Bloomington, Il: Ms. Christine Davis, President and CEO of Camtek, Inc announced recently that her company has completed and achieved its’ ISO 9001:2015 certification, which includes risk management.

Read more: Camtek Inc. Earns ISO 9001:2015 Certification

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability concerns from some customers, coupled with the option of lower-priced flip chip CSP substrates, prompted Qualcomm to lower its FO-WLP forecast this year and next. While Qualcomm’s forecast may be lower, others are stepping in to use recently installed capacity. FO-WLP has been adoption for some radar modules in vehicles equipped with advanced driver assist systems (ADAS) by companies including Infineon and NXP. Adoption of fan-out on substrate for high-performance applications is expanding.

Read more: TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

Orbotech Ltd. announced today that FTG (Firan Technology Group) Circuits has updated and expanded the PCB production capacity in their Toronto, Ontario facility with new DI (Direct Imaging) and AOI (Automated Optical Inspection) solutions from Orbotech.

Read more: FTG Circuits Invests in Additional Orbotech DI and AOI Solutions for PCB Production Upgrade

Zero Defects International [ZDI] has been appointed by Taiyo Industrial Company, Japan, to manage the North American introduction of its automated printed circuit board final inspection systems.

Read more: Zero Defects International Introduces Taiyo PCB Inspection System

Schaumburg, IL.  Bowman, a global manufacturer of XRF coating measurement instruments, held its 2017 International Sales Meeting in Chicago October 30 and 31, 2017.

Read more: Bowman Hosts International XRF Event

Advances in the printed wire board industry toward miniaturization, finer traces and HDI technology, smaller through-holes and micro-vias have placed higher demands on board design, manufacturability and quality.  Historically, the industry utilized titanium anode baskets with soluble copper-phosphate balls or anode slabs. Limitations associated with this standard anode technology are seen in low current density plating requirements, over-plating of copper to meet minimum plated board specifications and nodule defects impurities in the plating bath. Today there is an exciting alternative, Industrie De Nora’s DT insoluble MMO (mixed metal oxide) anode technology package.

Read more: De Nora Tech, LLC Announces Exciting New Advances in the PWB Plating Industry

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