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Written by Mike Buetow   
Friday, 31 January 2014 18:21

Counterfeit Detection

“A Comprehensive Framework for Counterfeit Defect Coverage Analysis and Detection Assessment”

Authors: Ujjwal Guin, Daniel DiMase and Mohammad Tehranipoor; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Abstract: Over the past few years, standards and programs have been put in place throughout the supply chain that outline testing, documenting, and reporting procedures. However, there is little uniformity in the test results among the various entities. Currently, there are no metrics for evaluating these counterfeit detection methods. In this paper, we have developed a detailed taxonomy of defects present in counterfeit components. Based on this taxonomy, a comprehensive framework has been developed to find an optimum set of detection methods considering test time, test cost, and application risks. We have also performed an assessment of all the detection methods based on the newly introduced metrics: counterfeit defect coverage, under-covered defects, and not-covered defects. (Journal of Electronic Testing, January 2014)

PCB Design Guidelines

“Front-End Data Preparation”

Author: Eurocircuits
Abstract: What do PCB fabricators do with the designer’s data before they make the PCBs? This white paper explains the front-end engineering process used at a typical fabrication site. (Company white paper; www.eurocircuits.com/images/easyblog_images/68/eurocircuits-frontend%20data%20preparation%20white%20paper.pdf)

PCB Substrates

“Wafer-Scale Design of Lightweight and Transparent Electronics That Wraps Around Hairs”

Authors: Dr. Giovanni A. Salvatore, Niko Münzenrieder, et al; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Abstract: Electronics on very thin substrates have shown remarkable bendability, conformability and lightness, which are important attributes for biological tissues sensing, wearable or implantable devices. Here we propose a wafer-scale process scheme to realize ultra flexible, lightweight and transparent electronics on top of a 1µm thick parylene film that is released from the carrier substrate after the dissolution in water of a polyvinyl-alcohol layer. The thin substrate ensures extreme flexibility, which is demonstrated by transistors that continue to work when wrapped around human hairs. In parallel, the use of amorphous oxide semiconductor and high-K dielectric enables the realization of analog amplifiers operating at 12V and above 1MHz. Electronics can be transferred on any object, surface and on biological tissues like human skin and plant leaves. We foresee a potential application as smart contact lenses, covered with light, transparent and flexible devices, which could serve to monitor intraocular pressure for glaucoma disease. (Nature Communications, January 2014)

Solder Materials

“Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate”

Authors: M. Nahavandi, et al; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Abstract: This study investigates the viability of lead-free Bi-Ag and Bi-Sb solder alloys, ranging in composition from 1.5 to 5 wt.% Ag and Sb. The effects of melting point, wetting angle, microstructure and morphology were analyzed by differential scanning calorimetry, optical microscopy, and scanning electron microscope-energy dispersive x-ray analysis. The results showed that all tested alloys had suitable melting temperatures, ranging from 271° to 276°C. The wetting angle increased by raising the Sb content, but, in contrast, by increasing the wt.% of Ag, the wetting angle decreased. A Cu-rich phase was present in all Bi-Ag alloys. The Cu-rich phase was also present in decreasing amounts with increasing Sb, but, with 5Sb, there was no Cu-rich phase, and a Cu3Sb intermetallic compound was present in the interface and as precipitates in the solder. Grooving along Cu grain boundaries was observed at the interface for the rest of the alloys. (Journal of Electronic Materials, February 2014)

Standards

“Facts About OSHA’s New Hazard Communication Standards and GHS”

Authors: Lindsey Shehan and Kevin Pawlowski; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .  
Abstract: The Global Harmonized System (GHS) is being implemented to aid in the communication of hazards and risks. Previously, every country had different requirements, causing confusion and increasing risk of serious accidents. Since 2005, the GHS has been updated every two years. GHS established a standard system for classifying and labeling chemicals with the intent to have it fully implemented by 2008. It also impacts the content and organization of Material Safety Data Sheets (MSDS), which will be called Safety Data Sheets (SDS) moving forward. This paper explains how GHS impacts the US, Mexico and Canada. (Company white paper, January 2014)

This column provides abstracts from recent industry conferences and company white papers. Our goal is to provide an added opportunity for readers to keep abreast of technology and business trends.

Last Updated on Friday, 31 January 2014 19:19
 

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