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NEWS

Camtek Posts Q4 2015 Revenues Up 25%

Camtek Posts Q4 2015 Revenues Up 25%

12 February 2016

MIGDAL HAEMEK, ISRAEL – Camtek reported fourth quarter 2015 revenues of $25.8 million, up 25% year-over-year.  Read More...

Global Personal, Entry-Level Storage shipments Down 9.2% YoY

Global Personal, Entry-Level Storage shipments Down 9.2% YoY

12 February 2016

FRAMINGHAM, MA – Worldwide personal and entry-level storage (PELS) shipments totaled 68.5 million units in 2015, down 9.2% year-over-year, according to the Inte...  Read More...

JEDEC Revises Semi Device Package Component Standard

JEDEC Revises Semi Device Package Component Standard

12 February 2016

ARLINGTON, VA – JEDEC Solid State Technology Association published a revised standard that establishes requirements for the next generation of semiconductor dev...  Read More...

Orbotech Profits Up, Sales Down in Q4

Orbotech Profits Up, Sales Down in Q4

10 February 2016

YAVNE, ISRAEL -- Orbotech today announced fourth-quarter revenues fell 4.7% year-over-year to $188.2 million.  Read More...

Zuken Announces 2016 'Innovation World' Series

Zuken Announces 2016 'Innovation World' Series

09 February 2016

WESTFORD, MA, USA – Zuken today announced the pending launch of its Zuken University and Expert Bar at its annual user conference in San Diego in April.  Read More...

TTM’s Anaheim Facility Sustains Minor Fire Damage

TTM’s Anaheim Facility Sustains Minor Fire Damage

08 February 2016

ANAHEIM – TTM Technologies experienced a fire at its facility here on Feb. 6. No injuries resulted from the fire, and minor damages were incurred, the firm says...  Read More...

Report: Flex for Autos Market to Hit $5.5B by 2026

Report: Flex for Autos Market to Hit $5.5B by 2026

08 February 2016

CAMBRIDGE, ENGLAND -- Use of printed and flexible electronics for automotive applications is expected to grow to over $5.5 billion in the next decade, spearhead...  Read More...

MFlex Reports Q4 Net Sales Down 19.5%

MFlex Reports Q4 Net Sales Down 19.5%

05 February 2016

IRVINE, CA – MFlex reported fourth quarter net sales were $169 million, down 19.5% year-over-year. The decline was mainly attributable to softness in the tablet...  Read More...

MFlex to be Acquired by Chinese Sheet Metal Firm

MFlex to be Acquired by Chinese Sheet Metal Firm

05 February 2016

SUZHOU -- Suzhou Dongshan Precision Manufacturing will acquire Multi-Fineline Electronix in an all-cash deal valued at $610 million.  Read More...

TTM Reports Q4 Net Sales Up 71%

TTM Reports Q4 Net Sales Up 71%

04 February 2016

COSTA MESA, CA – TTM Technologies reported fourth quarter net sales of $668.9 million, up 71.1% year-over-year and 2.6% sequentially.  Read More...

Global Wireless Medical Devices Expected to Grow 25% in Next 5 Years

Global Wireless Medical Devices Expected to Grow 25% in Next 5 Years

04 February 2016

STAMFORD, CT – The global market for wireless medical devices is expected to grow about 25.1% over the next five years, according to a new iRAP report.  Read More...

Cadence Posts Q4 Revenue Up 4.3% YoY

Cadence Posts Q4 Revenue Up 4.3% YoY

03 February 2016

SAN JOSE, CA – Cadence Design Systems reported fourth quarter 2015 revenue of $441 million, an increase of 4.3% year-over-year.  Read More...

Feb. 16 Webinar Addresses REACH, ECHA Updates

Feb. 16 Webinar Addresses REACH, ECHA Updates

03 February 2016

WILTSHIRE, UK – A free webinar later this month will focus on the impact of the European Chemicals Agency’s latest guidance on electronics companies and their s...  Read More...

Global Tablet Market Down 13.7% in 2015

Global Tablet Market Down 13.7% in 2015

03 February 2016

FRAMINGHAM, MA – The worldwide tablet market declined 13.7% year-over-year in the fourth quarter of 2015, with 65.9 million units shipped, says the Internationa...  Read More...

Flex Demand Aids ESI's Fiscal Q3

Flex Demand Aids ESI's Fiscal Q3

03 February 2016

PORTLAND, OR -- Electro Scientific Industries’s fiscal third-quarter revenue slipped 1% from a year ago.  Read More...

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FEATURES

IoT Makes Complex Design Problems Mass Market – Part 1

IoT Makes Complex Design Problems Mass Market – Part 1

As smart integrated technology connected to the internet becomes mainstream across the consumables industry, complex design challenges are no longer limited to ...  Read More...

InterNepcon Japan Goes into 'Auto-Drive'

InterNepcon Japan Goes into 'Auto-Drive'

InterNepcon Japan 2016 is the first electronics trade show in Japan this year.  Read More...

New Embeddable Technologies

New Embeddable Technologies

Enabled by superior materials, a host of passives have greater electrical benefits in even smaller packages.  Read More...

Empirical Confirmation of Via Temperatures

Empirical Confirmation of Via Temperatures

What determines the temperature of a via? Hint: It’s not the current.  Read More...

GHS: The Final Countdown

GHS: The Final Countdown

The deadline for implementation for the new chemical safety program is June 1. Are you ready?  Read More...

Multi-Fabric Planning for Efficient PCB Design

Multi-Fabric Planning for Efficient PCB Design

A coordinated design methodology fine-tunes chip-to-package PCB layout and routing. When routing a ball grid array style package on a printed circuit board, ha...  Read More...

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PRODUCTS

Keysight Releases ADS 2016 Simulation Suite

Keysight Releases ADS 2016 Simulation Suite

ADS 2016 software improves design productivity and speeds circuit and electromagnetic simulation performance. Features enhanced harmonic balance and circuit env...  Read More...

LPKF Launches MicroLine 5000 Laser Drill

LPKF Launches MicroLine 5000 Laser Drill

MicroLine 5000 is for laser drilling flexible printed circuit boards. UV laser-based drill has a working area of 21" x 24". Comes in two laser power c...  Read More...

D-Coax Debuts Reconfigurable Probe Station

D-Coax Debuts Reconfigurable Probe Station

Reconfigurable mini probe station model W4.0 x L6.5 is used to test a chip or small printed circuit board that can’t wait for local lab probe station availabili...  Read More...

LPKF Debuts Contac S4 Through-Hole Plating Station

LPKF Debuts Contac S4 Through-Hole Plating Station

Contac S4 enables through-hole plating on a laboratory scale, as a result of a cleaning step for microvias. Station can be equipped with up to six baths. Genera...  Read More...

LPKF Releases ProtoMat E44 PCB Plotter

LPKF Releases ProtoMat E44 PCB Plotter

ProtoMat E44 printed circuit board plotter is for mechanical milling and drilling of PCBs out of fully coated base substrates. Features increased spindle speed ...  Read More...

Ansys Releases Ansys 17.0 Simulation Software

Ansys Releases Ansys 17.0 Simulation Software

Ansys 17.0 features improvements across the entire workflow, from modeling to post processing. SpaceClaim Direct Modeler speeds time to CAE with improved perfor...  Read More...

Northfield Shows RollMaster Roll-to-Roll Material Handling System

Northfield Shows RollMaster Roll-to-Roll Material Handling System

RollMaster roll-to-roll material handling system for flex printed circuit manufacturing is for high-volume manufacturing of thin and sensitive materials. Proces...  Read More...

Cadence Rolls Out Sigrity 2016 Si/PI Analysis Tool

Cadence Rolls Out Sigrity 2016 Si/PI Analysis Tool

Sigrity 2016 includes automated support for IBIS-AMI model creation, fast and accurate channel model extraction using multiple field solvers, and an automated p...  Read More...

Ciiva Unveils Smart Parts Component Search/Analysis Tools

Ciiva Unveils Smart Parts Component Search/Analysis Tools

Smart Parts Search intelligent parts data analysis and verification technology for PCB design powers new tools for seamlessly transforming design intent into re...  Read More...

SiSoft Debuts OptimEy SerDes Equalizer

SiSoft Debuts OptimEy SerDes Equalizer

OptimEy automatically co-optimizes SerDes TX and RX equalization to maximize margin for high-speed serial channels. Replaces traditional "blind sweeps"...  Read More...

Ansys Delivers Chip-Package-System (CPS) Design Flow

Ansys Delivers Chip-Package-System (CPS) Design Flow

Chip-Package-System design flow reportedly has excellent simulation capacity and speed for power integrity, signal integrity and EMI analysis. Automated thermal...  Read More...

Taconic Introduces fastRise EZp Bondply

Taconic Introduces fastRise EZp Bondply

fastRise EZp is a low-temperature curing, low loss flexible bondply for complex rigid/flex PWBs containing polyimide, LCP or PTFE cores. Bonds well to substrate...  Read More...

Hirose Debuts FX20 Connector

Hirose Debuts FX20 Connector

FX20 Series board-to-board connector has a floating contact mechanism and self-alignment structure. Provides +/-0.6mm floating in the x and y axes. Absorbs moun...  Read More...

Kimtech Offers Pure A4 Sleeve Protector

Kimtech Offers Pure A4 Sleeve Protector

Pure A4 Sleeve Protector provides barrier protection to shield a person and garment from hazardous chemicals and biologics. Reduces risk of exposure and contami...  Read More...

Panasonic Develops Stretchable Insulating Film

Panasonic Develops Stretchable Insulating Film

Soft, flexible polymer resin film stretches and returns to its original shape. Adapts to desired manners of folding and to varying free-form surfaces, substanti...  Read More...

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