Press Releases

SOUTHINGTON, CT – Uyemura has announced an important field promotion, and a new addition to its Connecticut Tech Center Engineering Team. Both actions are in support of the company’s increasing focus on IC substrates, and its role as a supplier to wafer manufacturers, semiconductor fabs and PWB customers.

Russ Schwartz, a Uyemura Senior Mechanical Engineer with 20+ years experience, has been promoted to Project Engineer. Prior to joining Uyemura, Schwartz worked in every stage of wafer fabrication during tenures at Intel and Motorola. In his new position, he will qualify and maintain process lines, assure chemistry performance, and provide mechanical expertise for the design and installation of Uyemura equipment.

Steve Medd is also a veteran of the semiconductor industry, with 15 years experience. At IBM and Entegris, he held posts in applications engineering and process engineering, respectively. In his new position as Uyemura Support Engineer, he provides customer support at the Tech Center metallurgical lab.

HSINCHU – As climate change intensifies, governments worldwide are taking proactive measures to achieve sustainable development goals. In response to this challenge, the Thai government plans to achieve carbon neutrality by 2050 and net-zero emissions by 2065, introducing the Bio-Circular-Green Economy (BCG) model as one of the national development strategies. To accelerate the local industry's transition to net-zero emissions, the Industrial Technology Research Institute (ITRI) and Thailand's National Science and Technology Development Agency (NSTDA) are collaborating to host the "ITRI - NSTDA Joint Seminar" on February 27. The seminar will focus on leveraging innovative technology to drive the bio-circular-green economy, cultivating industries' capabilities for achieving net-zero emissions in the future.

ITRI points out that ASEAN countries such as Thailand and Vietnam have emerged as new global manufacturing hubs, attracting numerous Taiwanese companies for investment. According to customs data, bilateral trade between Taiwan and Thailand has reached $16.238 billion in 2023, with Thailand ranking as Taiwan's 13th largest trading partner. Industries such as printed circuit boards and electric vehicles are flourishing, bringing immense potential for the developments in net-zero emissions and the green economy. The "ITRI - NSTDA Joint Seminar" has invited ITRI President Dr. Edwin Liu and NSTDA President Prof. Sukit Limpijumnong to deliver keynote speeches, sharing their insights on the green economy and sustainable development. Additionally, David Lai, Secretary-General of the Taiwan Printed Circuit Association, will present sustainable development plans for the printed circuit board industry. The seminar will explore three major technological aspects, including sensor technology and applications, smart manufacturing, and hydrogen energy technology applications, creating more cooperation opportunities for both sides.

The "ITRI - NSTDA Joint Seminar" will take place on February 27 at the Thailand Science Park in Pathum Thani. The seminar aims not only to present the key research areas of both ITRI and NSTDA, but also to create a platform for Taiwanese and Thai enterprises to explore further collaboration opportunities for achieving green economy. Registration link: NSTDA-ITRI Joint Seminar 2024

CAMBRIDGE, UK – Electromagnetic interference shielding is becoming more adapted to the meet demands of growing communications technology. Personal devices are everywhere. As they get thinner, the components in each device are getting closer together, and EMI shielding is becoming well-known as the mastermind.

Delicate signal

People are drawn to the latest smartphones for their up-to-date technology and high-quality communication. 5G network connections bring a faster data range, but what people don’t realize is that these high frequencies are much more delicate. EMI shielding works to prevent even the slightest interference.

The process of EMI shielding is now done on such a small scale that it allows phones to be smart and sleek, leaving bulky devices too big for pockets in the past and making them more streamlined. Where shielding used to be done on a larger yet more simplified scale, it is changing to make way for what the technology markets demand and is proving successful, so much so that the average consumer might not even be aware it exists.

Smooth talking

Mobile phones are becoming neater and more aesthetically pleasing each year, and the modernity extends itself to the hidden technology too. Where antennas used to be large and rather obvious parts of a phone, they are now small enough to fit inside and even do a better job than they used to.

This means other components, such as radio frequency chips, need even sturdier shielding to not interfere with the antenna’s functioning.

Board-level shielding using metallic box-shaped enclosures has been used for a long time to prevent electromagnetic signals from interfering with antennas. However, conformal package-level shielding is expected to become widespread in the coming years as system-in-package architectures become more present in miniaturized commercial electronics. To achieve this, it is imperative that the shielding materials not only have high conductivity and shielding effectiveness but are also low-cost to procure and are compatible with standard scalable deposition techniques.

With increasing frequencies being able to attain quick and high-quality signals, shielding is working to match up to the delicate nature of these frequencies. Developments are on the horizon for new ways to shield these parts using intricate spray techniques and the introduction of metallic inks, such as silver, that offer stronger and particle-free protection. These shiny new techniques could one day replace the tiny boxes made with plastics and metals that are already in use. Selective deposition could offer even more precise shielding and allow for the further miniaturizing of devices without compromising effectiveness.

The developments of EMI shielding have had to keep up with the rapid changes in mobile phone design, demonstrating just how capable and fast-paced this technology can be. While it may have been overlooked in the past, it is gaining recognition as devices require higher frequencies and benefit people every day. Its compatibility with changing trends proves that the materials and techniques used in the process are good at adapting and are becoming more reliable.

For more information, please see the IDTechEx report, “EMI Shielding for Electronics 2024-2044: Forecasts, Technologies, Applications”.

WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.

The incentives, which are part of the CHIPS and Science Act, will support three GlobalFoundries manufacturing projects in New York and Vermont. The Commerce Department previously announced incentives for Microchip Technology and BAE Systems.

“The significant semiconductor manufacturing incentives announced today will help advance U.S. chip production and reinforce America’s economic and national security. We congratulate GlobalFoundries for investing ambitiously in these projects and salute the Commerce Department’s ongoing work to begin getting critical CHIPS Act incentives out the door. The CHIPS Act is working, and SIA stands ready to continue to work with government leaders to ensure the law’s landmark manufacturing and research provisions deliver maximum benefits to U.S. chip production, innovation, and supply chain resilience for many years to come.”

The CHIPS Act’s manufacturing incentives have already sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling more than $220 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 40,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

PETACH TIKVA, ISRAEL - Eltek Ltd. (NASDAQ:ELTK), a global provider of printed circuit board solutions, has priced an underwritten public offering of 625,000 ordinary shares at $16.00 each, aiming to raise $10 million before fees and expenses. The offering is slated to close on February 15, 2024, contingent upon customary closing conditions.

ThinkEquity is the sole book-running manager for the transaction. Eltek plans to allocate the net proceeds towards expanding its production capabilities and for general corporate needs, including working capital.

The shares are being offered pursuant to a shelf registration statement on Form F-3, filed with the U.S. Securities and Exchange Commission (SEC) and effective as of August 5, 2022. Prospective investors are advised to consult the prospectus supplement and accompanying prospectus filed with the SEC, which detail the offering's terms.

Eltek, established in 1970 and headquartered in Israel, specializes in the production of complex and high-quality printed circuit boards, catering to the defense, aerospace, and medical sectors among others. The company operates internationally, with a subsidiary in North America and agents across Europe, India, South Africa, and South America.

FREUDENSTADT, GERMANY – Calumet Electronics (Calumet), a leading American printed circuit board manufacturer is pioneering the domestic production of advanced packaging substrates. The current development and onshoring of this technology are the direct result of a strategic partnership with Schmid Group (Schmid), a top global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries. This collaboration marks a significant step in advancing substrate technology within the United States (US) and complements the recent government grant awarded to Calumet by the US Department of Defense under DPA Title III.

Through this strategic partnership, Calumet and Schmid are working collaboratively to scale domestic production capacity for advanced substrates. Schmid is providing innovative equipment, while Calumet is taking the lead in expanding its manufacturing capabilities. Together, they are aligning their efforts with construction milestones to establish the first-ever US-based advanced substrate facility.

Key Highlights:

  1. Dedicated US-Based Advanced Technologies Facility: Calumet is currently standing up a 60,000 sq. ft. state-of-the-art manufacturing facility dedicated to advanced substrate production. This landmark facility represents a significant milestone as the first of its kind in the US, poised to advance substrate technology and enhancing the nation’s capabilities in advanced packaging.
  2. Enabling Next-Gen Technology: The project will implement cutting-edge process and production technology, enabling the production of mSAP, SAP and (ET) embedded trace on a single versatile platform.
  3. Environmental and Fiscal Responsibility: Calumet and Schmid’s R&D teams are collaborating across enterprises to develop a modular, space-efficient approach that maximizes environmental conservation, process efficiency, and cost savings while minimizing costly cleanroom footprints.
  4. Substantial Capital Investment: The project is projected to attract a total capital investment of nearly $50 million. This substantial investment underscores the dedication to strengthening the US supply chain for microelectronics and printed circuit boards.
  5. Government Support: Calumet received a significant investment from the US Department of Defense, which awarded them $39.9 million via the DPA Title III Program. This grant empowers Calumet, in collaboration with Schmid, to enhance manufacturing capabilities and contribute to national security.
  6. Workforce Development: The partnership between Calumet and Schmid is driving technological advancements while focusing on upskilling the US workforce. By establishing advanced packaging and substrate manufacturing within the US, this collaboration creates sustainable jobs and strengthens domestic expertise.

At the forefront of the next-gen technology, advanced packaging and substrates are driving advancements in miniaturization, integration, performance, thermal management, high frequency capabilities, speed, and energy efficient components and systems. Engineered to cater to the specific requirements of high-performance systems, advanced substrates play a pivotal role in enhancing functionality and efficiency. This is poised to shape the future of advanced packaging technology in the US, uniting these two industry leaders for this purpose.

“The partnership between Calumet and Schmid signals a significant leap forward in advanced packaging and substrate technology, further enhancing the United States’ competitive position in the global market”, affirmed Stephen Vairo, President, and Chief Executive Officer of Calumet Electronics.

Christian Schmid, Schmid Group Chief Executive Officer, added “We are pleased to partner with Calumet to streamline the traditional lab-to-fab transition, in alignment with our shared mission as innovators and sustainable partners to the industry. We will create a lighthouse project in Calumet for the reshoring of technology and production to the US”.

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