Press Releases

FREUDENSTADT, GERMANY – Calumet Electronics (Calumet), a leading American printed circuit board manufacturer is pioneering the domestic production of advanced packaging substrates. The current development and onshoring of this technology are the direct result of a strategic partnership with Schmid Group (Schmid), a top global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries. This collaboration marks a significant step in advancing substrate technology within the United States (US) and complements the recent government grant awarded to Calumet by the US Department of Defense under DPA Title III.

Through this strategic partnership, Calumet and Schmid are working collaboratively to scale domestic production capacity for advanced substrates. Schmid is providing innovative equipment, while Calumet is taking the lead in expanding its manufacturing capabilities. Together, they are aligning their efforts with construction milestones to establish the first-ever US-based advanced substrate facility.

Key Highlights:

  1. Dedicated US-Based Advanced Technologies Facility: Calumet is currently standing up a 60,000 sq. ft. state-of-the-art manufacturing facility dedicated to advanced substrate production. This landmark facility represents a significant milestone as the first of its kind in the US, poised to advance substrate technology and enhancing the nation’s capabilities in advanced packaging.
  2. Enabling Next-Gen Technology: The project will implement cutting-edge process and production technology, enabling the production of mSAP, SAP and (ET) embedded trace on a single versatile platform.
  3. Environmental and Fiscal Responsibility: Calumet and Schmid’s R&D teams are collaborating across enterprises to develop a modular, space-efficient approach that maximizes environmental conservation, process efficiency, and cost savings while minimizing costly cleanroom footprints.
  4. Substantial Capital Investment: The project is projected to attract a total capital investment of nearly $50 million. This substantial investment underscores the dedication to strengthening the US supply chain for microelectronics and printed circuit boards.
  5. Government Support: Calumet received a significant investment from the US Department of Defense, which awarded them $39.9 million via the DPA Title III Program. This grant empowers Calumet, in collaboration with Schmid, to enhance manufacturing capabilities and contribute to national security.
  6. Workforce Development: The partnership between Calumet and Schmid is driving technological advancements while focusing on upskilling the US workforce. By establishing advanced packaging and substrate manufacturing within the US, this collaboration creates sustainable jobs and strengthens domestic expertise.

At the forefront of the next-gen technology, advanced packaging and substrates are driving advancements in miniaturization, integration, performance, thermal management, high frequency capabilities, speed, and energy efficient components and systems. Engineered to cater to the specific requirements of high-performance systems, advanced substrates play a pivotal role in enhancing functionality and efficiency. This is poised to shape the future of advanced packaging technology in the US, uniting these two industry leaders for this purpose.

“The partnership between Calumet and Schmid signals a significant leap forward in advanced packaging and substrate technology, further enhancing the United States’ competitive position in the global market”, affirmed Stephen Vairo, President, and Chief Executive Officer of Calumet Electronics.

Christian Schmid, Schmid Group Chief Executive Officer, added “We are pleased to partner with Calumet to streamline the traditional lab-to-fab transition, in alignment with our shared mission as innovators and sustainable partners to the industry. We will create a lighthouse project in Calumet for the reshoring of technology and production to the US”.

AUSTIN, TX – The competition is increasing in the OSAT space with Intel and Samsung offering OSAT services for silicon not fabricated in their foundry. TechSearch International examines high-performance packaging offerings from top OSATs and foundries with a score card for the options. This competition may be driven by the shortage in assembly capacity for AI packages used for training and inferencing. With increased capacity coming online for silicon interposers, chip-on-wafer (CoW) assembly, and high bandwidth memory (HBM), the assembly crunch is expected to ease by the end of the year. High Density Fan-Out (HDFO) using redistribution layers (RDL) instead of silicon interposers is emerging as an option.

It has been used for AMD’s machine learning and Apple’s high-end graphics computing station for several years, and automotive companies are exploring its use for future chiplet designs. Intel continues to use its embedded silicon bridge in a laminate substate. TechSearch International’s latest analysis describes AI market trends with a new market projection for training and inferencing packages.

The report analyzes build-up substrate supply and demand, finding no shortage in the overall industry. AI, server CPUs, and network switch packages continue to drive the growth in body size. With pull back in capacity plans and the growth in body sizes, supply and demand will become tight in 2028. Fortunately, the new plants coming online have higher yields. The report also examines the market for flip chip bonders used in fine pitch device assembly.

The electronics industry continues to burn through inventory, but this year’s decline in smartphone and PC shipments made it a difficult year, as reflected in OSAT financials. The outlook is brighter this year. OSAT financials are highlighted in the report.

The semiconductor industry is experiencing renewed attention from governments around the world. The report highlights some of the plans and list various incentives offered by governments globally. A list of U.S. government funded projects and programs, award winners, and activity is provided.

The latest Advanced Packaging Update is a 60-page report with full references and an accompanying set of more than 60 PowerPoint slides.

WASHINGTON – February 7, 2024 – In a letter signed by 54 microelectronics executives, IPC, the global association for electronics manufacturing, and the Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.

These funding sources are crucial to restore American leadership in the strategically vital printed circuit board (PCB) industry. The United States currently produces only four percent of the world’s supply compared to 30 percent at the turn of the century. PCBs are central to all electronics across all industries including defense, healthcare, telecommunications, aviation, and automotive.

The semiconductors funded by the CHIPS and Science Act gain functionality through their placement on PCBs. As chips have increased in sophistication, so too have the PCBs upon which they are placed. U.S. armed forces depend on PCBs found in everything from night vision goggles and drones to avionics and satellites.

“Semiconductor chips are powerful examples of modern innovation, but they require an electronic system to operate,” said John W. Mitchell, IPC president and CEO. “Chips have no functionality until they are packaged and placed on PCBs by electronics manufacturers who assemble systems. IPC and our member companies urge Congress to reinvigorate a domestic PCB industry that is critical to U.S. industrial resiliency, economic competitiveness, and national security.”

“America’s leadership in microelectronics has implications for our national and economic security,” said PCBAA Chairman Travis Kelly, “As they did with the CHIPS Act, Congress must invest in American printed circuit boards.”

For years, experts inside and outside of government have warned that the Department of Defense’s (DOD’s) reliance on a long and vulnerable supply chain creates unacceptable risk.

  • 2017: The Department of Commerce Bureau of Industry and Security issued a warning to DOD regarding the health of the PCB industry
  • 2018: The White House recommended that the DOD expand direct investment in the lower tier of the industrial base.
  • 2022: The Departments of Commerce and Homeland Security warned of serious risks because of the lack of PCB manufacturing and recommended investment incentives and funding of Title III of the Defense Production Act.
  • 2023: The House Select Committee on the United States Competition with the Chinese Communist Party recommended financial assistance programs for American PCB manufacturing and research. This was the first of 150 recommendations in their report.
  • 2024: The Department of Defense named microelectronics as a key area of risk for the defense industrial base.

For the full text of the letter, please visit https://emails.ipc.org/links/IPC-IndustryLetter_FY24Appropriations.pdf

PCB East, the electronics industry’s East Coast conference and trade show. Coming June 4-7 to the Boston suburbs. pcbeast.com

AUSTIN, TX – High Density Packaging User Group (HDP) is pleased to announce that Gold Circuit Electronics (GCE) has become a member.

"GCE is a top 25 printed circuit board manufacturer with top Fortune 100 OEM customers in the server, AI, data center, cloud, storage, switch, router, base station, telecom, automotive, industrial and medical markets supply. Our tech range has grown significantly in the last 5+ years to include a large percentage of business in the advanced tech space", said Joseph Beers, Senior Vice President at GCE. “Joining HDPUG is a strategic decision to increase our presence in this community and contribute, learn, and collaborate meaningfully to help our business alignment in the markets and with the customers we serve.”

"I am pleased to welcome GCE to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in PWB fabrication for high performance electronics, especially those focused on next- generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.

AUSTIN, TX – High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.

"Shikoku Chemicals has been developing distinctive copper surface treatment chemicals for PWBs and semiconductors by applying our unique organic synthesis technology, like OSP (Organic Solderability Preservative) and new chemical adhesion process between smooth copper and resin focus on the high frequency field. We look forward to working together with HDP members and hope to support cutting-edge technologies from around the world in various fields,” said Kazuhiko Yokoe, General Manager, Fine Chemicals Sale Dept. Sale & Marketing Division.

"I am pleased to welcome Shikoku to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in surface treatment chemicals for high performance PWBs, especially those focused on next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.

INGLESIDE, IL – IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sectors – has renamed its popular stock TTL ® 100 Series. Now called DuraTrack, the label series for printed circuit boards and electronic components provides printed circuit assemblies with comprehensive traceability – an increasingly attractive internal quality control and supply chain transparency feature for brand owners producing high-leverage electronics.

Engineered for use in surface mount technology and throughout the entire assembly process, DuraTrack thermal transfer printable labels can endure harsh fluxes, the latest cleaning chemistries, and high temperatures encountered in today’s circuit board assembly processes on both sides of the board.

The DuraTrack Series of labels is ideally suited to a wide array of electronics components manufacturing environments, including box builds, internal and external vehicle parts (such as in-cabin infotainment systems and outside sensors), and various other computer unit and PCB assembly settings.

Available in 61 sizes, in both high-performance polyimide and polyester, this off-the-shelf product is available for immediate delivery. The DuraTrack Series can also be customized for those customer applications that require an exact fit.

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