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Cadence Introduces Allegro v. 16.5

Published: 25 April 2011

Allegro 16.5 printed circuit board and IC packaging software includes advanced miniaturization capabilities, integrated power delivery network analysis, DDR3 design-in kit, bolstered co-design features, and flexible team design. New features include constraint-driven flow for embedded components; seamless integration of Allegro Power Delivery Network Analysis and Allegro PCB Editor; faster PCB Interconnect Design Planning; package-board-aware DDR3 SoC IP methodology for a compliant, fast implementation path from silicon IP to package and board; links to Encounter Digital Implementation System and Virtuoso. Is configurable, to enable on-demand access to advanced features for specific design tasks.

Cadence Design Systems, www.cadence.com

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