PHOENIX, AZ, May 6, 2026 — Entrepix, Inc., a globally recognized expert in CMP and wafer cleaning and a subsidiary of Amtech Systems, Inc., today announced that it has entered into a representative agreement with CWI Technical Sales to support sales of its DSS-200 Ontrak wafer cleaning system as well as Entrepix CMP parts, services and upgrades in the Eastern United States from Florida to Eastern Canada.

Under the agreement, CWI Technical Sales will focus on expanding market adoption of the DSS-200 platform, Entrepix’s industry-leading double-sided wafer cleaning system, serving semiconductor and advanced substrate manufacturers seeking high-performance, cost-effective cleaning solutions. The DSS-200 wafer cleaning system has been fully modernized by Entrepix and features a modern control system and optimized handling for thin or fragile substrates. In addition, the system can be configured for odd wafer sizes making it well suited for the production of novel substrates.

“We are excited to partner with CWI Technical Sales, whose deep technical expertise and hands-on understanding of wafer processing enable them to quickly diagnose challenges and deliver practical, high-impact solutions for our mutual customers,” said Jason Brown, Vice President and General Manager for Entrepix.” Their problem-solving approach and close engagement with end users make them an ideal partner to drive adoption of our DSS-200 platform,” added Brown.

“Entrepix has a great reputation for not only making a quality product but for innovation and technical problem solving’” said Nat Weil, President of CWI Technical Sales. “The applications in the Eastern US are diverse technically, and driven by trends like optical interconnect, defense, aerospace and others – the DSS platform is uniquely positioned to provide the performance and reliability that these customers demand,” added Weil.

Learn more about CWI Technical Sales here: https://www.cwitechsales.com/.

AURORA, CO ― May 2026 ― AdvancedPCB has completed the installation of two Falcon small-hole drilling systems from Schmoll Maschinen GmbH at its U.S. facilities in Maple Grove, Wisconsin and Santa Clara, California.

The investment is part of the company’s 2026 Technology Acceleration Initiative, focused on advancing precision circuit board fabrication capabilities to support increasingly complex designs and substrate applications.

Designed for high-precision microdrilling, the Falcon Series addresses the growing demands of substrate manufacturing, including smaller hole diameters, tighter tolerances, and higher hole counts. The systems combine high-speed spindles reaching up to 300,000 rpm with advanced linear drives and CNC control technology to deliver consistent accuracy and repeatability.

With accuracy down to ±12-15 µm (CpK > 1.67) and temperature-controlled processing, the Falcon systems are built to maintain stability during long production runs. Additional features such as CCD alignment and automated collet cleaning support reliable, high-quality output across a range of advanced materials.

By adding these systems in both Midwest and West Coast operations, AdvancedPCB is enhancing its ability to support high-density and substrate-driven applications while improving process consistency and throughput across its U.S. facilities. These capabilities further position AdvancedPCB to meet the stringent quality and reliability requirements of industries such as aerospace and defense, AI and data centers, medical technologies, and robotics.

AdvancedPCB’s 2026 Technology Acceleration Initiative includes coordinated investments across multiple U.S. facilities to expand advanced fabrication technologies, increase capacity, and elevate support for next-generation electronic systems.

For more information, visit www.AdvancedPCB.com.

DOWNERS GROVE, Ill.  -- SWEP, part of Dover (NYSE: DOV) and a world-leading supplier of brazed plate heat exchangers (BPHEs), today announced a partnership with Microchannel Devices (MCD) to expand SWEP's market offering with printed circuit heat exchangers (PCHE).

Both companies provide high-performing heat exchangers designed to optimize system efficiency, reduce footprint, and support more sustainable energy solutions. MCD's printed circuit technology complements SWEP's brazed plate technology and further enhances its portfolio of energy-efficient solutions.

"This partnership provides SWEP access to complementary products, while MCD benefits from accelerated market reach through SWEP's global sales channels and strong customer relationships. Our collaboration is a valuable opportunity to strengthen SWEP's position in existing markets and enhance our ability to serve customers through an expanded BPHE offering," says Ulrika Nordqvist, SWEP President.

SWEP and MCD share a strong commitment to the green energy transition and market development in areas such as hydrogen infrastructure, energy storage, and CO2 applications. The partnership enhances SWEP customer value by leveraging expanded application and technical expertise to meet demanding development requirements, particularly in applications characterized by space constraints, ultra-high working pressures, and extreme temperatures.

Through the buy-resell agreement, SWEP customers will gain access to a broad portfolio of ultra-compact heat transfer solutions through their trusted, long-term business partner, ensuring seamless dialogue and established procurement processes. The expanded PCHE offering is supplied by MCD, an Italy-based specialist in chemical etching, which delivers high-quality, certified PCHEs through its patented diffusion bonding and fully integrated design, production, and testing capabilities.

Canton, MA — April 2026 — Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026), taking place April 28–30, 2026, at the Renaissance Los Angeles Airport Hotel.

Recognized as the premier event focused on the design, reliability, and application of electronic components for aerospace, defense, and space systems, CMSE 2026 brings together leading engineers, technologists, and innovators to address the industry’s most pressing technical challenges.

As part of the conference’s Day 1 technical program, Chandra Gupta, Director of Business Development at Remtec, will present “Innovative Ceramic Sub-Mounts and Heat Spreaders.” His session will explore advanced thermal management strategies critical to improving the reliability and performance of high-power electronic systems.

High-power semiconductor devices—such as amplifiers and DC-DC converters—face significant thermal challenges that can impact performance and long-term reliability. Dr. Gupta’s presentation will address how advanced ceramic materials and engineered sub-mount designs can dramatically improve heat dissipation, reduce thermal resistance, and extend mean time before failure (MTBF) in mission-critical applications.

“CMSE is one of the most important technical gatherings in our industry because it brings together the people who are solving the toughest reliability challenges in aerospace, defense, and space electronics,” said Mr. Buyea. “For Remtec, it’s an opportunity not just to showcase our technology, but to contribute to the collective advancement of high-performance, high-reliability electronic systems. The conversations that happen here—especially around thermal management and materials innovation—are critical to the future of our industry and the systems that depend on it.”

CMSE 2026 is designed to foster deep technical engagement through high-quality presentations, keynotes, and interactive discussions. The event also plays a vital role in educating the next generation of engineers, ensuring the continued advancement of technologies that support national defense and space exploration.
Remtec’s participation underscores its commitment to solving complex thermal and reliability challenges through advanced materials and integrated manufacturing solutions.

About Remtec

Remtec is a leading provider of advanced ceramic substrates and microelectronic assembly solutions, specializing in high-performance applications where thermal management, reliability, and signal integrity are critical. Leveraging proprietary technologies such as plated copper thick film (PCTF®), Remtec delivers solutions using materials like alumina and aluminum nitride to support demanding environments across aerospace, defense, telecommunications, and power electronics.

From substrate design to fully integrated assembly—including die attach, wire bonding, and system-level integration—Remtec provides end-to-end solutions that help customers improve performance, reduce risk, and accelerate time to market. With a strong focus on engineering collaboration and innovation, Remtec continues to push the boundaries of what’s possible in high-reliability electronics.