Gent, Belgium – Following a comprehensive year-long review process that involved welcome input from the worldwide Gerber community, the latest tools in the Gerber format have now been finalized and are ready for integration into the main Gerber specification.
BANNOCKBURN, Ill., USA, November 15, 2016 — The latest technical research, industry best practices, trending topics, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO 2017 technical conference and professional development courses, which will take place February 11–16 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org.
Read more: Turn Inspiration into Innovation through IPC Apex Expo 2017
SUZHOU JIANGSU, CHINA — Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is delighted to announce the appointment of Chris Bowles as Technical Account Manager. Based in North California, Chris will support sales activities in the United States, including Ventec’s latest ThinFlex products.
Read more: Ventec International Appoints Chris Bowles as Technical Account Manager, USA
Northfield, MN -- All Flex, a manufacturer of flexible printed circuit boards and flexible heaters, continues to build its capabilities of fast-turn fabrication technology by adding an advanced ‘flying probe’ electrical test unit for large panel, bare-board testing.
Read more: All Flex Adds Flying Probe Electrical Test
WILSONVILLE, Ore., Nov 8, 2016 /PRNewswire/ -- Mentor Graphics Corporation (NASDAQ: MENT) today announced that Seica, a leading supplier of automated test equipment for the electronics manufacturing industry, will offer the Valor Process Preparation tool to users of its Pilot® Flying Probe Testers (FPT). The Valor Process Preparation product will help streamline the input of printed circuit board (PCB) design data and generation of test programs for Seica's flying probe testers, thereby accelerating new product introduction (NPI) cycles.
The Valor Process Preparation software offers a complete solution for PCB electrical test engineering, interfacing seamlessly with Seica's VIVA software and delivering all the data required to generate a complete test program. The Valor Process Preparation design for test (DFT) engine enables optimization of test probe locations and automates probe offsets to compensate for differences in pad and solder mask openings, and to determine optimum approach for fine pitch leads. The Valor Process Preparation product supports 25 different CAD and CAM formats including Gerber and ODB++.
"Our Flying Probe Testers are extremely popular in NPI-intensive environments and Valor Process Preparation helps our customers meet the need for both high test coverage and rapid test program generation," said Antonio Grassino, president, Seica. "Valor's integration with our VIVA software creates an optimal flow from design to test."
"The Valor Process Preparation DFT engine applies our accumulated knowledge from the PCB design and manufacturing domains to assist customers in PCB testing," said Dan Hoz, general manager, Mentor Graphics Valor Division. "Our partnership with Seica allows our joint customers to implement a single platform for all of their process engineering needs starting from stencil through documentation, inspection and SMT programming."
Product Availability The Valor Process Preparation solution for Seica's Pilot Flying Probe Testers is available today. For more information visit: https://www.mentor.com/pcb-manufacturing-assembly/products/valor-mss-process-preparation. Seica is an exhibitor at Electronica 2016 (booth A1-459) in Munich, Germany, from November 8-11, 2016. For additional information on Seica's Pilot Flying Probe Test Platforms, visit http://www.seica.com/products/flying-probe-testers/