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NEWS

NI Doubles Profits on 5% Sales Climb

NI Doubles Profits on 5% Sales Climb

28 April 2017

AUSTIN, TX -- National Instruments announced first-quarter revenue of $300 million, up 5% year-over-year.  Read More...

Q1 Worldwide Smartphone Shipments Up 4.3%

Q1 Worldwide Smartphone Shipments Up 4.3%

28 April 2017

FRAMINGHAM, MA – Phone companies shipped a total of 347.4 million smartphones worldwide in the first quarter, according to preliminary results from IDC.  Read More...

Aspocomp Posts Q1 Net Sales Up 37%

Aspocomp Posts Q1 Net Sales Up 37%

27 April 2017

ESPOO FINLAND – Aspocomp reported first quarter net sales of EUR 5.7 million (US$ 6.2 million), up 37% year-over-year.  Read More...

IPC: US Skills, Qualifications in Short Supply

IPC: US Skills, Qualifications in Short Supply

27 April 2017

BANNOCKBURN, IL – A recent IPC study on worker skills gap indicates most US electronics assemblers are having a hard time recruiting qualified production worker...  Read More...

Rogers' PCB Materials Sales Up 7% in Q1

Rogers' PCB Materials Sales Up 7% in Q1

26 April 2017

ROGERS, CT -- Rogers today announced first quarter net sales of $203.8 million, up 27% from last year and exceeding previously company guidance of $185 million ...  Read More...

Amphenol Says Q1 Sales Up 8% YoY

Amphenol Says Q1 Sales Up 8% YoY

26 April 2017

WALLINGFORD, CT -- Amphenol today reported first quarter revenues rose 7.5% to $1.56 billion.  Read More...

DuPont Awarded Expanded Global Patents for Kapton

DuPont Awarded Expanded Global Patents for Kapton

26 April 2017

RESEARCH TRIANGLE PARK, NC – DuPont today announced that it has been granted patents in several additional countries related to its Kapton brand of black polyim...  Read More...

N. American Semi Equipment Billings Up 69% in March

N. American Semi Equipment Billings Up 69% in March

25 April 2017

MILPITAS, CA – North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March (three-month average basis), up ...  Read More...

Tech Issues Getting Bipartisan Support, ITI Says

Tech Issues Getting Bipartisan Support, ITI Says

25 April 2017

WASHINGTON – Key tech industry issues are receiving broad bipartisan support, according to the public policy trade group ITI. Successes include passage of perma...  Read More...

EMA Introduces E-Learning and OrCAD Certification

EMA Introduces E-Learning and OrCAD Certification

25 April 2017

ROCHESTER, NY – EMA Design Automation today announced the release of a new e-learning training platform to help OrCAD users improve proficiency with the toolset...  Read More...

Sanmina Posts Fiscal Q2 Revenue Up 4.3%

Sanmina Posts Fiscal Q2 Revenue Up 4.3%

24 April 2017

SAN JOSE, CA – Sanmina posted second fiscal quarter revenue of $1.68 billion, up 4.3% year-over-year and down 2.3% sequentially.  Read More...

Cadence Q1 PCB Revenue Up 18% YoY

Cadence Q1 PCB Revenue Up 18% YoY

24 April 2017

SAN JOSE, CA – Cadence Design Systems reported first quarter revenue at its System Interconnect and Analysis unit rose 18% from a year ago.  Read More...

Report: Wus Expects Big Jump in Profits

Report: Wus Expects Big Jump in Profits

24 April 2017

KUNSHAN, CHINA - Wus Printed Circuit said stronger sales would boost fiscal first-half net profits 164% to 263%, or 80 million to 110 million yuan ($11.6 millio...  Read More...

ITRI Develops Code of Conduct for Tin Mining, Smelting Ops

ITRI Develops Code of Conduct for Tin Mining, Smelting Ops

20 April 2017

HSINCHU, TAIWAN – ITRI and member companies developed an industry Code of Conduct designed for global tin mining and smelting operations, addressing the growing...  Read More...

HT Global Circuits Acquires Pho-Tronics

HT Global Circuits Acquires Pho-Tronics

20 April 2017

ST. PETERSBURG, FL – PCB manufacturer HT Global Circuits has acquired Pho-Tronics for an undisclosed sum.  Read More...

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FEATURES

Managing Rule Checks

Managing Rule Checks

Performing manufacturability checks early to reduce time to market.  Read More...

Rhines: EDA's Big Q4 Might Not be a Blip

Rhines: EDA's Big Q4 Might Not be a Blip

The EDA industry is coming off its strongest quarterly showing in five years.  Read More...

Semi-Additive Process for Low Loss Buildup Material in High-Frequency Signal Transmission Substrates

Semi-Additive Process for Low Loss Buildup Material in High-Frequency Signal Transmission Substrates

A novel material promotes signal integrity at high frequencies through high plating-resin adhesion and a smooth dielectric interface.  Read More...

Is Fan-out Wafer-level Packaging Right for Your Product?

Is Fan-out Wafer-level Packaging Right for Your Product?

New CAD tools feature virtual prototyping for evaluating effects of packaging architecture on functionality, cost, weight and size.  Read More...

One Step Closer to Transparent Electronics

One Step Closer to Transparent Electronics

Transparent electronics is an emerging technology for printed circuit design.  Read More...

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PRODUCTS

Hirose Debuts FX30B Series Board-to-Board Connector

Hirose Debuts FX30B Series Board-to-Board Connector

FX30B Series board-to-board connector combines specialized floating contact alignment with current carrying capability up to 25A.  Read More...

Atotech Debuts Neoganth E Reducer

Atotech Debuts Neoganth E Reducer

Neoganth E Reducer for horizontal applications offers enhanced process stability and safety, and reduces chemistry consumption by up to 25%, lowering operating ...  Read More...

NI Releases WLAN Test Toolkit 17.0

NI Releases WLAN Test Toolkit 17.0

WLAN Test Toolkit 17.0, combined with NI Vector Signal Transceiver (VST), supports Draft 1.1 of IEEE 802.11ax waveform generation and analysis for characterizat...  Read More...

MacDermid Enthone Debuts Affinity ENIG 2.0

MacDermid Enthone Debuts Affinity ENIG 2.0

Affinity ENIG 2.0 is a high-reliability, low-variation electroless nickel immersion gold plating process.  Read More...

FLIR Systems Launches ETS320 Thermal Imaging System

FLIR Systems Launches ETS320 Thermal Imaging System

FLIR ETS320 is designed for real-time benchtop viewing, testing and analyzing of thermal characteristics of electronic components and printed circuit boards.  Read More...

Polyonics Introduces Adhesive Transfer Tapes

Polyonics Introduces Adhesive Transfer Tapes

Polyonics adhesive transfer tapes include double liners for ease of handling and die cutting, provide high bond strengths, are chemical-resistant and reportedly...  Read More...

Uyemura Rolls Out Talon 3 E-Pd

Uyemura Rolls Out Talon 3 E-Pd

Talon 3 electroless palladium allows plating directly onto copper. Paves the way for electroless palladium/ immersion gold (EPIG).  Read More...

TE Connectivity Expands Deutsch 369 Series Connectors

TE Connectivity Expands Deutsch 369 Series Connectors

Deutsch 369 series connectors include two new versions enabling integration directly to printed circuit boards.  Read More...

EMA Releases PCB Clustering for OrCAD

EMA Releases PCB Clustering for OrCAD

PCB Clustering for OrCAD provides AutoClustering technology, intelligent design (IP) reuse and replication technology that can reduce board placement time.  Read More...

Eurocircuits Offers PCB Visualizer DfM, Ordering Suite

Eurocircuits Offers PCB Visualizer DfM, Ordering Suite

PCB Visualizer free online tool suite checks PCB designs for manufacturability before order.  Read More...

Grieve Releases No. 977 Electric Universal Oven

Grieve Releases No. 977 Electric Universal Oven

No. 977 is electrically-heated, 500°F universal-style oven used to preheat racks of small printed circuit boards.  Read More...

Hirose Launches DF40GL Series FPC

Hirose Launches DF40GL Series FPC

DF40GL series low-profile flexible printed circuit connector supports FPC applications in a small package and operates at USB 3.1 gen 2 speeds up to 10Gbps.  Read More...

Magus, CST Announce Antenna Magus 2017

Magus, CST Announce Antenna Magus 2017

Antenna Magus 2017 antenna design tool includes several new antennas and design updates. Includes over 300 antennas, including 13 new types. Four specialized ho...  Read More...

CST Releases Studio Suite 2017

CST Releases Studio Suite 2017

Studio Suite 2017 electromagnetic simulation tool includes a range of new tools for synthesis and analysis and improvements to existing features.  Read More...

Ventec Launches VT-5A2 Thermally Conductive Laminate/Prepreg

Ventec Launches VT-5A2 Thermally Conductive Laminate/Prepreg

VT-5A2 high Tg laminate and prepreg material has a thermal conductivity eight times that of FR-4.  Read More...

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