shortest amount of time possible.”
Services provided through Avishtech’s labs include, among others:
Dk/DF Testing
Thermomechanical Analysis (TMA) Z-axis or X/Y Expansion and Tg
Dynamical Mechanical Analysis (DMA) – Tensile or Flexural Modulus and Tg Testing
Rheology Testing
Press Cycle Design/Development
Cure Kinetics Studies
Aging Studies / Shelf-Life Testing
Surface Roughness Characterization
Fourier Transform Infrared Spectroscopy (FTiR)
Thermogravimetric Analysis
Fabrication of special samples for testing in shear
Multicircuits, located in Oshkosh, WI, a small and large quantity and high quality circuit board manufacturer, along with IEC, are pleased to announce the purchase of a brand new ModVIA Expandable Plasma System from Nordson Electronics Solutions.
The ModVIA Expandable Plasma System combines the best in class technology of the VIA Series while retaining the PCB Series size and function. Using MARCH’s High Flux Electrode design, the ModVIA system is capable of uniform plasma treatment for PCB panels, as well as desmear and etchback, and can process rigid and flexible panels.
Nordson Electronics Solutions – For over 30 years Nordson Electronics Solutions has been the global leader in plasma cleaning and plasma surface treatment equipment, and plasma applications technology. Known as Nordson MARCH since 2009, the organization has broad experience advanced semiconductor packaging and assembly, wafer level packaging, printed circuit board manufacturing, life science and medical device assembly, and various large-scale industrial applications.
International Electronic Components (IEC) – IEC is the longest serving distributor of consumables, equipment, and services in the North American printed circuit board industry for over 50 years. IEC has established themselves as a dependable, responsive organization with locations in Toronto, Canada, Santa Clara, CA, Chicago, IL, and Norristown, PA. IEC works closely with its suppliers and customers in order to provide best-in-class service across North America.
Multicircuits Inc. – Since 1990, Multicircuits Inc. has been committed to providing high quality PCB backed with superior customer service. Offering prototyping, fast turnaround, and full production runs of single-sided to multi-layer boards and capable of low and high output, Multicircuits is capable of supplying PCB needs for nearly any application.
BANNOCKBURN, IL — IPC's Validation Services Program has awarded an IPC-4103 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper-clad laminates, and prepregs to the global electronics industry. To earn this QPL, TUC successfully qualified their laminate product, TU-1300N, to IPC-4103B, Specification for Base Materials for High Speed/High Frequency Applications.
TUC was not only the first in achieving a QPL to IPC-4103, but also earned the first QPL to IPC-4101, Specification for Base. Materials for Rigid and. Multilayer Printed Boards, more than five years ago.
TUC met or exceeded the IPCs Validation Services QPL requirements for producing materials used by printed circuit board manufacturers in the electronics industry. Thus, the company is now listed as an IPC trusted source capable of manufacturing in accordance with industry best practices. TUC and other trusted suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database at www.ipcvalidation.org.
“Being a trusted supplier to IPC-4103 means that TUC has met the highest standards for production and quality in this leading-edge market,” said George Hsin, chief strategy officer of Taiwan Union Technology Corporation. “PWB suppliers made this QPL their first screen when selecting base materials for IPC-4101 and now we are a trusted supplier for IPC-4103 as well.”
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.
“TUC has differentiated itself from the competition by becoming part of IPC's global network of trusted industry sources," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize TUC as the first world member of trusted QPL suppliers to meet IPC-4103.”
For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at This email address is being protected from spambots. You need JavaScript enabled to view it. or +1 847-597-2806.
AUSTIN, TX — TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the role of hybrid bonding.
Chiplet architectures are increasingly being adopted to achieve the economic advantages lost with the high cost of silicon scaling on advanced nodes. With chiplet designs, more silicon is needed to support the disaggregation of the monolithic die into smaller intellectual property (IP) building blocks. Many devices have made the conversion from solder bumps to Cu pillar. FO-WLP processes in production using the Deca M-SeriesTM and TSMC’s InFO use a Cu pillar on the native wafer. Reduced demand for smartphones and PCs this year is changing demand for flip chip packages, but growth will continue. The compound annual growth rate (CAGR) for all types of flip chip devices in units from 2021 to 2026 is 4.5 percent. This includes both solder bump and Cu pillar. Industry-wide capacity utilization was extremely high last year, but has decreased more than 10 percent this year. With continued capacity expansion, utilization will not reach levels seen in 2021 over the next several years.
Despite lower demand for consumer products such as smartphones, Fan-in WLP shipments will increase this year because of continued growth in image sensor demand, particularly for surveillance cameras in China. The WLP count continues to climb for most products. In a few cases, WLP counts have declined in products due to higher levels of integration. The projected CAGR from 2021 to 2026 in units is 7.83 percent. Devices using FO-WLP include application processors, RF, PMICs, audio CODEC, envelope trackers, automotive radar, and some image sensors. Single die are common and multi-die configurations are increasing. A 6.3 percent CAGR in units is projected for 2021 to 2026. Several companies are researching, developing, or installing panel-based production lines. A variety of approaches for large-area production have been developed. No consistent method or panel size has emerged, but several companies have adopted panel sizes of 600 mm x 600 mm. While applications for panels include some portion of the reconstituted wafer market, new applications such as power devices are emerging.
The latest analysis is a 106-page report with full references and an accompanying set of ~140 PowerPoint slides. TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 22,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.
PLANO, TX ― Super PCB , a single source for high quality printed circuit boards (PCBs), announced the appointment of Mike Young, Aligned Solutions, Inc. as its distributor for the following states in the Midwest: Missouri, Minnesota, North Dakota, South Dakota, Kansas, Nebraska, Western Iowa and West Virginia. Mr. Young provides sales and support for Super PCB’s quality PCBs.
Aligned Solutions has been providing information, equipment, materials and services in the Midwest since 1976. In almost five decades in the Midwest, Aligned Solutions has seen the industry change along with the landscape of manufacturing. This has created a different climate for how manufacturing works and how to best support the industry, not to mention how to be a successful rep firm.
Young has more than 30 years of experience in the electronics industry and another six years as a weapons technician in the U.S. Navy with an affiliation to electronics. From the Navy, Young went to Electrovert. For more than 25 consecutive years, he's worked as a manufacturing representative for KDF Company and Aligned Solutions.
Since 2003, Super PCB has been providing the best value in the PCB industry by offering competitive pricing at the highest quality and best-in-class customer support.The team at Super PCB’s mission has been and remains to be the only PCB source that its customers ever need. The company serves the telecom and Wireless, Transportation, Industrial, Medical, Lighting, Consumer Electronics, Energy and IOT industries.
Super PCB offers USA manufacturing to support fast-turn and ITAR requirements, as well as overseas manufacturing facilities to support you prototype and mass production to lower costs. The company’s manufacturing facilities are ISO 9001 certified and UL listed. Super PCB’s state- of-art equipment and technology ensures the highest quality and efficiency.
For more information about Super PCB, email This email address is being protected from spambots. You need JavaScript enabled to view it., call (214) 550-9837 or visit www.superpcb.com.
WALTHAM, MA — Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, has signed an agreement with Tethon Corporation Inc. (“Tethon 3D”) to develop new materials for its Fabrica 2.0 micro-additive manufacturing system (“micro-AM”).
The agreement is focused on materials with high-performance and specialty specifications, including high temperature, transparent, and carbon nano tubes.
Development of materials, along with breakthroughs in deep learning-based AI and releasing next-generation systems across Nano Dimension’s manufacturing solutions portfolio, are critical in the Company’s ambitious R&D roadmap. The Company welcomes another breakthrough going according to plan.
“Our customers have been asking for a micro-AM platform to manufacture production parts,” said Trent Allen, Chief Executive Officer of Tethon 3D. “The Fabrica 2.0 is a modern marvel of engineering and our material scientists have loved innovating with the platform to create novel materials.”
“We value our relationship with Tethon 3D and are very impressed with the progress they are making thus far,” said Dr. Jon Donner, Product Champion for the Fabrica 2.0. “The development of these materials should further open markets and applications such as electrical connectors, medical devices and microfluidic chips amongst others.”
Nano Dimension (12.1, C119) and Tethon 3D (12.1, A131) will both be highlighting parts at the upcoming Formnext Exhibition in Frankfurt, Germany, November 15-18. Learn more about the Formnext exhibit at https://formnext.mesago.com/events/en.html.
