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NEWS

FWLP Market to Grow at 30% CAGR for 5 Years

FWLP Market to Grow at 30% CAGR for 5 Years

06 May 2015

LYON, FRANCE – The fan-out wafer level packaging market reached more than $150 million in 2014, and a CAGR of 30% for the next five years is expected, says Yole...  Read More...

Ansys' Q1 Sales Up, Profits Down

Ansys' Q1 Sales Up, Profits Down

06 May 2015

PITTSBURGH -- Ansys today announced first-quarter revenue rose 1.2% year-over-year to $217.8 million.  Read More...

NI Unveils 5G Research Lab

NI Unveils 5G Research Lab

06 May 2015

AUSTIN, TX -- NI today announced the opening of a corporate lab here to support research into next-generation wireless systems and 5G systems.  Read More...

Molex Acquires Printed Electronics Provider

Molex Acquires Printed Electronics Provider

05 May 2015

LISLE, IL -- Molex today announced the acquisition of certain assets of Soligie, a provider of printed and flexible electronics for various end-markets.  Read More...

Semi Sales Rise in March Quarter

Semi Sales Rise in March Quarter

04 May 2015

WASHINGTON — Worldwide sales of semiconductors reached $83.1 billion during the first quarter, up 6% year-over-year.  Read More...

'Smart Home' Forecast Has Warm Glow

'Smart Home' Forecast Has Warm Glow

04 May 2015

LONDON -- Global revenues from smart home automation systems will grow at a 21% CAGR between 2015 and 2020, according to ABI Research.  Read More...

Tablet Demand Continues to Slide

Tablet Demand Continues to Slide

01 May 2015

FRAMINGHAM, MA – Worldwide tablet shipments in March recorded a year-over-year decline for the second consecutive quarter as overall shipments fell to 47.1 mill...  Read More...

NCAB Plans US Expansion

NCAB Plans US Expansion

01 May 2015

HAMPSTEAD, NH ― NCAB Group plans to open additional divisions in key regions throughout North America this year, the company said today.  Read More...

Uyemura Names 5 to New Positions

Uyemura Names 5 to New Positions

30 April 2015

SOUTHINGTON, CT – Uyemura has announced five new appointments. John Meyers, an expert on electroless copper technology, has been named product manager for Elect...  Read More...

Flextronics Reports Fiscal Q4 Net Sales Down 11.5%

Flextronics Reports Fiscal Q4 Net Sales Down 11.5%

30 April 2015

SAN JOSE, CA – Flextronics reported fiscal fourth quarter net sales ended Mar. 31 of $5.95 billion, down 11.5% year-over-year, slightly below guidance of $6 bil...  Read More...

Rogers' PCB Material Sales Grow Again in Q1

Rogers' PCB Material Sales Grow Again in Q1

30 April 2015

ROGERS, CT -- Rogers Corp. said its Printed Circuit Materials division had first quarter net sales of $71.3 million, up 21.8% over last year mainly due to the a...  Read More...

PCB Sales a Drag on Orbotech's

PCB Sales a Drag on Orbotech's

30 April 2015

YAVNE, ISRAEL -- Orbotech today reported sales from PCB inspection equipment fell 25% to $31.3 million for the period ended Mar. 31.  Read More...

Apple Watch Teardown Reveals Surprises

Apple Watch Teardown Reveals Surprises

30 April 2015

AUSTIN, TX -- Apple leveraged its smartphone design for its new watch, but added certain aspects not seen in the iPhone, a new teardown reveals.  Read More...

TTM Q1 Net Sales Up Nearly 13%

TTM Q1 Net Sales Up Nearly 13%

30 April 2015

COSTA MESA, CA – TTM Technologies reported first quarter net sales of $329.2 million, up 12.8% year-over-year and down 15.8% sequentially.  Read More...

March N. American PCB Orders Up 1.6% YoY

March N. American PCB Orders Up 1.6% YoY

29 April 2015

BANNOCKBURN, IL – Total North American printed circuit board shipments decreased 0.9% in March compared to the same month in 2014. Year-to-date shipments are do...  Read More...

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FEATURES

EMS in Overdrive

EMS in Overdrive

Automotive and Apple were the two major growth factors in 2014.  Read More...

PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks

PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks

Cracking increased twofold when air cooling was used instead of water laminate cooling.  Read More...

Practical Progresses from Advanced Materials

Practical Progresses from Advanced Materials

Fine Tech Japan, a popular trade show for advanced materials, was held at Tokyo Big Sight a couple weeks ago.  Read More...

Multi-Fabric Planning for Efficient PCB Design

Multi-Fabric Planning for Efficient PCB Design

A coordinated design methodology fine-tunes chip-to-package PCB layout and routing. When routing a ball grid array style package on a printed circuit board, ha...  Read More...

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PRODUCTS

Altium Releases Designer 15.1 PCB Design Tool

Altium Releases Designer 15.1 PCB Design Tool

Altium Designer 15.1 includes features to improve design efficiency with expansions to productivity, documentation, and high-speed design. High-speed design con...  Read More...

Kozio Releases VTOS Scan Automated Hardware Interface Test Tool

Kozio Releases VTOS Scan Automated Hardware Interface Test Tool

Kozio VTOS Scan tool automates the process of creating new configurations, enabling verification of new board designs, new product introductions, and full volum...  Read More...

NI Rolls Out Multisim 14

NI Rolls Out Multisim 14

Multisim 14 SPICE simulation environment features an enhanced user experience, quicker access to simulation results, and improved interactive simulation. Includ...  Read More...

Cadence Upgrades OrCAD PCB CAD

Cadence Upgrades OrCAD PCB CAD

OrCAD PCB CAD software now includes five new products and three key features aimed at increasing productivity by reducing design cycle time and facilitating mor...  Read More...

Mentor Announces New Pads Suite

Mentor Announces New Pads Suite

Pads suite comes in three configurations with features ranging from schematic capture to advanced hierarchical placement planning and analysis. Pads Standard ...  Read More...

Nan-o Dimension Releases Dragonfly 2020 3D Printer

Nan-o Dimension Releases Dragonfly 2020 3D Printer

Dragonfly 2020 3D inkjet deposition printer is for printed circuit boards. Is said to print multilayer circuits with 10 or more layers in a few hours. Prints bl...  Read More...

D-Coax Offers TDR – VNA Probe Assemblies

D-Coax Offers TDR – VNA Probe Assemblies

TDR – VNA probe assemblies through 44GHz are in two configurations. Testing for small discontinuities on non-planar printed circuit boards is possible on a 40GH...  Read More...

XJTAG Updates XJTAG Software

XJTAG Updates XJTAG Software

Updated XJTAG software reportedly increases flexibility for easier access to JTAG capabilities of boards and maximum test coverage. Dynamic chain profiling help...  Read More...

Lackwerke Peters Debuts Elpemer SD 2491 SG-TSW-R6-B

Lackwerke Peters Debuts Elpemer SD 2491 SG-TSW-R6-B

White solder resist Elpemer SD 2491 SG-TSW-R6-B has excellent yellowing resistance after Pb-free reflow soldering and high thermal loads. Has thermal cycling te...  Read More...

Zuken, Intel Offer PCB Reference Design Availability for Intel IoT Devices

Zuken, Intel Offer PCB Reference Design Availability for Intel IoT Devices

Board reference designs for Intel-produced Internet of Things (IoT) devices prepared in CR-8000 Design Force are now available. Delivery starts with Intel Atom ...  Read More...

Keysight Technologies Debuts N7660B Signal Studio

Keysight Technologies Debuts N7660B Signal Studio

N7660B Signal Studio software is for multi-emitter scenario generation. Provides multi-emitter signals downloadable to one or more Keysight N5193A UXG agile sig...  Read More...

DfR Solutions Updates Sherlock 4.0 Software

DfR Solutions Updates Sherlock 4.0 Software

Sherlock Automated Design Analysis software v. 4.0 models complex printed circuit boards and components. Features include FEA integration tools, lead modeling ...  Read More...

L&M Debuts S3 Flying Probe Tester

L&M Debuts S3 Flying Probe Tester

S3 10µm Substrate Tester has four freely movable test heads and a test rate of 100 measurements per sec. for high-speed open and short tests. Optically aligns t...  Read More...

Mentor Announces Xpedition Package Integrator Flow

Mentor Announces Xpedition Package Integrator Flow

Xpedition Package Integrator flow performs integrated circuit, package, and printed circuit board co-design and optimization.  Read More...

Bruker Introduces M2 Blizzard XRF Spectrometer

Bruker Introduces M2 Blizzard XRF Spectrometer

M2 Blizzard is a small-spot X-ray fluorescence (XRF) spectrometer designed for nondestructive analysis of printed circuit boards, in accordance with ASTM B568 a...  Read More...

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