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NEWS

Amphenol Says Q1 Sales Up 8% YoY

Amphenol Says Q1 Sales Up 8% YoY

26 April 2017

WALLINGFORD, CT -- Amphenol today reported first quarter revenues rose 7.5% to $1.56 billion.  Read More...

DuPont Awarded Expanded Global Patents for Kapton

DuPont Awarded Expanded Global Patents for Kapton

26 April 2017

RESEARCH TRIANGLE PARK, NC – DuPont today announced that it has been granted patents in several additional countries related to its Kapton brand of black polyim...  Read More...

N. American Semi Equipment Billings Up 69% in March

N. American Semi Equipment Billings Up 69% in March

25 April 2017

MILPITAS, CA – North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March (three-month average basis), up ...  Read More...

Tech Issues Getting Bipartisan Support, ITI Says

Tech Issues Getting Bipartisan Support, ITI Says

25 April 2017

WASHINGTON – Key tech industry issues are receiving broad bipartisan support, according to the public policy trade group ITI. Successes include passage of perma...  Read More...

EMA Introduces E-Learning and OrCAD Certification

EMA Introduces E-Learning and OrCAD Certification

25 April 2017

ROCHESTER, NY – EMA Design Automation today announced the release of a new e-learning training platform to help OrCAD users improve proficiency with the toolset...  Read More...

Sanmina Posts Fiscal Q2 Revenue Up 4.3%

Sanmina Posts Fiscal Q2 Revenue Up 4.3%

24 April 2017

SAN JOSE, CA – Sanmina posted second fiscal quarter revenue of $1.68 billion, up 4.3% year-over-year and down 2.3% sequentially.  Read More...

Cadence Q1 PCB Revenue Up 18% YoY

Cadence Q1 PCB Revenue Up 18% YoY

24 April 2017

SAN JOSE, CA – Cadence Design Systems reported first quarter revenue at its System Interconnect and Analysis unit rose 18% from a year ago.  Read More...

Report: Wus Expects Big Jump in Profits

Report: Wus Expects Big Jump in Profits

24 April 2017

KUNSHAN, CHINA - Wus Printed Circuit said stronger sales would boost fiscal first-half net profits 164% to 263%, or 80 million to 110 million yuan ($11.6 millio...  Read More...

ITRI Develops Code of Conduct for Tin Mining, Smelting Ops

ITRI Develops Code of Conduct for Tin Mining, Smelting Ops

20 April 2017

HSINCHU, TAIWAN – ITRI and member companies developed an industry Code of Conduct designed for global tin mining and smelting operations, addressing the growing...  Read More...

HT Global Circuits Acquires Pho-Tronics

HT Global Circuits Acquires Pho-Tronics

20 April 2017

ST. PETERSBURG, FL – PCB manufacturer HT Global Circuits has acquired Pho-Tronics for an undisclosed sum.  Read More...

ITI: H-1B Visa Employees Valuable to US Tech Innovation

ITI: H-1B Visa Employees Valuable to US Tech Innovation

19 April 2017

WASHINGTON – In response to President Donald Trump’s executive order on the H-1B visa program, ITI issued a statement from President and CEO Dean Garfield on th...  Read More...

Semi Revenues Up 1% in 2016

Semi Revenues Up 1% in 2016

19 April 2017

MILPITAS, CA – Semiconductor revenues increased 1% in 2016 compared to 2015, according to the World Semiconductor Trade Statistics (WSTS), resulting in record r...  Read More...

Year-to-Date SEMI Equipment Billings Up 90% through Feb.

Year-to-Date SEMI Equipment Billings Up 90% through Feb.

19 April 2017

MILPITAS, CA – SEMI’s equipment billings year-to-date through February show more than a 90% gain compared to the same period in the previous year, reaching abou...  Read More...

Nelco, Neltec Laminates Units to Consolidate

Nelco, Neltec Laminates Units to Consolidate

24 April 2017

MELVILLE, NY -- Park Electrochemical announced its Nelco and Neltec laminates units will consolidate over the next four to six months.  Read More...

Flex Opens Design Center in Israel

Flex Opens Design Center in Israel

18 April 2017

HAIFA, ISRAEL – Flex opened a new design center here, inaugurated last month.  Read More...

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FEATURES

Managing Rule Checks

Managing Rule Checks

Performing manufacturability checks early to reduce time to market.  Read More...

Rhines: EDA's Big Q4 Might Not be a Blip

Rhines: EDA's Big Q4 Might Not be a Blip

The EDA industry is coming off its strongest quarterly showing in five years.  Read More...

Semi-Additive Process for Low Loss Buildup Material in High-Frequency Signal Transmission Substrates

Semi-Additive Process for Low Loss Buildup Material in High-Frequency Signal Transmission Substrates

A novel material promotes signal integrity at high frequencies through high plating-resin adhesion and a smooth dielectric interface.  Read More...

Is Fan-out Wafer-level Packaging Right for Your Product?

Is Fan-out Wafer-level Packaging Right for Your Product?

New CAD tools feature virtual prototyping for evaluating effects of packaging architecture on functionality, cost, weight and size.  Read More...

One Step Closer to Transparent Electronics

One Step Closer to Transparent Electronics

Transparent electronics is an emerging technology for printed circuit design.  Read More...

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PRODUCTS

NI Releases WLAN Test Toolkit 17.0

NI Releases WLAN Test Toolkit 17.0

WLAN Test Toolkit 17.0, combined with NI Vector Signal Transceiver (VST), supports Draft 1.1 of IEEE 802.11ax waveform generation and analysis for characterizat...  Read More...

MacDermid Enthone Debuts Affinity ENIG 2.0

MacDermid Enthone Debuts Affinity ENIG 2.0

Affinity ENIG 2.0 is a high-reliability, low-variation electroless nickel immersion gold plating process.  Read More...

FLIR Systems Launches ETS320 Thermal Imaging System

FLIR Systems Launches ETS320 Thermal Imaging System

FLIR ETS320 is designed for real-time benchtop viewing, testing and analyzing of thermal characteristics of electronic components and printed circuit boards.  Read More...

Polyonics Introduces Adhesive Transfer Tapes

Polyonics Introduces Adhesive Transfer Tapes

Polyonics adhesive transfer tapes include double liners for ease of handling and die cutting, provide high bond strengths, are chemical-resistant and reportedly...  Read More...

Uyemura Rolls Out Talon 3 E-Pd

Uyemura Rolls Out Talon 3 E-Pd

Talon 3 electroless palladium allows plating directly onto copper. Paves the way for electroless palladium/ immersion gold (EPIG).  Read More...

TE Connectivity Expands Deutsch 369 Series Connectors

TE Connectivity Expands Deutsch 369 Series Connectors

Deutsch 369 series connectors include two new versions enabling integration directly to printed circuit boards.  Read More...

EMA Releases PCB Clustering for OrCAD

EMA Releases PCB Clustering for OrCAD

PCB Clustering for OrCAD provides AutoClustering technology, intelligent design (IP) reuse and replication technology that can reduce board placement time.  Read More...

Eurocircuits Offers PCB Visualizer DfM, Ordering Suite

Eurocircuits Offers PCB Visualizer DfM, Ordering Suite

PCB Visualizer free online tool suite checks PCB designs for manufacturability before order.  Read More...

Grieve Releases No. 977 Electric Universal Oven

Grieve Releases No. 977 Electric Universal Oven

No. 977 is electrically-heated, 500°F universal-style oven used to preheat racks of small printed circuit boards.  Read More...

Hirose Launches DF40GL Series FPC

Hirose Launches DF40GL Series FPC

DF40GL series low-profile flexible printed circuit connector supports FPC applications in a small package and operates at USB 3.1 gen 2 speeds up to 10Gbps.  Read More...

Magus, CST Announce Antenna Magus 2017

Magus, CST Announce Antenna Magus 2017

Antenna Magus 2017 antenna design tool includes several new antennas and design updates. Includes over 300 antennas, including 13 new types. Four specialized ho...  Read More...

CST Releases Studio Suite 2017

CST Releases Studio Suite 2017

Studio Suite 2017 electromagnetic simulation tool includes a range of new tools for synthesis and analysis and improvements to existing features.  Read More...

Ventec Launches VT-5A2 Thermally Conductive Laminate/Prepreg

Ventec Launches VT-5A2 Thermally Conductive Laminate/Prepreg

VT-5A2 high Tg laminate and prepreg material has a thermal conductivity eight times that of FR-4.  Read More...

Polar Instruments Releases Atlas 17.03 SI Software

Polar Instruments Releases Atlas 17.03 SI Software

Atlas 17.03 signal integrity software has enhanced compatibility for Tektronix DSA8300 sampling units when used in SPP insetion loss testing applications.  Read More...

Mentor Graphics Debuts Xpedition Vibration and Acceleration Simulation

Mentor Graphics Debuts Xpedition Vibration and Acceleration Simulation

Xpedition vibration and acceleration simulation for printed circuit board systems reliability and failure prediction augments mechanical analysis and physical t...  Read More...

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