RÖDERMARK, GERMANY – A new A-RMXY2-60S-CCD from Schmoll Maschinen GmbH has been installed at Ilfa's manufacturing facility in Hanover.
With its new Schmoll unit, the company will realise high-precision depth milling with a tolerance of +/- 5 µm. A high-resolution CCD camera is used for optical registration, which automatically detects a wide variety of surfaces such as copper, tin or gold.
The system has an automatic loading and unloading system, and the drilling and milling machine performs its tasks autonomously – up to 10 different product configurations can be run. The drilling or milling depth is controlled by an integrated measuring system in the Z-axis motor.
"Thanks to the high precision in depth milling, the machine supports us specifically on our technological growth course, which envisages investments in the double-digit millions for the Hanover location. In the first step, the drilling and milling machine will support us in the production of printed circuit boards for sensitive medical technology," the company writes in the press release.
PITTSBURGH – Deepening its commitment to democratizing simulation, Ansys (NASDAQ: ANSS) announced the launch of the Ansys Developer portal to make tools for developers more accessible —the new digital space will better enable the Ansys ecosystem and connect users and Ansys experts in all areas of simulation.
The Ansys Developer portal brings together developer tools from the entire Ansys portfolio into a single hub with documentation, examples, guides, and use cases. The portal equips users to accelerate their work by extending simulation workflows across the Ansys portfolio. It also includes a community forum for customers, partners, and internal developers to collaborate, share ideas, ask questions, and suggest features while providing direct access to open-source initiatives like the PyAnsys project Python libraries.
Ansys is committed to providing customers with the tools needed to speed innovation and achieve goals. By simplifying and streamlining the availability of this set of resources, Ansys is enabling engineers, architects, and developers to better design new solutions for automating repetitive and complex simulations and workflows across physics and engineering domains. Facilitating access to these resources through the portal will significantly reduce the time required to complete tasks and minimize the potential for errors. The portal is a key foundation for building new solutions in simulation, including those used to train artificial intelligence/machine learning (AI/ML) models.
Customers across all industries will benefit from the tools and support provided by the Ansys Developer portal. For example, Danfoss, a market-leading company delivering an extensive range of products and solutions across three business segments, is focused on empowering its customers to decarbonize through energy efficiency, machine productivity, low emissions, and electrification.
"Ansys' robust ecosystem of developer tools empowers our engineers to automate shared workflows, combine different tools, and democratize simulation for all team members to use," said Jakob Harming, a lead system simulation engineer at Danfoss. "Having access to Ansys tools provides us with a common framework to easily create apps, set up and run simulations, and create reports. Additionally, having to learn only Python is a huge advantage since most graduates have a basic understanding of it."
"The Ansys Developer portal will bring our developer tools and enablement together, into a single environment for collaboration, shared learning, and innovation," said Shane Emswiler, senior vice president of products at Ansys. "With this platform, we can grow and nurture Ansys' developer ecosystem and greatly improve the experience by providing easier access to relevant tools, resources, and technical support."
OSLO, NORWAY – CONFIDEE are proud to announce the appointment of Andrea Queirolo as Sales Manager Italy. This strategic move is aimed at expanding the company’s reach in the European market.
“We are thrilled to further expand our presence in Europe and welcoming Andrea to our team. With his extensive experience and industry knowledge, we are confident that he will be an invaluable asset to our company as we continue to grow and serve our customers as a trusted PCB partner, protecting the supply chain,” says CEO Vidar Olsen.
His experience in the PCB industry spans over three decades, positioning him as one of the most experienced figures in the Italian market. Queirolo brings a wealth of knowledge and expertise to the team. He will be responsible for driving growth and strengthening relationships with customers in Italy.
“I am excited join the company and contribute to increase the business in Italy. CONFIDEE is founded on solid values with a focal point on compliance, however the focus is always to be the strongest partners for our customers, providing them with the best possible PCB solutions, helping them achieve their business goals”, said Queirolo.
In his new role, Queirolo will work closely with customers to identify their specific needs and provide them with compliant PCB solutions that meet their unique requirements. He will also be responsible for building and maintaining relationships with key industry players and identifying new opportunities for growth.
BRUSSELS, BELGIUM – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry. The European Parliament, Commission and Council forged the agreement in Strasbourg, France.
In the year since the landmark legislation was drafted, the European Chips Act has become a strategic centerpiece of Europe’s industrial ambition. The legislation aims to facilitate the continent’s digital and green transition by strengthening its semiconductor industry production capacity. A strong supporter of Europe’s economic growth, SEMI Europe expects the EU Chips Act to help Europe increase its global semiconductor manufacturing share to 20% in the next decade.
The legislation includes a crisis response provision through which the European Commission will assess risks to the European Union’s semiconductor supply and publish early warning indicators in member states that might trigger EU-wide chip shortage alerts.
“The European Chips Act is a significant step forward for the semiconductor industry in Europe with robust investments to help strengthen manufacturing and the resiliency of global supply chains,” said Ajit Manocha, SEMI President and CEO. “In addition, the Act will enable cohesive strategies to grow Europe's talent base and ensure the region remains at the forefront of innovation.”
“Now is the time to invest in the semiconductor sector in Europe,” said Laith Altimime, President of SEMI Europe. “The European Chips Act strengthens the continent’s appeal as a destination for semiconductor industry investment and lays the groundwork for the growth of the entire ecosystem. The act will help create a more favorable environment for chip industry investments in Europe and promises to spark greater innovation.”
The European Chips Act is a cornerstone of efforts to strengthen Europe’s competitiveness in building chips and expand innovation in the design, manufacturing and packaging of chips. The act will also enable Europe to deepen its understanding of global semiconductor supply chains and address the skills shortage.
“SEMI looks forward to the implementation of the European Chips Act, which is crucial to strengthening Europe’s semiconductor competencies across the entire value chain,” said Christopher Frieling, Director of Advocacy and Public Policy at SEMI Europe.
Visit SEMI Global Advocacy to learn more about its public policy efforts and the latest developments. Go to SEMI Workforce Development for information on how SEMI is addressing the microelectronics industry’s talent needs.
CHANDLER, AZ – Rogers Corporation (NYSE:ROG) will exhibit at the Del Mar Electronics & Manufacturing Show April 26 th & 27 th at the Del Mar Fairgrounds in San Diego, CA (booth #622). High performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials are being highlighted along with Radix™ 3D Printable Dielectrics.
Highlighted Products:
Recently introduced Radix™ 3D Printable Dielectrics family of products, is the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Radix 3D Printable Dielectrics are proprietary composite materials designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
CLTE-MW™ laminates now include lower profile and thinner copper foil options to better serve the needs of designers and PCB fabricators producing millimeter wave PCB circuit designs. The new hyper very low profile (HVLP) ED copper cladding reduces insertion loss of transmission lines operating at 77 GHz by about 20% compared to standard ED copper foil. Additionally, the new HVLP copper cladding option is available in 9 µm, 18 µm and 35 µm thicknesses. These additional copper thickness options provide PCB fabricators more flexibility to achieve tight feature tolerances on signal layers, particularly with sequentially laminated designs.
These laminates are well suited for a range of applications including millimeter wave automotive and industrial radar antennas, 5G millimeter wave base stations and backhaul radios, and phased array radar systems.
SpeedWave® 300P Ultra-Low Loss Prepreg. With the increasing need for stackup flexibility in high layer count designs for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs, SpeedWave 300P prepreg offers a broad range of competitively priced high performance options for the circuit designer. SpeedWave 300P prepreg can be used to bond a variety of Rogers’ materials including XtremeSpeed™ RO1200™, CLTE-MW™, and RO4000® series laminates.
This prepreg system offers a low dielectric constant of 3.0 – 3.3 and a low dissipation factor of 0.0019 – 0.0022 at 10 GHz with stable performance over a broad frequency range. This material is offered in multiple spread and open weave glass styles and resin content combinations to maximize stackup options.
RO4000® Products for Multilayer Structures:
Next generation products designed to meet the existing and emerging needs of advanced millimeter wave multilayer designs. RO4835T™ laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and they complement RO4835™ laminates when thinner cores are needed.
RO4450T™ 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials were designed to complement RO4835T laminates and the existing RO4000 laminate family, and come in 2.5, 3, 3.5, 4, 4.5, 5 or 6 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z-axis expansion for plated through-hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bondplys have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
RO3003G2™ high frequency laminates build on Rogers’ industry-leading RO3003™ platform to provide designers with improved insertion loss and reduced Dk variation. The combination of Rogers’ optimized resin and filler content along with the introduction of hyper very low-profile ED copper (HVLP) translates to Dk of 3.00 @ 10 GHz (clamped stripline method) and 3.07 @ 77 GHz (microstrip differential phase length method). RO3003G2 laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension”, “NANO” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, today responded to the statement released by Stratasys Ltd. (Nasdaq: SSYS) on April 18th, 2023:
“It is disappointing that Stratasys has resorted to sowing misinformation and falsehoods in its rebuff of Nano Dimension’s acquisition offer that would provide immediate and certain cash payment at a compelling premium to share price to Stratasys shareholders.
COURT RULED: NANO CAN COMPLETE THE STRATASYS ACQUISITION:
These claims are nothing more than a desperate attempt to mask the Board’s clear entrenchment and efforts to mislead shareholders. The facts speak for themselves.
The Israeli court’s ruling vindicated Nano Dimension’s position that its Board of Directors has the full authority to continue to lead and govern the Company as they have been, including as it relates to Nano Dimension’s proposed acquisition of Stratasys.
Clearly the Stratasys' board members are trying to exploit the court decision in order to interfere with the Company's intention to initiate a Special Tender Offer to the shareholders of Stratasys in order to preserve their position as board members. In its ruling from April 16th, 2023, the district court in Lod, Israel, rejected Murchinson’s motion and stated explicitly that Murchinson’s motion “whereby the Company will not be allowed to take any action that is not in the ordinary course of business… will harm the Company in an excessive way” and explicitly mentioned the completion of the Stratasys transaction as an example where such a restriction cannot be accepted.
The Company has a clear and full authority to take actions that are not in the ordinary course of business including the Stratasys transaction and any claim made to the contrary by Stratasys is false and misleading.
MURCHINSON & ANSON’S ILIGAL ACTIONS:
The Company intends to appeal against the appointment of the two observers. The fact remains that Murchinson and Anson’s sham vote was illegitimate and invalid. Nano Dimension is appealing to the Israeli Supreme Court to block the Court’s temporary appointment of the two Murchinson observers, which is not for the best interest of the Company and its shareholders; those observers have one goal – to interfere with the Company’s business affairs and transactions and as a result harm the interests of the Company’s shareholders. Murchinson’s aggressive action to call an illegal shareholders meeting should not be rewarded with an appointment of two observers, where other shareholders do not enjoy the same right.
Murchinson and Anson’s Invalid Meeting Results Demonstrate Nano Dimension Shareholders’ Lack of Interest in their Agenda: Over 90% of Nano Dimension shares, excluding those owned by Murchinson or Anson, either voted against Murchinson’s nominees or took no action. In other words, excluding their own shares, Murchinson and Anson garnered support representing less than 9.5% of shares voted. The embarrassingly low voter turnout is proof that Nano Dimension shareholders will not be coerced by an actor who the Company believes is solely interested in making a quick profit at the expense of substantial potential long-term value for other shareholders.
“IT’S TIME TO ALLOW STRATASYS SHAREHOLDERS TO HAVE THEIR SAY:
Nano Dimension will continue to proceed towards acquiring Stratasys as it prepares for an all-cash special tender offer at $18.00 per share, which would allow shareholders to choose for themselves and receive a significant and immediate premium for their shares.”
