WESTFORD, MA, USA, September 4, 2025 – Zuken Inc. (President: Katsube Jinya, hereinafter “Zuken”) has joined "JOINT3" consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies. JOINT3 brings together global leaders in semiconductor supply chain. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic interposers.
Based on Zuken’s track record and expertise as an EDA vendor supporting customers in advanced packaging design, we participate in the practical implementation of next-generation semiconductor packaging design, manufacturing, and verification with panel-level organic interposers in JOINT3. And Zuken contributes to the establishment of optimal design and manufacturing process by developing tools and features to solve issues that emerge in the process.
In recent years, packaging for back-end processes has emerged as a key technology in the field of next-generation semiconductors. This includes 2.xD packages, whereby multiple semiconductor chips are arranged in parallel and connected via interposers, demand for which is expected to grow in line with the need for increased data communication capacity and speed. As semiconductor performance improves, interposers are becoming larger, and there is a shift from silicon interposers to organic interposers made from organic materials.
Conventional manufacturing methods involve cutting rectangular pieces from circular wafers. However, as interposers increase in size, the number of them that can be obtained from a single wafer decreases, posing a significant challenge. To address this issue, a manufacturing process that transitions from circular wafer shapes to square panel shapes is gaining attention, as it allows for an increased number of interposers to be produced from a given area of wafer.
Zuken has participated in various 2.5D and 3D package design, manufacturing, and verification projects, in addition to providing customers with advanced package design environments. Throughout the course of these projects, we have a proven track record in supporting the design and tool development for various technologies such as Chip stacking, Organic Package stacking, and various interposers. These experiences and technologies are consolidated into the CR-8000 Design Force's 2.5DIC/3DIC design and verification features, and the SoC/package/PCB collaboration design environment.
In JOINT3, Zuken engages in the practical implementation and validation of next-generation semiconductor packaging design and manufacturing using panel-level organic interposers. In addition to verifying the physical structure design and electronics design, Zuken is also planning to develop new functions such as preliminary verification in the design stage that takes into account the physical properties and chemical characteristics of various materials.
By collaboration and co-creation with other JOINT3 members, Zuken contributes to the evolution of design, manufacturing, and verification process for the next-generation semiconductor packaging with panel-level organic interposers. And Zuken aims to play a key role in the next-generation ecosystem and supply chain.
Overview of JOINT3
Name
JOINT3 (JOINT:Jisso Open Innovation Network of Tops)
Objectives
Accelerate the development of materials, equipment, and design tools optimized for panel-level organic interposers through co-creation with participating companies.
Participating Companies (listed in alphabetical order)
Hitachi High-Tech Corporation, JX Advanced Metals Corporation, Kao Corporation,
Lam Research Corporation, LINTEC Corporation, MEC COMPANY LTD., Mitutoyo Corporation,
NAMICS Corporation, Nikko-Materials Co., Ltd., OKUNO CHEMICAL INDUSTRIES CO., LTD.,
Synopsys, Inc., Tokyo Electron Ltd., Tokyo Ohka Kogyo Co., Ltd., TOWA Corporation, ULVAC, Inc.,
Ushio Inc., ZUKEN Inc., 3M Company
Location
Advanced Panel Level Interposer Center “APLIC”
(Yuki City, Ibaraki Prefecture, Japan (within the Resonac Shimodate Plant (Minami-yuki)))
Packaging Solution Center
(Kawasaki City, Kanagawa Prefecture, Japan)
Activities
Developing materials, equipment, and design tools for organic interposers using a panel-level (515 x 510 mm) prototype production line
Promoting development through co-creation by having material and equipment manufacturers produce common prototypes
Utilizing JOINT3 as a “training ground” for technology and equipment manufacturers to further enhance technologies related to panel-level organic interposers
DOVER, DE – September 2025 – Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, will hold its first-ever Spanish-language webinar tailored to the Mexican market. The online session, “How to optimize electronic component purchases and save costs,” will take place on September 5, 2025 at 1 PM EST, and will run for approximately 45 minutes.
The session will be hosted by Roberto J. Cantero of Luminovo and will feature Victor H. Madero, CEO & Founder of SMTVYS, as the guest speaker. Together, they will share strategies to centralize electronics purchasing data and maximize pricing efficiency. Attendees will discover how to achieve up to a 200% increase in purchasing efficiency and cut annual component costs by as much as 10%.
Key topics include:
Electronics Supply Chain Trends – Insights into the latest industry shifts and approaches to tackle a rapidly changing market.
Solutions for 2025 – Proven strategies and innovative methods to manage growing complexity and volatility.
Proactive Risk & Cost Management – Leveraging real-time data—covering compliance, lifecycle tracking, availability, and pricing—to drive savings and resilience.
The session will conclude with an introduction to Supply Chain Intelligence, showing how to transition toward a more data-driven, agile electronics procurement model. The webinar is ideal for EMS providers and OEMs with substantial electronics content—especially procurement, strategic sourcing, costing engineers, and supply chain managers.
This event marks a milestone in Luminovo’s regional engagement, offering localized expertise in Spanish tailored to the needs of the Mexican electronics industry.
ICZOOM Group Inc., a leading B2B electronic component e-commerce platform, has announced the introduction of its integrated printed circuit board (PCB) manufacturing and surface mount technology (SMT) assembly services at the IIC Shenzhen 2025. This announcement was made during the International Integrated Circuit & Component Exhibition and Conference held from August 26-28, 2025, at the Shenzhen Convention & Exhibition Center.
This strategic move signals ICZOOM's expansion beyond electronic component distribution, creating a more comprehensive profit model and service offering. The company's new services include a full-process suite—ranging from electronic component procurement, customs declaration, and smart warehousing to PCB manufacturing and SMT assembly, specifically designed to support small and medium-sized enterprises (SMEs).
By partnering with high-quality manufacturers, ICZOOM aims to leverage its industry relationships to execute a capital-efficient expansion without significant upfront investments. This allows the company to enhance its existing one-stop order fulfillment services, strengthening its supply chain solutions for SME customers who often face challenges managing fragmented supply chains and multiple vendor relationships.
The launch at the high-profile IIC Shenzhen 2025 positions ICZOOM to capture additional revenue streams beyond its traditional component sales, potentially increasing its service offerings to include design, manufacturing management, and assembly services.
Founded in Shenzhen, China, ICZOOM Group Inc. continues to cater to the needs of SMEs in the consumer electronics, Internet of Things (IoT), automotive electronics, and industry control segments, with a focus on providing transparent and efficient e-commerce solutions for electronic component products.
Eltek Ltd., a global manufacturer of printed circuit boards, has received a $2.4 million order from a leading Israeli defense company. The products will be delivered mainly in 2026 and 2027 and are critical components in the customer's systems, requiring advanced technological capabilities. This order is a continuation of previous supplies to the same customer.
Eltek Ltd. (NASDAQ: ELTK), a global manufacturer of printed circuit boards (PCBs), has received a significant order worth $2.4 million from a leading Israeli defense company. The order, announced on August 25, 2025, is set to be delivered primarily in 2026 and 2027. The products are critical components that require advanced technological capabilities, and this order is a continuation of previous supplies to the same customer [1].
Eltek specializes in the manufacture and supply of complex and high-quality PCBs, including HDI, multilayered, and flex-rigid boards, catering to high-end markets such as defense, aerospace, and medical industries. The company's headquarters and R&D center are located in Israel, with operations extended through subsidiaries and distributors in North America and various other regions [2].
The CEO of Eltek, Eli Yaffe, commented on the order, stating that the products have been previously supplied to the same customer. This indicates a strong, established relationship and a high level of trust between Eltek and the defense company. The order highlights Eltek's ability to meet the advanced technological requirements of the defense sector, which is critical for the integration of PCBs into sophisticated defense systems.
Eltek's order book continues to grow, reflecting the company's strong market position and technological expertise. As a global player in the PCB industry, Eltek's focus on innovation and high-quality products is evident in its ability to secure such significant orders from leading defense companies. The company's certifications, including ITAR compliance, AS-9100, and NADCAP electronics, further underscore its commitment to quality and reliability.
For more information about Eltek Ltd., visit their website at www.nisteceltek.com.
On Aug 18, Jarnistech, a PCB manufacturer specializing in high-end multilayer and specialty material boards, announced the launch of its glass-based printed circuit board (PCB) solution. The technology has already been adopted in customer prototype validation projects, aimed at applications that require strict control over signal loss, thermal stability, and optical transparency. As electronic systems continue to evolve toward RF transmission, optoelectronic integration, and miniaturization, glass PCBs have emerged as a promising alternative to traditional FR-4. Glass substrates deliver superior insertion loss characteristics, impedance consistency, thermal stability, and optical clarity, helping address material performance bottlenecks in advanced designs.
“Unlike conventional copper-clad laminates, glass is rigid and brittle,” said Mike, an engineer at Jarnistech. “Mechanical drilling and depaneling can’t be applied. To overcome this, we’ve adopted custom fixtures, non-contact handling systems, and laser-induced chemical etching to achieve precise, microcrack-free forming.” He added that operators undergo specialized training in plasma surface treatment and brittle-material handling.
Jarnistech has developed a complete technical framework, covering equipment, processes, and operations, to reliably support prototype verification and customized R&D for glass PCBs. The company has already delivered prototypes to customers in fields such as optoelectronic sensing, millimeter-wave communication, and AR modules. Building on this, Jarnistech is expanding its high-end manufacturing capabilities by leveraging the reliability of specialty substrates. Its portfolio includes Rogers, Isola, Panasonic, Taconic, Teflon, and BT series, as well as hybrid PCB structures, enabling clients to implement high-frequency, high-speed designs.
“Beyond glass substrates, we are also advancing in other specialty PCB materials,” said Jeremy Lin, CEO of Jarnistech. “We now have mature processing experience with ultra-low-loss laminates, including Panasonic’s Megtron 6 and M8 series. Looking ahead, Jarnistech will continue focusing on specialty PCB solutions to provide stable, reliable support for complex, high-performance designs.”
Freudenstadt, Germany – August 20th, 2025 - SCHMID Energy System GmbH has been awarded a major contract by Dutch shipping company Portliner to design and construct a large-scale flow battery system with up to 1.5 MW of peak power. This state-of-the-art energy storage solution will serve as the primary power source for the zero-emission propulsion of an all-new container vessel.
This landmark project marks SCHMID Energy System’s entry into the maritime propulsion market and strengthens its position as a pioneer in sustainable energy storage solutions for shipping. The chosen flow battery technology offers high energy density, exceptional longevity, and flexible charging and discharging capabilities- all critical requirements for the reliable operation of large cargo vessels on long-haul routes. It allows charging the battery from onshore electrical charger or for very fast charging swapping of discharged electrolyte with charged electrolyte from charging pontoons will be developed.
“This contract is a major strategic milestone for our company,” said Henrik Buschmann, Vice President BU Energy Systems, SCHMID Group.
“We are leveraging decades of experience in innovative energy systems to enter the maritime sector for the first time, sending a strong signal for sustainable solutions worldwide. Partnering with Portliner allows us to combine technological excellence with a clear commitment to environmental and climate protection.” Portliner is equally enthusiastic about the collaboration.
“With SCHMID Energy Systems, we have found a partner that not only brings deep technical expertise but also shares our vision for clean, future-proof shipping,” said Ton van Meegen, CEO, Portliner.
“The flow battery will enable us to operate our container ships entirely emission-free, making a tangible contribution to reducing CO₂ emissions in global trade.”
The vessel will operate without any fossil fuels, directly contributing to the decarbonization of maritime freight transport and supporting international climate goals.
Upon successful delivery of this project, SCHMID Energy Systems intends to further advance maritime applications of its flow battery technology - from cargo ships and ferries and swimming electrolyte pontoons.
