NEWS

Polyimide Film Market to Grow More than 10% CAGR through 2023

Polyimide Film Market to Grow More than 10% CAGR through 2023

25 May 2018

NEW YORK, NY – The global polyimide film market was $1.73 billion in 2017 and is set to reach $3.12 billion by the end of 2023.  Read More...

N. American Semi Equipment Billings Up 26% in April

N. American Semi Equipment Billings Up 26% in April

24 May 2018

MILPITAS, CA – North America-based manufacturers of semiconductor equipment posted $2.69 billion in billings worldwide in April (three-month average basis), acc...  Read More...

Germany Region PCB Manufacturer Sales Up 7% in March

Germany Region PCB Manufacturer Sales Up 7% in March

23 May 2018

FRANKFURT, GERMANY – Despite a sharp decline in incoming orders in March, order backlogs of printed circuit board manufacturers in the Germany region were well ...  Read More...

US Annual Sales of AVs to Reach 5M by 2026

US Annual Sales of AVs to Reach 5M by 2026

23 May 2018

HAMPSHIRE, UK – The annual sales of fully autonomous vehicles (AVs) in the US will reach 5 million by 2026, says Juniper Research. The global market will accoun...  Read More...

IPC Releases Additional Test Coupons for IPC-2221B Gerber Coupon Generator

IPC Releases Additional Test Coupons for IPC-2221B Gerber Coupon Generator

23 May 2018

BANNOCKBURN, IL – IPC released additional test coupons for the IPC-2221B Gerber Coupon Generator, an annual subscription service for IPC member companies.  Read More...

IC Insights Nearly Doubles 2018 Semi Capex Growth Forecast

IC Insights Nearly Doubles 2018 Semi Capex Growth Forecast

22 May 2018

SCOTTSDALE, AZ – IC Insights has raised its expectations for 2018 capital spending by six percentage points to a 14% increase. If this occurs, it would be the f...  Read More...

Nordson Posts Fiscal Q2 Net Sales Up 12%

Nordson Posts Fiscal Q2 Net Sales Up 12%

22 May 2018

WESTLAKE, OH – Nordson reported fiscal second quarter net sales of $553.7 million, up 11.6% year-over-year.  Read More...

In Wake of PCB Factory Fire, Taiwan Reviewing New Chemical Regs

In Wake of PCB Factory Fire, Taiwan Reviewing New Chemical Regs

21 May 2018

TAIPEI – Taiwanese legislators are reviewing amendments to the national Toxic Chemical Substances Control Act following a deadly fire at a domestic printed circ...  Read More...

Substrates Workshop to be Held at NPL

Substrates Workshop to be Held at NPL

21 May 2018

TEDDINGTON, UK – IMAPS-UK will hold a workshop on substrates for more demanding applications at the National Physical Laboratory on June 27.  Read More...

Taimide Expansion to Come Online by Year-End

Taimide Expansion to Come Online by Year-End

18 May 2018

TUNGLUO, TAIWAN -- Polyimide film supplier Taimide has begun phase two of its factory expansion here.  Read More...

Nano Dimension Reports Record Q1 Revenues

Nano Dimension Reports Record Q1 Revenues

17 May 2018

NESS ZIONA, ISRAEL – Nano Dimension today reported first quarter revenues of $635,000, compared to $118,000 in 2017.  Read More...

IPC to Hold Annual Lobbying Days Next Week

IPC to Hold Annual Lobbying Days Next Week

17 May 2018

BANNOCKBURN, IL – IPC announced its annual US lobbying event, IMPACT Washington D.C., will take place May 21-23.  Read More...

AT&S Reports Fiscal H1 Revenues up 22%

AT&S Reports Fiscal H1 Revenues up 22%

15 May 2018

VIENNA, AUSTRIA -- AT S reported first-half revenues grew 21.7% to €991.8 million ($1.18 billion) on higher demand in for automobiles and medical devices.  Read More...

Smart Home Automation Revenues to Exceed $45B by 2023

Smart Home Automation Revenues to Exceed $45B by 2023

15 May 2018

HAMPSHIRE, UK -- Increasing smart security adoption will drive home automation and monitoring revenues from an estimated $12 billion in 2018 to over $45 billion...  Read More...

Ucamco Updates Gerber Spec

Ucamco Updates Gerber Spec

14 May 2018

GENT, BELGIUM -- Ucamco has released revision 2018.05 of the Gerber format specification.  Read More...

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FEATURES

How Rigid-Flex PCB Design Configurations are Advancing

How Rigid-Flex PCB Design Configurations are Advancing

Odd-layer-count boards are not only manufacturable, but at times preferable.  Read More...

More on Via Temperatures

More on Via Temperatures

Can vias carry considerably more current than was previously known?  Read More...

Can Next-Gen Military Products Beat the Heat?

Can Next-Gen Military Products Beat the Heat?

Thermal management is becoming a common limiting factor in newer technologies. Ed.: This is the fifth of an occasional series by the authors of the 2017 iNEMI ...  Read More...

Using ECAD-MCAD Linkages to Enhance Avionics Thermal Design

Using ECAD-MCAD Linkages to Enhance Avionics Thermal Design

New tool features keep the thermal design concurrent with the PCB design.  Read More...

Voltage in the GHz World

Voltage in the GHz World

Understand what is happening to the energy moving around in a circuit board.  Read More...

Growing System Complexity Prompts Need for Engineering Models

Growing System Complexity Prompts Need for Engineering Models

Advancement in model-based system engineering was one of many highlights at the Zuken Innovation World conference in San Diego.  Read More...

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PRODUCTS

Taconic Shows FastRise EZpure Low-Temp Curing Adhesive

Taconic Shows FastRise EZpure Low-Temp Curing Adhesive

fastRise EZpure low-temperature curing adhesive is for rigid and flex PWBs.  Read More...

Fujiploy Debuts Sarcon 30XR-m TIM

Fujiploy Debuts Sarcon 30XR-m TIM

Sarcon 30XR-m is a high-performance thermal interface material that exhibits low thermal resistance.  Read More...

Taiyo Releases A307DC Visual Inspection System

Taiyo Releases A307DC Visual Inspection System

A307DC visual inspection system offers fully automated defect detection.  Read More...

FKN Systek Rolls Out K4000 M24 Metal Core Depanelizer

FKN Systek Rolls Out K4000 M24 Metal Core Depanelizer

K4000 M24 double circular blade depanelizer singulates pre-scored metal core panels.  Read More...

Grieve Debuts NO. 813 Walk-In Oven

Grieve Debuts NO. 813 Walk-In Oven

No. 813 is a gas-heated 500°F(~260°C) walk-in oven, currently used for curing printed circuit boards.  Read More...

NI Releases LabVIEW 2018

NI Releases LabVIEW 2018

LabVIEW 2018 software is for test workflows. Includes new tools that reportedly simplify system integration and grant more control through hardware accessibilit...  Read More...

Ansys Releases Ansys 19.1 Simulation and Analysis Suite

Ansys Releases Ansys 19.1 Simulation and Analysis Suite

Ansys 19.1 delivers new analysis capabilities in the electromagnetics suite for designing wireless communication, autonomous and electrification technologies.  Read More...

Atotech Launches Stanna-COF Chip-on-Film Immersion Tin Final Finish

Atotech Launches Stanna-COF Chip-on-Film Immersion Tin Final Finish

Stanna-COF immersion tin enables chip-on-film (CoF) technology.  Read More...

Atotech Debuts Cupracid Flex and InPro Flex Conformal Plating Solution

Atotech Debuts Cupracid Flex and InPro Flex Conformal Plating Solution

Cupracid Flex and InPro Flex are designed for standard conformal flex applications.  Read More...

Ventec Launches tec-speed 20.0 High-Frequency Laminate and Prepreg

Ventec Launches tec-speed 20.0 High-Frequency Laminate and Prepreg

tec-speed 20.0 high-frequency laminate and prepreg series is a ceramic-filled hydrocarbon thermoset material for such printed circuit board applications as cell...  Read More...

Circuit Foil Luxembourg Upgrades TWLS, TZA ED CU Foils

Circuit Foil Luxembourg Upgrades TWLS, TZA ED CU Foils

TWLS and TZA electrodeposited copper foils are now arsenic-free. All traces of arsenic have been removed from the treatment process.  Read More...

XJTAG Offers DFT Assistant Plugin for Mentor Xpedition

XJTAG Offers DFT Assistant Plugin for Mentor Xpedition

XJTAG DFT Assistant free software interface for Mentor Xpedition Designer increases design for test and debug capabilities of the schematic capture and PCB desi...  Read More...

Atotech Debuts BondFilm HF Oxide Replacement Chemistry

Atotech Debuts BondFilm HF Oxide Replacement Chemistry

BondFilm HF is for treatment of innerlayer cores.  Read More...

Konekt Releases Electra v7.20 Autorouter Software

Konekt Releases Electra v7.20 Autorouter Software

Electra v. 7.20 shape-based autorouter has improved completion rate and quality for high-density designs.  Read More...

AVX Releases 9176-800 Series Connectors

AVX Releases 9176-800 Series Connectors

9176-800 series low-profile insulation displacement connectors reduce Z-axis height of 9176-400 series 1mm; reduce volume of standard 00-9176 series IDCs more t...  Read More...

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