Printed Circuit Design & Fab Online Magazine - Global Semiconductor Equipment Billings Dip 2%

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Printed Circuit Design & Fab Magazine

MILPITAS, CA – Global semiconductor equipment billings dipped 2% year-over-year to $25.8 billion in the second quarter, while quarter-over-quarter billings slipped 4%, SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

"Overall demand for capital equipment remains strong despite uncertainty that continued to pervade the macroeconomy in the first half of 2023," said Ajit Manocha, SEMI president and CEO. "During the report period, some semiconductor market segments exercised caution in making capital equipment investments, though the impact across regions varied."

Q2 Semiconductor Equipment Billings

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

Q2 Semiconductor Equipment Billings 2