UP Media Group Issues Call for Papers for PCB West 2010 Print E-mail
Written by Chelsey Drysdale   
Tuesday, 12 January 2010 23:15

SMYRNA, GAUP Media Group Inc. seeks abstracts for PCB West 2010, to be held Sept. 28-30 in Santa Clara, CA.

The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara Convention Center.

PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI and other advanced circuits.
 
Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations; two-hour workshops, and half-day (3.5 hour) seminars.
 
Suggested paper and presentation topics include RF and microwave design; high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes (especially how they affect design and fabrication); environmental legislation (REACH, RoHS, etc.) and its effects; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; surface finishes; industry forecasts, and business and supply chain issues.
 
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Abstracts of 300 words or less should be submitted to conference co-chairs Pete Waddell ( This e-mail address is being protected from spambots. You need JavaScript enabled to view it ) or Mike Buetow ( This e-mail address is being protected from spambots. You need JavaScript enabled to view it ) by May 1. If selected, final papers and presentations will be due July 9, 2010.
 
Printed Circuit Design & Fab and Circuits Assembly magazines are media partners for the event.

For more information about PCB West, visit pcbwest.com or contact Show Manager Alyson Skarbek at This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

 


blog comments powered by Disqus
Last Updated on Wednesday, 13 January 2010 15:08
 

Products

Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....

Current Issue

June 2010 cover

Parts


Find and quote components




Powered by


Terms Of Use

Printed Circuit Design & Fab Magazine on Facebook