October 10, 2022 – Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that Chad Wood has joined the company’s US team. As Director OEM Sales & Business Development, Chad will drive business development, sales & support services for OEM customers predominantly in the Western region of the USA. His focus will be on Ventec’s core automotive, mil/aero, medical, lighting and network technology market segments, which typically require reliable thermal management materials (such as Ventec’s tec-thermal range) as well as high-speed and high-frequency material solutions (tec-speed).
Chad joins Ventec as an experienced technical sales leader who has worked in the electronics and semiconductor industries for more than 28 years. Since 2009, Chad has been involved in developing industry leading thermal solutions for the most demanding applications that require sustainable and reliable materials that optimize product performance for tier-1 OEMs in the automotive, lighting, power and industrial, and telecom/datacom markets. From his home base in southern California, Chad will focus on bringing design wins and qualifications for all Ventec products from customers in the western region of the USA. He will also be responsible for Ventec's manufacturer rep sales teams on the west coast.
Chris Hanson, Global Head IMS Technology at Ventec comments: ‘Chad brings with him strong relationships with decision makers at the OEM and fabricator level. To support our continued growth, driven by a significant rise in demand for our solutions in the USA and beyond, our expanding team ensures that we continue to provide industry-leading technical support services. We are delighted to welcome Chad to Ventec as our latest member of the OEM sales team.’
Ventec International is a world leader in the production of polyimide & high-reliability epoxy laminates and prepregs and a specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com.
About Ventec International Group
Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support network. For more information, visit www.venteclaminates.com.
SAN FRANCISCO, CA (September 28, 2022) - Today, SnapEDA, the first search engine for electronics design is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners, includes electronic component distributors, printed circuit board (PCB) tool makers, and engineering media sites.
The SnapEDA Syndication Network connects the electronic designers and engineers who are at the heart of the electronic industry with design content for millions of electronic components.
This content helps engineers design faster, grows revenue and loyalty for distributors, and allows chip and component manufacturers to get valuable design wins.
Over 80% of engineers that download SnapEDA’s design content purchase the product. This creates a competitive advantage for electronic component distributors and manufacturers that are a part of SnapEDA’s network, enabling them to win sales earlier in the design process.
Global spending on digital transformation is expected to reach an all-time high of $6.8 trillion in 2023. As a result of the global pandemic and a heightened demand for self-serve component selection tools, component manufacturers are increasingly investing in digital demand generation technologies. In addition to helping engineers find the parts they need, SnapEDA uniquely translates this demand into seamless design-ins, securing the win for component manufacturers.
“Before meeting SnapEDA we were very reactive with our CAD models and only provided them once they were requested. In today’s self-service approach to design, that strategy is no longer effective. SnapEDA has helped us to not only proactively provide CAD models for over 1 million of our products, but also to reach millions of engineers worldwide via their Syndication Network” Said Daniel Williams, CIO at Samtec.
“At SnapEDA, our mission is to help engineers design electronics faster so they can spend more time innovating. By providing our trusted design content everywhere - including the world’s leading distributors and PCB tools - we’re able to boost productivity for even more engineers worldwide for a frictionless design flow” said Natasha Baker, CEO and Founder of SnapEDA.
Partners in the network include Digi-Key, Autodesk Fusion360, RS Components DesignSpark, Cadence, Mouser, Zuken eCADSTAR, Distrelec, Online Components, Master Electronics, Octopart, DipTrace, Proteus, TraceParts, IHS Markit, PartsBox, Semikart, Devicemart, ExpressPCB, TARGET 3001!, Cadenas, Electronics Lab, Seeed Studio, Inventhub, OEM Secrets, Cofactr, Sourceability, Endeavor Business Media and PCBWay. Five new partners are signed and scheduled to launch in the coming months.
Engineers can also auto-import CAD models with SnapEDA plugins for Altium, KiCAD, Eagle, and PCB123. Supported content includes schematic symbols, PCB footprints, and 3D mechanical models for millions of manufacturer’s parts. This content is compatible with over 20 PCB design formats.
Learn more and join the SnapEDA Syndication Network at https://insights.snapeda.com/syndication.
About SnapEDA
SnapEDA helps engineers design electronics faster by removing barriers. Over one million electronics engineers and PCB designers use its search engine for electronics design each year, creating everything from medical devices to automotive electronics. By providing ready-to-use building blocks for design, including symbols and PCB footprints, its library shaves days off product development, allowing designers to focus on optimization and innovation. SnapEDA’s models are created using proprietary and patented creation, verification, and translation technology. Learn more at www.snapeda.com.
Smaller circuits with greater functionality are possible with the advanced circuit materials developed by Isola Group and being shown at the PCB West 2022 Exhibition on Wednesday, October 5, 2022 at the Santa Clara Convention Center in Santa Clara, CA. Combining laminate and prepreg materials optimized for power, RF/microwave, and high-speed-digital (HSD) circuits results in miniaturized and efficient multilayer mixed-signal assemblies that can fit the tightest places and provide the high performance and diverse functionality needed for modern electronic products. Isola’s representatives will offer guidance on the most effective use of their materials, whether for high-volume commercial applications or aerospace and defense (A&D) systems chasing reduce size, weight, and power (SWaP) requirements.
For more than 30 years, the PCB West Conference & Exhibition has linked suppliers and users of printed-circuit-board (PCB) materials. The 2022 edition features the one-day exhibition as well as a highly educational conference scheduled from October 4-7, 2022 aimed at both designers and manufacturers of analog, digital, and hybrid mixed-signal PCBs. More than 2500 visitors are expected to attend the one-day exhibition to gather information from more than 100 exhibitors. Isola Group has reserved Booth #XX on the PCB West 2022 exhibition floor.
With manufacturing facilities in Europe, Asia, and multiple sites in the U. S., Isola is truly a global circuit material developer and manufacturer offering assurance of consistent and dependable supply chains. Backed by robust design and manufacturing service capabilities, the company is constantly evolving and enhancing its product lines for greater ease of manufacturing even for hybrid, mixed-signal designs, employing straightforward baseline FR-4 manufacturing processes for many of its circuit materials. Laminate and prepreg materials cover a wide range of applications spanning aerospace and defense, automotive and transportation, communications, computing, industrial, medical, RF/microwave, and test and measurement systems.
Isola materials at the PCB West 2022 Exhibition include circuit materials that are designed to be used together in hybrid mixed-signal circuits but also to be processed tother with well-established methods, such as material processes used for FR-4. Examples include lead-free-compatible (RoHS-compliant), standard-loss 370HR materials and I-Tera® MT40 low-loss materials for higher-frequency circuits. Based on a patented, multifunction epoxy-resin formulation, 370HR materials support compact circuit designs with high-density interconnections while delivering high thermal reliability from -55 to +125°C. It has a typical dielectric constant (Dk) of 4.17 through the thickness (z-axis) at 1 GHz, decreasing lightly with frequency to 3.92 at 10 GHz. 370HR materials exhibit standard loss, with dissipation factor of 0.0161 at 1 GHz and 0.0250 at 10 GHz
For multilayer circuits requiring lower loss at higher frequencies, I-Tera® MT40 circuit materials has lower Df of typically 0.0028 at 2 GHz and 0.0035 at 10 GHz, with typical Dk through the z-axis of 3.45 at both 2 and 10 GHz. Its thermal characteristics are like those of 370HR, and it can be transformed into PCBs with standard FR-4 manufacturing processes. For extremely low loss at higher frequencies and in HSD circuits, Astra® MT77 has Dk of typically 3.00 at 2 and 10 GHz which remains at that value even with large swings in temperature. It has low Df of 0.0017 at 2 and 10 GHz and is manufactured with the same FR-4-like processes applied to 370HR and I-Tera MT40 materials.
These are several examples of the manufacturing-process-compatible circuit materials on display at the Isola booth at the PCB West 2022 Exhibition. The materials are available as laminates with a wide selection of copper weights and as prepregs, as dielectric materials without metallization. Compatible with FR-4 manufacturing processes, the materials maintain consistent performance across operating temperatures from -55 to +125°C with the high interconnect density needed tor modern circuit miniaturization. For more information about any of these materials, please see Isola at the PCB West 2022 Exhibition on October 5, 2022 or visit the Isola website at www.isola-group.com.
About Isola
Isola Group (www.isola-group.com) is a leading global developer and supplier of advanced electronic circuit materials for high-voltage, high-power, high-speed, and high-frequency PCBs. By performing ongoing R & D on emerging circuit applications, such as military radar and EW systems, commercial 5G communications networks, and vehicle electronification, and operating a network of global factories, Isola provides cost-effective, high-performance solutions for the most challenging electronic single-layer and multilayer PCB applications.
Auction to Feature Printed Circuit Board Manufacturing Equipment & Plant Support Equipment
Scarborough, Ontario Canada –Surplus Solutions, LLC a Global Industrial Auction Company, in conjunction with Infinity Asset Solutions will conduct A Major Online Auction to sell the assets of Milplex Circuit Canada, Inc. located at 70 Maybrook Drive, Scarborough, (Toronto) Ontario Canada.
Milplex Circuit (Canada), Inc. was an industry leader in the fabrication of thermally conductive Printed Circuit Boards. They had the expertise to fabricate single sided, double side, multilayer, and sequential lamination multilayer thermally conductive constructions. Milplex also provided aluminum copper backed or aluminum and copper core solutions. The Online Auction will open on Monday, October 17th, 2022 and will begin closing on Thursday, October 20th, 2022 at 11:00 AM EST. There will be a preview & inspection open to the public on Monday, October 17th from 9:00 a.m. - 4:00 p.m.
• Much More, Invenory, Raw Material, Over 350 Lots
According to Jason Hayne Vice President at Infinity Asset Solutions “the Milplex Circuit Canada Online Auction will provide buyers a unique opportunity to purchase Printed Circuit Board Manufacturing Equipment & Plant Support Assets at a reduced cost with no delays. All of the assets are available immediately with no supply chain issues or any delays. The 50,000 Sq Ft Facility is packed with Printed Circuit Board manufacturing equipment as well as a large quantity of plant support Assets”.
Auctioneer accepting Pre Auction offers on major equipment. All interested parties can find full auction details including equipment listings, photos, videos, lot catalog, and bidding instructions (Create Hyper Link Here) https://infinityassets.com/milplex-circuit-canada-inc-surplus-to-the-ongoing-operations.html
About: Surplus Solutions, LLC is a recognized leader in surplus industrial machinery and equipment auctions and valuations. Our certified and experienced auctioneers and appraisers value and sell business equipment, entire manufacturing plants, complete warehouses, real estate or intellectual property (IP) across a diverse array of industries. (www.ssllc.com)
Contacts
Surplus Solutions, LLC
Seth Tavares, 401-526-0051
Director of Marketing
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PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Wilmington, Del. Sept. 15, 2022 – Today DuPont announced the launch of a new brand, Micromax™, that will encompass the products formerly under the Microcircuit and Component Materials brand. Micromax™ products are used in a wide variety of electronics applications—from automotive, passive components, and 5G communications to healthcare and consumer goods.
“Micromax™ aims to be the leading brand for electronic thick film inks, pastes, and ceramic tapes,” said Tim Chang, Micromax™ global business leader. “The new brand name won’t impact our offerings or how we work with customers. Our high-quality products, exceptional customer service, and broad-based expertise remain the same. It will simply be faster and easier to identify our offerings.” Micromax™ organizes nearly 800 products under a single cohesive brand, simplifying how distributors and customers can identify and specify their preferred products. The changes include:
• GreenTape™, which will now be known as Micromax™ GreenTape™
• Heatel™, which becomes Micromax™ Heatel™
• Intexar™ which becomes Micromax™ Intexar™
• Fodel™ which becomes Micromax™ Fodel™
Because they’re tailored in close partnership with clients, Micromax™ products enable extremely customized solutions. With extensive knowledge of materials science and a breadth of electronics experience, the Micromax™ team helps customers imagine what others don’t, test what others can’t, and deliver true innovation that can positively change markets and improve our world.
To learn more about Micromax™, please visit https://www.mobility-materials.com/brands/micromax.html.
About Micromax™
Micromax™ is a leading brand of printable, stretchable, and moldable functional thick film inks, pastes and ceramic tapes. Micromax™ brand products are utilized for circuitry, interconnection and packaging of electronic devices in automotive, passive components, telecom, consumer electronics, healthcare and military applications featuring properties such as enhanced circuit density, improved thermal management, higher reliability and other critical functionality. Micromax™ represents over 60 years of experience in the development, manufacture and sale of specialized electronic materials, and offers leading global customer support and product quality and consistency.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
WILMINGTON Del., September 22, 2022 – DuPont (NYSE:DD) Interconnect Solutions, part of the Electronics & Industrial business, announced today a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles.
Integrating Pyralux® AP copper clad laminate into eMPack® traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. The characteristics of Pyralux® AP benefiting this application from Semikron-Danfoss include:
• Robust thermal resistance for temperature stability
• All-polyimide dielectric layer
• Extreme durability
• Excellent bond strength for automotive-grade reliability
• Excellent low dissipation loss characteristics
• Superior electrical performance
• Consistent signal integrity
Further, Pyralux® AP’s dielectric thickness tolerance and low coefficient of thermal expansion make it ideal for rigid flex or multiple layer flex applications. The adhesive-less flexible circuit material has a flammability rating of UL 94-V0, a maximum operating temperature of 200°C, and is certified to IPC 4204A/11.
"Pyralux® AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack® is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux® technology to help eMPack® become a global leader in EV power modules.”
Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack® power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD).
“We are excited how this EV power module application of Pyralux® AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack® power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack® and appreciate the collaboration with Semikron-Danfoss.”
About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products, and technical service to enable next-generation technologies.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
