THAILAND – Ventec International Group has confirmed its agreement with Jinzhou Precision Technology Corporation to distribute precision drill and router bits in the Europe, Middle East, and Africa (EMEA) region, working in cooperation with DCM Technology, Jinzhou’s long-standing European distribution partner. Jinzhou Precision Technology is a globally recognised leader in PCB tools and micro-tools, with over 30 years’ experience in the field. The company was the winner of the National Microdrill Champion Enterprises Award and currently produces 70 million machine-tool bits per month, including drills and routers down to 0.01mm for advanced high-density applications.
“Our agreement with Jinzhou Precision Technology & DCM Technology allows us to offer a comprehensive selection of bit types and sizes, for fast delivery from regional inventory, all of the highest quality with proprietary coating options to ensure tools retain their edge and maintain the utmost accuracy for longer,” said Mark Goodwin, COO of Ventec. “Investing in the best drilling and routing products, from the world’s largest manufacturer, delivers tangible dividends for our customers by delivering sustained productivity and quality gains.”
Accurate drilling and routing are essential to ensure high production quality, seen in perfectly formed electrical and thermal vias, component mounting points, panelisation, board profiling, cutouts, and slotting. Jinzhou Precision high-quality bits ensure consistent accuracy, and the range includes extremely fine-diameter drill bits, with longer flute lengths that are needed to produce today’s most advanced high layer count HDI boards. The tools also ensure long service lifetime when operated up at high cutting speeds, maintaining fast and repeatable cycle times. Choosing Jinzhou Precision from Ventec & DCM for enduring integrity and sharpness empowers PCB makers to drive up throughput and productivity.
Ventec’s new agreement with Jinzhou Precision Technology &DCM Technology strengthens the company’s one-stop supply commitment, which also assures customers of premium PCB laminates, prepregs, machinery, consumables, and precision tools, all available for fast delivery from inventory a single trusted supplier. Ventec’s technical team provides guidance on selecting and using the materials and tools to ensure compatibility and optimum throughput to maximize manufacturing efficiency and quality.
Also supported by Ventec’s worldwide distribution network, customers can rely on fast dispatch, efficient shipping, and consistent delivery performance to ensure their PCB manufacturing operations are always on track.
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, announces a new service - a system to help our customers to access EMC's well established mass lam offerings. Long a leader in mass lam manufacturing, EMC is the exclusive supplier in Insulectro's laminate and pre preg portfolio. The addition of this service allows Insulectro to again find innovative ways to enable our customers to make better circuits faster.
Michelle Walsh, Vice President of Product Management stressed its importance, "Mass lam outsourcing becomes essential when it comes to the industries like automotive, medical or mil/aero with low-volume, high-tech and complex PCB requirements that demand a quick-turn service that high-volume fabricators don’t typically provide. Insulectro is pleased to facilitate contact between our fabricators and EMC.”
Mitchell Benson, Insulectro’s Product Manager – Laminates, who is deeply knowledgeable about EMC’s mass lam capabilities, offers his take, “At Insulectro, we’re always looking for ways to remove barriers for our fabricators. By streamlining access to EMC’s trusted mass lam solutions, we’re enabling customers to respond faster to complex builds and tight timelines—without sacrificing quality. It’s another example of how we partner with our suppliers and customers to drive innovation and speed to market.”
China Silver Technology Holdings Limited has announced new procurement agreements with Shenzhen Zhengjiaxing Electronics Co., Ltd. and Shenzhen Xiaobai Assistant Technology Co., Ltd. to supply printed circuits and AI electronics products, respectively. These agreements align with the company’s strategy to diversify into higher-end products, generating stable income and enhancing innovation capabilities, thereby supporting sustainable growth and resource integration.
More about China Silver Technology Holdings Limited
China Silver Technology Holdings Limited, previously known as TC Orient Lighting Holdings Limited, is an investment holding company with major subsidiaries engaged in the manufacturing and trading of LED lighting and printed circuit boards (PCBs), including single-sided, double-sided, and multi-layered PCBs. The company is focused on developing business opportunities to enhance long-term growth and shareholder value.
LYON, FRANCE – Yole Group today announces the release of its annual Status of the Advanced IC Substrates Industry report, a comprehensive market and technology analysis covering organic IC substrates, glass core substrates, substrate-like PCBs, and Embedded Die technologies.
After a challenging 2023, the IC substrate ecosystem is showing promising signs of recovery. According to Yole Group’s latest projections, the combined market for advanced substrate technologies is expected to reach $31 billion by 2030, driven by AI and HPC, as well as broader penetration into consumer, automotive, and defense segments….
Bilal Hachemi, PhD, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group, comments: “This growth reflects sustained demand for larger, complex, high-ASP substrates capable of supporting generative AI, data center, and advanced package requirements, including finer interconnects, higher yield, and controlled lead times.”
ICEPT 2025, Shanghai: Ask for a meeting with our advanced packaging expert at, with Yik Yee Tan, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group. Contact: This email address is being protected from spambots. You need JavaScript enabled to view it.
Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
“Lincstech has been supporting the electronics industry with high quality Printed Wiring Boards for over 60 years and are proud to be a mainstay in the industry. We are privileged to play a key role in industries from Semiconductor Test, ensuring the functionality of electronic devices, to life-saving medical devices and beyond in rapidly growing segments such as AI,” said Eijiro Ikegami, President and CEO at Lincstech America Inc. “Lincstech is excited to join HDP User Group, especially as we are now a part of the Global Brands Manufacture (GBM) organization which is a member of the Passive Systems Alliance (PSA) group consisting of businesses producing Passive Components, Printed Circuit Boards, Electronic Manufacturing Services and IC Packaging. We look forward to working with HDP User Group and contributing to the advancement of PCBs and the greater electronics industry.”
“I am pleased to welcome Lincstech to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in leading edge PCBs and 3D substrates for high-speed computing and data systems will contribute significantly to our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
Taiyo Holdings Co., Ltd. announced a change in its Representative Director following a review of its management structure, as resolved in the recent Board of Directors meeting. This change, effective June 21, 2025, involves Hitoshi Saito assuming the role of President and Group CEO, while Eiji Sato becomes the Senior Corporate Executive Officer, indicating a strategic shift in leadership to potentially enhance the company’s operational efficiency and market positioning.
More about Taiyo Holdings Co., Ltd.
Taiyo Holdings Co., Ltd. operates in the chemical industry, focusing on the production and sale of materials for printed circuit boards and semiconductor packages. The company is listed on the Prime Market of the Tokyo Stock Exchange.
