CAMBRIDGE, UK – Can digital and/or high throughput manufacturing be applied to circuit boards? Can stretchable electronics be produced without sacrificing processing capabilities? Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that aims to resolve both of these questions. By combining aspects of printed and conventional electronics, specifically conductive inks patterned on a flexible substrate with mounted components such as integrated circuits (ICs), it represents a compelling 'best of both worlds' solution.
Matching Value Propositions to Applications
At its core, FHE is an alternative approach to circuit manufacturing. As such, FHE circuits can, in principle, be used wherever comparatively simple PCBs are needed (i.e., not complex multilayer circuits). Of course, replacing an established incumbent technology requires a compelling advantage that is typically application-dependent - do not expect FHE circuits to displace the PCB in most consumer electronics anytime soon.
Relative to existing flexible PCBs, FHE offers 3 distinct value propositions: Additive digital manufacturing, conformality/stretchability, and compatibility with roll-to-roll (R2R) manufacturing. The key to successful commercialization is finding a product-market fit where one or more of these value propositions either justifies switching or to facilitate a new application that would not otherwise be possible.
Additive Digital Manufacturing
Since conductive ink can be printed using digital methods such as inkjet or the emerging laser-induced forward transfer (LIFT), FHE enables additive digital manufacturing. FHE is thus well suited to prototyping and very high-mix low-volume (HMLV) manufacturing - it could also potentially be deployed to facilitate versioning and even 'mass customization', the latter of which is difficult to envisage without digital manufacturing.
Additive manufacturing is less wasteful than more established subtractive approaches and is thus especially advantageous when components and, hence, conductive traces are widely spaced. One such example is mounting LEDs on sheets for large area lighting, which can also be produced by R2R manufacturing.
Conformality/Stretchability
Conformality/stretchability is a key value proposition of FHE. Whereas flexible PCBs often employ rigid islands for mounting packaged ICs and other rigid SMD components, FHE circuits can be more flexible since many components (e.g., sensors) can be printed. Furthermore, conductive inks that are either stretchable or can withstand bending enables a shorter bending radius and even stretchability.
The flexible (and potentially stretchable) form factor makes FHE ideally suited to wearable technology, including electronic skin patches and e-textiles since it improves wearer comfort relative to the current rigid boxes that contain conventional electronics. Challenges include washability and sustainability concerns relative to reusable rigid electronics mounted within a removable box.
R2R Manufacturing
For large-volume manufacturing, conductive traces can be printed using rotary analog methods such as flexography, gravure, and rotary screen printing. This enables very rapid deposition via R2R manufacturing, reducing costs. Cost benefits are especially significant if traces can be printed onto existing surfaces (such as packaging labels), eliminating the need for a dedicated structure.
Given the large volumes required and relatively low value-add per item, minimizing costs is essential for electronics to be adopted for smart packaging/RFID. While most RFID tags currently use stamped aluminum foil for antennas, printing with copper inks will reduce costs and improve sustainability. R2R FHE production is forecast to expand to more sophisticated smart packaging circuits with greater functionality, such as sensing.
Comprehensive Insight
IDTechEx's report "Flexible Hybrid Electronics 2024-2034" evaluates the status and prospects of FHE circuits, which we forecast to reach a market size of around US$1.8 billion by 2034 - more if the associated infrastructure, software, and services are included. Drawing on years of following the printed electronics industry and 40 interview-based company profiles, the report outlines trends and innovations in the materials, components, and manufacturing methods required. It explores the application sectors where FHE is most likely to be adopted, drawing on current activity and in-depth discussions with contract manufacturers and potential adopters. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities, such as skin temperature sensors and printed RFID tags.
To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/FHE.
Chandler, AZ – Rogers Corporation (NYSE:ROG) will exhibit at PCB West in Santa Clara, CA (booth #201) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials.
PCB West provides in-depth technical training and access to a host of leading suppliers to the printed circuit board design, fabrication, and assembly industry. Held at the Santa Clara Convention Center, the event takes place September 20th from 10:00 a.m. – 6:00 p.m.
Rogers’ Materials at Booth 201:
SpeedWave® 300P Ultra-Low Loss Prepreg. With the increasing need for stackup flexibility in high layer count designs for 5G millimeter wave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs, SpeedWave 300P prepreg offers a broad range of competitively priced high performance options for the circuit designer. SpeedWave 300P prepreg can be used to bond a variety of Rogers’ materials including CLTE-MW™, and RO4000® series laminates.
This prepreg system offers a low dielectric constant of 3.0 – 3.3 and a low dissipation factor of 0.0019 – 0.0022 at 10 GHz with stable performance over a broad frequency range. This material is offered in multiple spread and open weave glass styles and resin content combinations to maximize stackup options.
Thin copper foil can simplify the PCB fabrication steps required to consistently produce reliable millimeter wave radar PCBs. Utilizing 9 micron foils on antenna outer layers for millimeter wave radar PCBs can help PCB fabricators achieve tighter final feature tolerance for signal lines and antenna patterns. Additionally, starting with 9 micron copper on RO3003G2 laminate, instead of 18 micron copper, can reduce the copper reduction steps needed by the PCB fabricator to meet the final PCB copper thickness requirements after filled via formation.
RO4835IND™ LoPro® Laminates
RO4835IND LoPro thermoset laminates are specially designed for 60-81 GHz short-range industrial radar applications, where excellent electrical performance and cost-efficiency are equally important. These laminates also provide environmental reliability and interconnection stability, which are critical criteria for PCB material selection.
With a low insertion loss of 2.13dB/inch at 60 GHz, these laminates meet customers’ critical radar coverage requirements. The expanded weave fiber provides excellent Dk uniformity, and Rogers’ tight quality control provides low Dk variation from lot to lot. RO4835IND LoPro laminates are compatible with standard epoxy/glass (FR-4) processes and have a higher fabrication yield rate than conventional PTFE-based laminates. Low material and fabrication costs make RO4835IND LoPro laminates a cost-effective solution for industrial radar.
CLTE-MW laminates provide a cost-effective, high performance material for the circuit designer. This unique laminate system is well suited for millimeter wave applications that have limitations in thickness due to either physical or electrical constraints. The seven available thickness options from 3 mils to 10 mils ensure that ideal signal to ground spacing exists for today’s millimeter wave designs. CLTE-MW laminates are reinforced with spread glass, which along with a high filler loading help minimize the high frequency glass weave effects on electromagnetic wave propagation. The woven glass reinforcement also provides excellent dimensional stability. Other key features of the laminate include low z-axis CTE (30ppm/°C) for excellent plated through hole and component board level reliability.
CLTE-MW laminates are well suited for a range of applications including millimeter wave automotive and industrial radar antennas, 5G millimeter wave base stations and backhaul radios, and phased array radar systems.
RO4000® Products for Multilayer Structures:
Next generation products designed to meet the existing and emerging needs of advanced millimeter wave multilayer designs. RO4835T™ laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and they complement RO4835™ laminates when thinner cores are needed.
RO4450T™ 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials were designed to complement RO4835T laminates and the existing RO4000 laminate family, and come in 2.5, 3, 3.5, 4, 4.5, 5 or 6 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z-axis expansion for plated through-hole reliability and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bondplys have the UL 94 V-0 flame retardant rating and are compatible with lead-free processes.
SANTA CLARA, CA – ROHM Semiconductor today announced a dedicated webpage for a new Product Longevity Program (PLP) which provides information on the estimated supply periods for products scheduled for long-term supply – suitable for industrial equipment and other applications with long lifecycles.
In recent years, semiconductors and electronic components have been increasingly installed in long-life applications, such as industrial equipment and automotive systems, requiring the disclosure of applicable products and clarification of supply periods to facilitate product selection.
ROHM products formally placed under the new Product Longevity Program (selected after considering the production system, equipment, material procurement status, and other factors) are disclosed, along with the estimated supply periods. The goal: improving searchability by increasing the efficiency of customer product selection. The PLP sets supply periods of 10 to 20 years for products (mainly power and analog) requiring long-term supply, with relevant information such as supply status posted on ROHM’s website. This information (target products, supply periods) will be updated annually to ensure the continuity of customer operations.
As the role of semiconductors in the industrial equipment and automotive markets continues to grow, ROHM will strive to provide long-term supply that meets market needs and contributes to the creation of a sustainable society through an expanding lineup of superior products.
‘Quality is our top priority at all times’ has always been ROHM’s goal. In line with a corporate objective of ‘contributing to the advancement and progress of culture through a consistent supply, under all circumstances, of high quality products in large volumes to the global market,’ ROHM has been supplying products that meet customer demands to achieve a sustainable society.
SHAO GUAN, CHINA – In a visit aimed at unveiling the secrets of flexible PCB manufacturing, JLCPCB hosts the popular YouTube channel Strange Parts for a factory visit and tour of its latest technology manufacturing. The below video introduces each step of the manufacturing process of Flexible PCB. From material preparation, circuit printing, component placement, soldering, testing, and stiffener attachment, witnessing the complete production process of FPC from raw material to finished assembled circuit boards.
Flexible PCB, also known as FPC, or flex PCB, is crucial in modern electronic devices with their remarkable bending and folding capabilities. They offer high reliability and excellent mechanical flexibility, making them widely used in industries such as consumer electronics, communication devices, medical instruments, automotive, aerospace, and military.
The factory director of JLCPCB stated, "We are honored to have the opportunity to showcase our expertise and excellent capabilities in Flex PCB manufacturing to a global audience. JLCPCB has five PCB manufacturing industrial areas, covering an area of more than 280 Acres and serving users over 4.1 Million. We will continue driving innovation and providing customers with the highest-quality electronic manufacturing solutions."
Having high-quality PCBs is crucial to bringing excellent PCB designs to life. JLCPCB is committed to ensuring top-notch production standards by investing in cutting-edge equipment and collaborating with leading raw material suppliers from around the world. JLCPCB's flexible circuit board offers renowned adhesive material, enhanced heat resistance and dimensional stability, and customization options with a variety of multi-color choices.
JLCPCB is excited to announce a special offer on high-quality flexible PCB, starting at just $16. In addition to manufacturing flexible PCB, JLCPCB is also supported for flexible PCB assembly. To further support customers in their hardware innovation journey, JLCPCB extends a warm welcome to new users with up to $54 in registered coupons. This offer empowers innovators to explore the possibilities of flexible PCB and other PCB manufacturing options without financial constraints.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension”, “Nano” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, today announced that following its 2023 Annual General Meeting (“the Annual Meeting”), Nano shareholders have voted to re-elect Nano’s highly qualified director nominees – Dr. Yoav Nissan-Cohen, Col. (Ret.) Channa Caspi and Oded Gera – to the Company’s Board of Directors (“the Board”). In addition, shareholders did not approve separate proposals put forth by Murchinson Ltd. (“Murchinson) to remove other current directors.
Yoav Stern, Chairman and CEO of Nano Dimension commented, “We are pleased that shareholders have supported the continued service of all the Company’s directors. The entire Board appreciates the confidence that our shareholders have shown in our leadership and strategy. We remain laser focused on maximizing long-term value through the execution of our disciplined M&A strategy, while delivering strong organic growth through our leading technology and innovation efforts. We appreciate the dialogue that we have had with all shareholders throughout this process and remain committed to continuing that engagement going forward.
“We value the feedback we have received from our shareholders, as well as the recommendations of governance experts, ISS and Glass Lewis. As we move forward into the next phase of executing on our strategic plan, we will consider this feedback as part of the process to evolve and enhance our corporate governance, including the potential downsizing of the board, while ensuring we maintain the skills, capabilities and diversity on our Board to guide the Company in the years ahead. We are looking forward to a record 2023 and the value creation that lies ahead of us.”
In addition, shareholders approved the reappointment of Somekh Chaikin, Certified Public Accountants, as the Company’s independent auditor until the next Annual Meeting and have authorized the Company’s Board of Directors to determine their compensation until the next Annual Meeting.
Further details regarding the final results of the Annual Meeting will be included in a Report on Form 6-K that Nano Dimension will file with the U.S. Securities and Exchange Commission in due course.
AUSTIN, TX – Flex (NASDAQ: FLEX) today published its 2023 sustainability report, highlighting the company's global sustainability activities, performance, and results from calendar year 2022. The report reveals Flex's progress toward its 2030 sustainability goals to reduce its environmental impact, invest in local communities, advance a safe, inclusive, and respectful workplace, drive responsible, ethical business practices and accelerate a more sustainable value chain in partnership with customers and suppliers.
"The strides we've made toward our long-term commitments is a testament to our 170,000 employees' ongoing dedication and contributions, and collaboration with our suppliers and customers," said Kyra Whitten, Senior Vice President, Corporate Marketing, Communications, and Sustainability at Flex. "Sustainability is an ongoing journey, and we will continue to further embrace sustainable, responsible manufacturing practices as we build great products for our customers, deliver stakeholder value, and do our part to help address broader environmental and social call-to-actions for current and future generations."
2022 sustainability accomplishments
27 percent decrease in absolute scope 1 and 2 greenhouse gas emissions from 2019 baseline year
100 percent of major sites partnered with a local non-governmental organization
17 percent reduction in safety incident rate year over year
100 percent of employees had access to emotional / mental health programs
35 percent of preferred suppliers and 64 percent of specified customers had greenhouse gas emissions reduction and science-based targets, respectively
Released first Task force on Climate-Related Financial Disclosures (TCFD) report to share the company's approach to TCFD's key areas of governance, strategy, risk management, metrics and targets
In 2022, Flex received accolades and awards for its sustainability and ESG leadership and performance, including receiving a Manufacturing Leadership Award for its 2030 sustainability strategy and commitments, Business Intelligence Group's Initiative of the Year for its Supplier Greenhouse Gas Emissions Reduction Program and Cisco's Excellence in Sustainability Award, among others. Additionally, the company was named to CDP's supplier engagement leaderboard and A-List for water security for the second and third consecutive year, respectively, and included in the S&P Global's Sustainability Yearbook for the fourth year in a row.
