Chandler, AZ - Rogers Corporation’s (NYSE:ROG) Advanced Connectivity Solutions team will be presenting the latest developments in printed-circuit-board (PCB) materials for emerging high-frequency applications at the upcoming IPC APEX EXPO 2018 (http://www.ipcapexexpo.org), Feb. 27 – March 1, 2018 at the San Diego Convention Center.
Read more: Rogers Corporation to Showcase Advanced Connectivity Material Solutions at IPC Apex Expo 2018
Mulino, OR February 14, 2018 – Sunstone Circuits®, the leading printed circuit board (PCB) solutions provider for prototypes, medium volume and production quantities, recently attended, sponsored and judged a competition category at MakeHarvard, the first engineering hackathon held at the historic Harvard University.
Read more: Sunstone Circuits® Attends and Sponsors MakeHarvard
BANNOCKBURN, Ill., USA, February 14, 2018 — IPC — Association Connecting Electronics Industries® announced today that all 149,700 sq. ft. of exhibit floor space has sold out for IPC APEX EXPO® 2018, making it the largest IPC APEX EXPO in the last decade.
Read more: Show Floor Sells Out for IPC Apex Expo 2018
SCHAFFHAUSEN, Switzerland and SAN FRANCISCO, CA (February 14, 2018) -- TE Connectivity (TE), a world leader in connectivity and sensors, and SnapEDA, the Internet’s first parts library for circuit board design, are collaborating to make more than 25,000 new digital models available to electronics designers, helping them bring their products to market faster.
Read more: TE Connectivity Releases Over 25,000 New Digital Models in Collaboration with SnapEDA