Why Is Advanced Semiconductor Packaging Needed?

This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging. The latter highlights the significance of semiconductor technologies in meeting these requirements.

Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements. Wafer level integration provides advantages over traditional methods, such as increased connection density, smaller footprints for size-sensitive applications, and enhanced performance.

"Advanced" semiconductor packaging specifically includes high-density fan-out, 2.5D, and 3D packaging, characterized by a bumping pitch size below 100 µm, enabling at least 10x higher interconnect densities.

Bandwidth Is Key

To enhance bandwidth from a packaging perspective, two key factors come into play: the total number of I/Os (input/output) and the bit rate per each I/O. Increasing the total number of I/Os requires enabling finer line/space (L/S) patterns in each routing layer/redistribution layer (RDL) and having a higher number of routing layers. On the other hand, improving the bit rate per I/O is influenced by the interconnect distance between chiplets and the selection of dielectric materials. These factors directly impact the overall performance and efficiency of the packaging system.

Unleashing High Bandwidth: Exploring Materials and Processing for Advanced Semiconductor Packaging

Delving deeper into achieving higher wiring density and a higher bit rate per I/O from a materials and processing perspective reveals the critical role played by the selection of dielectric materials and the utilization of appropriate processing techniques. These factors have a significant impact on the overall performance and capabilities of the packaging system.

Selecting suitable dielectric materials is crucial, considering properties like low dielectric constant, optimal CTE (as close to the CTE of Cu as possible), and favorable mechanical characteristics that ensure module reliability, such as Young's modulus and elongation. These choices enable higher data rates while preserving signal integrity and facilitating fine line/space features for increased wiring density.

In high-performance accelerators, such as GPUs, inorganic dielectrics like SiO2 have been extensively utilized to achieve ultra-fine line/space (L/S) features. Nevertheless, their use is limited in applications that demand high-speed connectivity due to their high RC delays. As an alternative, organic dielectrics have been proposed for their cost-effectiveness and ability to mitigate RC delays through their low dielectric constant. However, organic dielectrics present challenges, including high CTE, which can negatively impact the device’s reliability, and difficulties in scaling to fine L/S features.

In addition to selecting appropriate materials, the processing techniques employed during packaging fabrication play a crucial role in achieving a higher number of I/Os and improving the bit rate per I/O. The steps involved in 2.5D packaging processes, including lithography, CMP (Chemical Mechanical Planarization), etching processes, and the CMP and bonding processes in 3D Cu-Cu hybrid bonding, present challenges in achieving tighter routing and increased wiring density. IDTechEx provides detailed insights into how the choice of materials influences the fabrication processes, offering a comprehensive understanding of their impact on advanced semiconductor packaging.

Materials and Technologies Covered in the IDTechEx Report

IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report is divided into four main parts, offering a structured approach to understanding advanced semiconductor packaging. The first part provides a comprehensive introduction to the technologies, development trends, key applications, and ecosystem of advanced semiconductor packaging, providing readers with a solid overview. The second part focuses on 2.5D packaging processes, delving into crucial aspects, including dielectric materials for RDL and Microvia, RDL fabrication techniques, and material selection for EMC and MUF. Each sub-section within this part presents a detailed analysis of process flows, technology benchmarks, player evaluations, and future trends, providing readers with comprehensive insights.

The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D die stacking. This section provides valuable insights into the manufacturing process and offers guidance on material selection for optimal outcomes. It also showcases case studies highlighting the successful implementation of Cu-Cu hybrid bonding using both organic and inorganic dielectrics. Additionally, the report includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presented in the last chapter. This forecast encompasses unit and area metrics, providing the industry with meaningful perspectives into anticipated market growth and trends for the next decade.

To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP 

Waltham, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that it has made notable progress in accelerating its plans to commercialize the industrial artificial intelligence (“AI”) services of its in-house DeepCube Group by making its propriety technology available for use by external customers.

Nano Dimension has signed an agreement with a large multinational electronics company to leverage DeepCube’s deep learning-based AI technology. The Company has also entered a memorandum of understanding (“MoU”) with another international industrial company and is in the latter stages of discussions with several more leading industrial and advanced manufacturing companies for the commercial use of its DeepCube technology.

While the use cases that are contracted for or being discussed vary by customer, they are often around improving the efficacy of processes through some combination of in-line or instantaneous analysis of images and/or data. For the cases at hand, improving throughput and yield are of the utmost importance, and even slight enhancements can translate into large financial upsides.

Nano Dimension has based much of its strategy around the application of deep learning-based AI. The Company acquired DeepCube twenty-six months ago and has since leveraged its technology and its leading group of data scientists to drive improvements for its proprietary additive manufacturing systems. After seeing the improvements that deep learning-based AI for industrial applications could create, Nano Dimension explored bringing this technology directly to clients for their own use cases, and it has been well-received.

Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, commented, “We are pleased to see results so quickly after being led by a clear and present “pull” from the market. Fortunately, customers are demanding DC-AI Deep Learning Engine for specific and various applications, beyond our adaptation of it to Additive Manufacturing.

While AI has been the topic of much conversation lately, it is hard to imagine a greater set of applications for this unique technology than the opportunities we are discussing with a range of top-tier customers. The nature of their businesses and the problems they face means that DC-AI can bring notable improvements to their products and services, while also translating into a better bottom-line.”

BROOKLYN, NY – IEH Corporation announced today that in the past week it has booked over $1 million in new orders for their hyperboloid connectors in support of the Boeing 737Max jet.

Dave Offerman, President and CEO of IEH Corporation commented, "This is a very positive development for our company, especially for the revenue we generate from the commercial aerospace sector. The orders themselves are meaningful, but even more significant is what they portend; that the post-COVID recovery of the commercial aviation industry has begun to impact the 2nd and 3rd tier component suppliers in the aerospace supply chain, which includes IEH.

As discussed in prior communications, the worldwide grounding of the Max jet in late 2019, followed by the steep decline in air travel in early 2020 due to COVID, was incredibly disruptive to the commercial aerospace supply chain. It created long delays and bottlenecks, and as people began flying again, severe imbalances in supply and demand. It has taken a long time for the airplane manufacturers and their Tier 1 suppliers to work through the inventory that had accumulated pre-COVID, and reach a stage where components like connectors would again be necessary to complete module and subsystem builds. While the recovery will continue to be gradual and measured, this influx of orders signifies that the return to pre-COVID levels of production is approaching, which bodes well for IEH's revenue recovery over the coming quarters."

TORONTO – Firan Technology Group Corporation (TSX: FTG) today announced that IPC's Validation Services Program has awarded qualification for IPC-1791, Trusted Electronics Fabricator Requirements Qualified Manufacturers Listing (QML) to FTG Circuits Toronto.

FTG is a global corporation offering design, development, prototypes and manufacturing solutions for aerospace and defense electronic products and subsystems.

The FTG Circuits Toronto facility passed stringent Type 2 fabricator requirements, helping to optimize product quality, reliability, and consistency across the entire manufacturing operations, earning a spot-on IPC’s global network of rigorously vetted, trusted sources. Requirements for qualification and QML listing to IPC-1791 includes product and quality system, supply chain risk management system (SCRM), security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system review. This is the third FTG site to achieve the IPC-1791 certification.

FTG Circuits is a manufacturer of high-technology, high-reliability printed circuit boards including standard rigid, high-density interconnect (HDI), RF circuitry, thermal management, and rigid flex products. FTG produces boards utilizing traditional PCB manufacturing processes and a license of Averatek’s A-SAPTM Semi-additive process.

“This IPC recognized qualification combined with the capabilities, scope and FTG’s commitment to being the trusted PCB supplier of choice for aviation, defense and space industry customers assures our continued relationship with IPC Validation Services and the Trusted Supplier Audit Program,” said Mr. Brad Bourne, President and CEO, FTG Corporation.

IPC's Validation Services QML Program was developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards. The IPC-1791 QML verifies security systems and recognizes companies for either trusted electronic designer, fabricator, or assembler ensuring a high level of integrity. "IPC's Validation Services Audit Programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC Director of Validation Services. "We are pleased to recognize FTG Circuits Toronto as a member of IPC's network of trusted QML suppliers."