WALTHAM, MA — Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that it has delivered the Admaflex130 Evolution, which is the first of its next generation high precision ceramics and metal fabrication system, to the Karlsruhe Institute of Technology (“KIT”), one of the leading technical universities in Germany and Europe.

This sale is a clear demonstration of the benefit of Nano Dimension’s merger and acquisition program with the sale coming from Admatec Europe B.V., the newest group to join Nano Dimension. The relationship with KIT deepens the Company’s success of its extensive customer relationships with the world’s leading academic institutions.

KIT is among the largest and most notable German institutes of technology, with its research covering many areas within engineering and natural sciences. The Admaflex130 Evolution will be used by the Institute of Photonics and Quantum Electronics (“IPQ”) at KIT. IPQ is striving to deliver cutting-edge research in fields ranging from hybrid photonic integrated circuits, additive 3D nanofabrication, optical metrology and sensing to optical communications and signal processing.

Nano Dimension’s Admaflex130 Evolution is a leader in manufacturing high precision ceramics and metal applications. With the benefit of its Digital Light Processing (“DLP”) based technology, the 3D printer is ideal for research & development and 24/7 digital serial production of functional parts requiring complex geometries, high resolution, fine details, and smooth surface while benefiting from excellent material properties.

Pascal Maier, researcher at KIT, shared, “We are excited to have the Admaflex130 Evolution in our labs. For the packaging of integrated photonic circuits, we need submounts for our assemblies that offer highest shape fidelity along with low thermal expansion and good long-term stability. To achieve this, we need leading technologies to advance our work, and this is exactly what the Nano Dimension system can do. We look forward to using it in our daily work.”

Ziki Peled, President of Nano Dimension EMEA, added, “We appreciate the opportunity to enable the advanced work of the Karlsruhe Institute of Technology, and specifically the Institute of Photonics and Quantum Electronics. Given Nano Dimension’s focus on multi-material, high precision additive manufacturing, we are confident that our solution in the Admaflex130 Evolution will enable progress in their research, which is clearly intended to drive advancements in society.”

CHANDLER, AZ — Rogers Corporation (NYSE:ROG) ("Rogers") today announced the appointment of Larry Schmid as Senior Vice President, Global Operations and Supply Chain. In this role, Mr. Schmid will direct the operational and supply chain organizations across Rogers’ global operations, including in the U.S, China, Belgium, Germany, England, South Korea and Hungary. He will also implement Rogers’ ongoing operational excellence initiatives to improve financial performance.

"We are pleased to welcome Larry to Rogers and benefit from his more than 20 years of experience in global manufacturing operations and supply chain management," said Colin Gouveia, President and Chief Executive Officer of Rogers. "Operational excellence is a key pillar of our strategic plan, and Larry will play a leading role in sharpening our operational focus across the organization to systematically lower costs and improve profitability."

"I am thrilled to join Rogers, a proven industry leader, at an exciting time in its transformation and with so much opportunity ahead," said Mr. Schmid. "I look forward to working with Colin and the rest of Rogers’ senior leadership team to optimize our manufacturing, drive operational performance and improve supply chain efficiency."

About Larry Schmid

Mr. Schmid has more than 20 years of senior executive leadership in global manufacturing operations and supply chain management. He joins Rogers from Pilko & Associates, LP, a leading operations consultancy advising senior leaders in chemical, energy and related industries, where he most recently served as President. Previously, he held various international operations roles at Dow, including serving as a member of the Senior Operations Leadership Team and managing five Dow businesses that generated a total of $10 billion in revenue. Prior to Dow, Mr. Schmid held senior operational positions at Rohm and Haas. He holds a B.S. in Chemical Engineering from the University of South Florida.

SANTA CLARA, CA ― Averatek is pleased to announce that Director of Advanced Process Development Gus Karavakis will present “Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process” at the IPC APEX Expo Technical Conference, January 24-26, 2023 in the San Diego Convention Center. The technical paper was co-authored by Mike Carano, IPC Technology Roadmap Committee Chair and member of the Board of Directors.

The drive to miniaturization makes the smaller footprint of stacked vias more desirable in terms of routing and design efficiency than staggered vias. However, there is evidence that stacked vias are prone to latent failures after exposure to thermal stress of conventional surface mount technology (SMT) reflow processes. This issue is broadly defined as a weak interface between the plated copper and the blind via target pad. When thermally stressed, the generally weak interface will fracture, especially during forced-convection assembly reflow.

While many studies of microvia interfacial fracture focused on conventional electroless copper as the plated through-hole (PTH) choice, no recent studies measured the reliability of stacked microvias with a semi-additive process (SAP) using a liquid metal ink as the catalytic layer.

This novel catalytic ink promotes a tightly adherent and ultrathin electroless copper deposit. The lower thickness enables much finer line spaces and trace widths than conventional subtractive- etch or modified semi-additive processes (mSAP). Liquid metal ink technology enables capability for 5micron lines and spaces; the tighter line width control will benefit the impedance control.

To measure reliability of the liquid metal ink process, test vehicles were constructed and subjected to Thermal Shock and Thermal Stress testing, according to protocols in IPC-TM-650 Test Method 2.6.27B. Complete results of this study will be covered in the presentation. Test results indicate that the liquid metal ink process provides long-term reliability on two-stack blind vias, while offering distinct functionality advantages beyond conventional subtractive and mSAP processes.

Gus Karavakis has over 30 years of industry experience, with special expertise in advanced processes, additive technologies, IC Packaging and substrates, flex and rigid-flex PCB manufacturing and materials. He is the author/co-author of more than 80 patents, and holds a BE in Chemical Engineering from CCNY with an MS in Chemical Engineering from Columbia University.

WILMINGTON, DE – DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will exhibit (Booth #341) at the 2023 edition of the Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 24 - 26, 2023.

This show is attended by North America’s largest audience engaged in electronics manufacturing. At IPC/APEX, DuPont ICS will engage with PCB fabricators, designers, OEM’s and EMS companies, showcasing its portfolio of innovative, more sustainable metallization, dry film and flexible circuit material solutions for the PCB industry. The ICS portfolio also includes thermal management and electromagnetic shielding solutions from the recently added Laird Performance Materials.

According to Erik Reddington, ICS West Commercial Leader for Metallization & Imaging, and Laminates, IC substrates are expected to be the fastest growing segment of the PCB industry in the coming years. Reddington says the changing technology in printed circuit boards is moving toward smaller vias and finer lines, along with a desire for more sustainable solutions. He says DuPont has continued to innovate and invest in new technologies to address the needs of the PCB industry, becoming the leading total solutions and systems design partner addressing signal integrity and power transmission challenges while taking care of both people and the planet.

Reddington added that DuPont has been the preferred flexible laminate solution provider for more than 40 years. He said DuPont is offering the widest array of PCB construction options which is helping to drive device speed and reliability – enabling a range of applications from 5G connectivity to autonomous vehicles.

DuPont’s recently completed $250 million Kapton® polyimide film manufacturing expansion in Circleville, Ohio is a further illustration of its commitment to expanding printed circuit board manufacturing in the United States and Europe. DuPont has joined the Printed Circuit Board Association of America (PCBAA), the consortium of U.S.- based companies that support U.S. domestic production of printed circuit boards. Reddington said DuPont is using that involvement to better under the needs of the domestic PCB industry and develop solutions to enable next generation material advancements.

During the show, Reddington will address customers and show participants with a presentation on DuPont’s 2023 commitment to the PCS industry. The remarks will be presented on Tuesday, January 24th at 2 PM and Wednesday, January 25th at 3:30 PM at the DuPont booth on the exhibition floor.