Atlanta – ECIA’s 2025 Executive Conference Committee is pleased to announce that the program for the October conference is complete. The theme for this year’s conference is ‘Amped UP, the Power of Tomorrow.” The 2025 Executive Conference takes place October 19-21, 2025, at a NEW LOCATION, the Westin O’Hare Hotel.
"The 2025 ECIA Executive Conference Core Committee was inspired by the rapid advancements in technology shaping the electronics industry and selected a theme that captures the opportunities ahead,” explained Maryellen Stack, Director of Marketing Communications, Sager Electronics, and this year’s conference chair. “‘Amped Up. The Power of Tomorrow.’ is more than just a theme—it’s a call to action. It reflects the energy, transformative innovation, collaboration, and resilience driving our future. We are committed to delivering a conference that not only tackles the hard topics but also ignites—and powers—new ideas to lead our businesses forward.”
The conference committee considers survey results, feedback from previous years’ attendees, and current market conditions when selecting a theme. With supply chain disruptions, tariff uncertainty and geopolitical upheaval top of mind for strategic planners, theme selection was particularly important.
“Now that the conference program and speakers are finalized, the work of the Speaker Vetting committee really ramps up,” noted Stephanie Tierney, ECIA's Director of Marketing Communications and Member Engagement. ”They must work with each of the speakers to fine tune and prep the presentations to ensure that the topics are specific to our industry and the content flows together logically and doesn’t overlap or repeat. The theme sets the agenda reflecting the excitement of collaboration in our future. The 2025 Executive Conference Core Committee is working hard to deliver a top-notch experience.”
Sponsorships are filling fast! This Conference offers personal access to industry experts, ample time to discuss important issues and critical networking opportunities. Spotlight your company by becoming a sponsor. Several sponsorship levels are available as well as the opportunity to support a particular event or session.
Contact Stephanie Tierney: This email address is being protected from spambots. You need JavaScript enabled to view it. for more information or visit the sponsorship page.
Visit the conference website for more information.
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
In this newly established role, Dr. Bhatkal will report to the Executive Vice President of MacDermid Alpha Electronics Solutions and spearhead strategic initiatives to accelerate business growth and transformation in the Indian market, collaborating closely with global business and commercial leaders. His mandate aligns with India’s national priorities to build a robust and self-reliant electronics manufacturing ecosystem, supported by key government programs such as the Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM), which aim to attract investment, boost local innovation, and strengthen supply chain resilience. Dr. Bhatkal brings over two decades of leadership across the electronics, advanced materials, and energy sectors. He most recently led commercial operations in India for the Semiconductor Assembly Solutions division and has held senior roles including Vice President, Energy Technologies, and Managing Director, India, at Element Solutions Inc,. Renowned for driving transformation and building high-performing teams, he has consistently delivered strategic growth and operational excellence.
He serves on the board of iNEMI and advises leading institutions including IIT Madras and the Central Manufacturing Technology Institute. Dr. Bhatkal holds a Ph.D. and M.S. in Materials Engineering and an MBA. He is also a published author and co-inventor on multiple patents.
“Ravi’s appointment marks a pivotal step in advancing our long-term growth strategy for India,” said Julia Murray, Vice President, Global Marketing Communications. “His in-depth understanding of the Indian market, combined with a global perspective and passion for innovation, makes him the ideal leader to drive strategic progress in this critical region.”
This new role reflects MacDermid Alpha’s commitment to expanding its presence in India and delivering long-term value to customers and partners in the region. It also reinforces the company’s intent to actively contribute to India’s vision of becoming a global hub for electronics system design and manufacturing (ESDM).
Abstract submission will open on August 18, 2025, and the deadline for submissions is October 6, 2025. For all details and to submit an abstract, please visit the ECTC 2026 Call for Papers.
The ECTC 2026 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, chiplet architectures, hybrid bonding, WLP and PLP, fan-out and fan-in packaging, flip chip technologies, integrated photonics and optoelectronics, LEDs, 5G, quantum computing and systems, and other emerging technologies in electronics packaging.
Previously unpublished, non-commercial paper abstracts are requested in areas including:
Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.
The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.
An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.
TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.
The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.
Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.
The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.
An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.
TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.
The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.
THAILAND – Ventec International Group has confirmed its agreement with Jinzhou Precision Technology Corporation to distribute precision drill and router bits in the Europe, Middle East, and Africa (EMEA) region, working in cooperation with DCM Technology, Jinzhou’s long-standing European distribution partner. Jinzhou Precision Technology is a globally recognised leader in PCB tools and micro-tools, with over 30 years’ experience in the field. The company was the winner of the National Microdrill Champion Enterprises Award and currently produces 70 million machine-tool bits per month, including drills and routers down to 0.01mm for advanced high-density applications.
“Our agreement with Jinzhou Precision Technology & DCM Technology allows us to offer a comprehensive selection of bit types and sizes, for fast delivery from regional inventory, all of the highest quality with proprietary coating options to ensure tools retain their edge and maintain the utmost accuracy for longer,” said Mark Goodwin, COO of Ventec. “Investing in the best drilling and routing products, from the world’s largest manufacturer, delivers tangible dividends for our customers by delivering sustained productivity and quality gains.”
Accurate drilling and routing are essential to ensure high production quality, seen in perfectly formed electrical and thermal vias, component mounting points, panelisation, board profiling, cutouts, and slotting. Jinzhou Precision high-quality bits ensure consistent accuracy, and the range includes extremely fine-diameter drill bits, with longer flute lengths that are needed to produce today’s most advanced high layer count HDI boards. The tools also ensure long service lifetime when operated up at high cutting speeds, maintaining fast and repeatable cycle times. Choosing Jinzhou Precision from Ventec & DCM for enduring integrity and sharpness empowers PCB makers to drive up throughput and productivity.
Ventec’s new agreement with Jinzhou Precision Technology &DCM Technology strengthens the company’s one-stop supply commitment, which also assures customers of premium PCB laminates, prepregs, machinery, consumables, and precision tools, all available for fast delivery from inventory a single trusted supplier. Ventec’s technical team provides guidance on selecting and using the materials and tools to ensure compatibility and optimum throughput to maximize manufacturing efficiency and quality.
Also supported by Ventec’s worldwide distribution network, customers can rely on fast dispatch, efficient shipping, and consistent delivery performance to ensure their PCB manufacturing operations are always on track.
