IPC Undergoes IPC Tech Roadmap Study until Jan. 31 Print E-mail
Written by Chelsey Drysdale   
Tuesday, 14 January 2014 22:04

BANNOCKBURN, ILIPC released a global survey this month to collect data for the IPC International Technology Roadmap for Electronic Interconnections, and for IPC’s 2014 Technology Trends Study.

Participation is open to all manufacturers of printed circuit boards and board assemblies worldwide.

The deadline for survey responses is Jan. 31.

The survey covers technical issues in both fabrication and assembly of PCBs, including topics such as clock speed, heat dissipation, layer counts, embedding, aspect ratios, I/O pitch and component size.

Survey participants will receive the 2014 Technology Trends Study at no charge before it is available for sale. The first 100 people to submit a valid, usable survey will receive a free copy of the 2015 IPC Technology Roadmap.

The study and Roadmap are published every two years.

To contribute to the survey, contact Piyamart Holmgren at This e-mail address is being protected from spambots. You need JavaScript enabled to view it or 847-597-2868 for the access and company codes.






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