MIGDAL HAEMEK, Israel -- PCB Technologies, a global leader in advanced electronic and PCB manufacturing solutions, is pleased to report that during the past two weeks, until June 12, 2026, several orders have been placed with the Company's PCB and Substrates Division by a leading customer in the European semiconductor equipment industry, for dozens of different types of printed circuit boards, which will then be assembled by the customer as part of a critical system used by the semiconductor industry around the world. The Orders totaled approx. EUR 8.6 million. The Products will be supplied from the third quarter of 2026 through the first quarter of 2027. It is noted that the Company sells to the Customer additional products beyond those sold under the Orders.
About PCB Technologies
PCB Technologies is a leading All-in-One solutions provider specializing in high-mix multilayer rigid, rigid-flex, and multi-flex PCBs, advanced substrates, IC packaging, complex electronic assemblies, and electro-mechanical sub-systems. The company offers full-process, in-house capabilities that span the entire product lifecycle—from rapid prototyping to cost-effective, high-volume production. Through its exclusive subsidiary, iNPACK, PCB Technologies delivers specialized expertise in miniaturization and next-generation IC packaging solutions. Established in 1981, the company is a global front-runner in cutting-edge electronics manufacturing, serving mission-critical sectors including Military/Defense, Aerospace, Medical, RF/Microwave, and Robotics/Automation.
Key Largo, Florida, USA – Automated Production Equipment (APE) has significantly expanded production of its most popular PCB eyelets and funnellets, allowing delivery of these products at what may be the most competitive pricing in the industry, according to Casey Scheu, CEO.
PCB eyelets (also called hollow rivets) and funnelets are small, tin-plated copper or brass tubes used to restore the conductive path in damaged circuit boards and reinforce mechanical connections. They act as a reliable "bridge" for electrical current and component leads.
In making the announcement, Casey Scheu said, “By increasing manufacturing capacity and focusing on high-volume production of our most common sizes, APE's standard pricing is now approximately 35% lower than the nearest major competitor on many eyelet and funnellet products.”
Inside diameters range from 0.021" through 0.132", and products are made of Brass and Copper, with Bare and Tin-Plated Finishes.
Casey added, “Our expanded USA manufacturing operation is producing millions of eyelets and funnellets to support PCB repair technicians, electronics manufacturers, aerospace contractors, military depots, and repair facilities worldwide. Take advantage of our 20% Anniversary Sale and discover why more customers are switching to APE for their PCB eyelet and funnellet needs.”
Boston, MA: Issey Ende, VP of Sales and Marketing for PCB Technologies, has announced that the company will be exhibiting at IMS 2026, (IEEE International MTT Symposia) the world’s leading event for the RF, microwave, and high-frequency electronics industry, taking place June 7th through June 13th, 2026, at the Thomas M Menina Convention and Exhibition Center in Boston, Massachusetts.
PCB Technologies will be showcasing its advanced high-frequency PCB and assembly solutions to engineers, OEMs, defense contractors, and technology innovators attending this year’s event. Visitors to the PCB Technologies booth will learn why the company has become one of the most respected providers of complex RF, microwave, HDI, rigid-flex, and advanced electronic manufacturing solutions in the world.
IMS 2026 brings together thousands of engineers, researchers, manufacturers, and industry leaders from across the globe to explore the latest innovations in RF, microwave, millimeter-wave, and high-speed technologies. The event includes a world-class technical conference, workshops, networking opportunities, and one of the industry’s premier exhibitions featuring leading electronics manufacturers and technology providers.
“We are extremely excited to participate in IMS 2026,” said Mr. Ende. “This is one of the most important technology events in the world for companies involved in RF, microwave, aerospace, defense, medical, and advanced communications. IMS gives us the opportunity to demonstrate how PCB Technologies helps customers solve some of the industry’s most complex engineering and manufacturing challenges. Our ability to provide complete solutions—from advanced PCB fabrication to complex assembly and packaging—makes us uniquely valuable to customers developing next-generation electronic products.”
PCB Technologies will be at Booth 19096.
About PCB Technologies:
PCB Technologies is a global leader in advanced electronic manufacturing solutions, offering a complete range of services including high-reliability PCB fabrication, HDI, RF and microwave boards, rigid-flex technology, IC substrates, advanced packaging, and complex electronic assembly. The company’s vertically integrated manufacturing model enables customers to streamline development, improve reliability, reduce time-to-market, and achieve superior performance for mission-critical applications.
Serving industries including aerospace, defense, telecommunications, medical, automotive, industrial, and high-performance computing, PCB Technologies is known for delivering innovative solutions for the most demanding electronic applications in the world.
Attendees visiting the PCB Technologies booth at IMS 2026 will have the opportunity to meet with company experts, explore the latest manufacturing technologies, and discover how PCB Technologies is helping shape the future of advanced electronics manufacturing.
IMS 2026 (IEEE International MTT Symposia) is the premier global event for the RF and microwave industry, bringing together the brightest engineers, innovators, researchers, and technology companies from around the world. Held June 8th through June 13th, 2026, in Boston, Massachusetts, IMS offers an unmatched combination of technical education, product demonstrations, networking opportunities, and industry collaboration.
The event showcases the latest developments in RF, microwave, millimeter-wave, wireless communications, aerospace, defense electronics, automotive radar, satellite systems, and emerging high-frequency technologies. Engineers and technology leaders attend IMS to discover breakthrough innovations, gain practical technical knowledge, and connect with the companies driving the future of advanced electronics.
Canton, MA — April 2026 — Remtec, a leading innovator in advanced ceramic substrates and microelectronic assembly solutions, today announced that it will be attending the upcoming EEE International MTT-S Symposium 2026, taking place June 7–12, 2026, at the Thomas M. Menino Convention & Exhibition Center (MCEC) in Boston, Massachusetts. President and CEO Brian Buyea made the announcement, emphasizing the importance of the event not only for Remtec, but for the broader RF and microwave engineering community.
“The MTT-S Symposium is one of the most important gatherings in the world for RF, microwave, and high-frequency innovation,” said Buyea. “This is where the industry comes together to exchange ideas, challenge assumptions, and push the boundaries of what’s possible. For Remtec, it’s an opportunity to engage directly with engineers and designers who are solving some of the most complex challenges in electronics today. These conversations drive innovation—and that’s exactly where we want to be.”
As part of the event, Microwave Journal will conduct an on-site interview with Buyea at their booth, where he will share insights into the evolving role of ceramic substrates, power electronics, and high-frequency materials in next-generation system design.
About the EEE International MTT-S Symposium
The EEE International MTT-S Symposium is widely regarded as the premier global event for microwave theory and techniques, bringing together thousands of engineers, researchers, and industry leaders from around the world. The event features cutting-edge technical sessions, product exhibitions, panel discussions, and networking opportunities focused on RF, microwave, millimeter-wave, and advanced electronic systems.
Held in Boston—one of the world’s leading hubs for technology and innovation—the symposium provides a unique platform for collaboration, learning, and showcasing the latest advancements shaping the future of high-frequency electronics.
About Remtec
Remtec is a leading provider of advanced ceramic substrate and assembly solutions for high-performance electronic applications. With over 35 years of experience, the company specializes in Alumina and Aluminum Nitride ceramic technologies, delivering superior thermal management, reliability, and electrical performance for demanding environments. At the core of Remtec’s capabilities is its proprietary PCTF® (Plated Copper Thick Film) technology, enabling robust, high-performance interconnects for RF, microwave, and power electronics applications. From substrate design to full system-level assembly—including die attach, wire bonding, encapsulation, and housing integration—Remtec offers a true “From Substrate to System” approach.
Serving industries such as aerospace, defense, telecommunications, and industrial power, Remtec is committed to solving the toughest challenges in microelectronics with precision, reliability, and engineering expertise.
SANTA ANA, Calif., June 03, 2026 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including printed circuit boards (“PCB”s) and substrates, announced today that it has completed the closing of a new $1.0 billion cash flow senior secured revolver and a repriced and upsized senior secured Term Loan B (“TLB”) in the aggregate principal amount of $400 million.
“Consistent with plans communicated during our May 27th Investor Day presentation, we are excited to announce that we have brought on new credit facilities to strengthen our financial position while providing flexibility to pursue strategic initiatives,” said Dan Boehle, Executive Vice President and Chief Financial Officer. “Together with our solid balance sheet and healthy operational performance, we have enhanced our long-term capital structure to support further sustainable growth and maximize shareholder value in 2026 and beyond.”
TLB Highlights
Repriced and upsized TLB due May 2030 in the aggregate principal amount of $400 million.
The new TLB has been priced at Term SOFR+ 1.75%, a reduction of 50 basis points from our prior term loan B commitments.
Reduced pricing is anticipated to provide meaningful cash interest savings for the remaining term.
Cash Flow Revolver Highlights
The maximum availability under the multi-currency cash flow senior secured revolving credit facility is $1.0 billion, maturing in May 2031.
The new revolver replaced our prior $150 million U.S. and $150 million Asia asset-based-lending (ABL) facilities.
Milledgeville, Georgia, USA – Topline Corporation has released a 50-page product guide of jumpers and spacers, publication 2026-A, fully illustrated and featuring schematics, charts, specifications, land patterns, package outlines, and descriptions of the wide range of zero ohm jumpers and solderable PCB spacers that TopLine offers, including custom configurations.
