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Design News
- Altium Adds Atmel's Parts to Online Library
- DownStream Celebrates 10 Years with Record Sales in 2011
- IPC-2581 Consortium Taking Message on Road
- DoD Suspends Broker over Counterfeit Parts
- Murata, Beta Layout Team on RFID Starter Kit
- Altium Offering Models for FTDI's Board-Level ICs
- AWR Issued US Patent for Via Creation Design Method
- Cadence Rebounds in Big Q4
- Zarrow to Host Next UPMG 'PCB Chat'
- ACD Sets Annual Sales Record
Market News
- Engineers Say Career Worth ‘Books’
- TI CEO Sees Big Chip Spike Ahead
- Nokia Announces 4,000 More Job Cuts
- Cellphone Sales Up, But Growth Slowing
- Smartphone Unit Sales Set Annual Record
- iSuppli: EMS in for Flat Year
- Despite Sluggish Growth, Semi Sales Set Annual Record
- WTO Upholds Ruling Against China Over Raw Material Exports
- iSuppli: Sluggish Semi Sales in Store
- US Manufacturing Picture Continues to Improve
Fab News
- GCT’s Sales, Profits Sky in 2011
- Rogers' Sales, Profits Going Different Directions
- DDi’s Q4 Net Income Up 52% YoY
- Viasystems Delivers Record Earnings in Q4
- Panasonic Finishes Taoyuan ALIVH Factory
- Foxconn's Jan. Sales Up YoY
- CCI Eurolam Expands Sales Team in Germany
- Q4 AOI Sales Spur Orbotech Growth
- China Issues New PCB Industry Environmental Guidelines
- VCF Films Expands Manufacturing Capabilities
Products
Konica Minolta Develops KM128SNG-MB Inkjet Printhead
KM128SNG-MB inkjet printhead has a small printhead structure (38 mm wide, 128 nozzles in one row) that can deliver a 1 pl size drop for printed electronics applications. Provides ink resistance and optimization for low viscosity. Offers...
KM128SNG-MB inkjet printhead has a small printhead structure (38 mm wide, 128 nozzles in one row) that can deliver a 1 pl size drop for printed electronics applications. Provides ink resistance and optimization for low viscosity. Offers...
Features
Specifying QFN Stencils and Solder Layers
When it comes to paste coverage, less is more. I write a lot about things that go wrong with various layouts. Hopefully by doing that, I can help some readers avoid common pitfalls. But I should probably write about more good things to balance them out.Here’s a decent example. Figure 1 shows a good way to specify the solder paste layer for QFN parts. Notice that the center thermal area is segmented to give about 50% paste coverage. This...
When it comes to paste coverage, less is more. I write a lot about things that go wrong with various layouts. Hopefully by doing that, I can help some readers avoid common pitfalls. But I should probably write about more good things to balance them out.Here’s a decent example. Figure 1 shows a good way to specify the solder paste layer for QFN parts. Notice that the center thermal area is segmented to give about 50% paste coverage. This...
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- Copperless Flex Circuits
- Signal Integrity and PCB Physical Parameters
- In Case You Missed It
- No Counterfeits, No Excuses
- Invest or Cut Back?
- Why Quick is Not Always Better
- Benchmarking and Qualifying PCB Fabricators for Semiconductor Device Test Boards
- ‘An End-to-End Solution for Assembled HDI Rigid-Flex’
- In Case You Missed It
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